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1. 发明授权

US6124023A Prepreg for laminate and process for producing printed wiring-board using the same 失效
标题翻译：用于制造印刷电路板的层压板用预浸料及其制造方法
公开(公告)号：US6124023A
公开(公告)日：2000-09-26
申请号：US978599
申请日：1997-11-26
申请人： Kiyonori Furuta , Tadahiko Yokota
发明人： Kiyonori Furuta , Tadahiko Yokota
IPC分类号： B29C70/06 , B29K63/00 , B29K105/08 , B29L9/00 , B32B5/28 , B32B27/38 , C08G59/50 , C08J5/24 , C08K7/02 , C08L63/00 , H05K1/03 , H05K3/38 , H05K3/46 , B32B3/00
CPC分类号： C08J5/24 , C08L63/00 , H05K3/381 , C08J2363/00 , Y10T428/24612 , Y10T428/2481 , Y10T428/24851
摘要： The problems are to provide a prepreg for laminate which can secure a heat resistance, electrical insulation properties and an adhesion strength of a conductor layer, a printed wiring-board which satisfies a high density and which is excellent in a heat resistance and electrical insulation properties upon utilizing the conventional production equipment and method of laminate pressing, and a process for producing the same.A prepreg for laminate characterized in that a paper-like or fabric-like substrate is impregnated with an epoxy resin composition capable of forming a roughened surface through roughening treatment, and a laminate obtained by using the same; a printed wiring-board obtained by using the printed wiring-board and a process for producing the same, which comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate; and a multi-layer printed wiring-board and a process for producing the same, which comprises (1) a step of laminating the prepreg for laminate with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.
摘要翻译：问题在于提供一种能够确保导体层的耐热性，电气绝缘性和粘合强度的层叠体的预浸料，满足高密度且耐热性和电绝缘性优异的印刷线路板在利用传统的生产设备和层叠压制方法及其制造方法。一种用于层压体的预浸料，其特征在于，通过粗糙化处理将能够形成粗糙化表面的环氧树脂组合物浸渍在纸状或织物状基材中，以及使用它们的层压体。通过使用印刷线路板获得的印刷线路板及其制造方法，其包括（1）通过对层压体的表面进行粗糙化处理来形成粗糙化表面的步骤，以及（2）在层压体的粗糙化表面上形成导体层的步骤; 和多层印刷线路板及其制造方法，其包括：（1）将层压材料的预浸料与内层材料层合以使得预浸料坯设置在表面上的步骤，并将其压制形成层叠体，（2）使层叠体的表面进行粗糙化处理以形成粗糙面的工序，（3）在层叠体的粗糙化面上形成导体层的工序。

2. 发明授权

US08992713B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08992713B2
公开(公告)日：2015-03-31
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10 , H05K3/46 , B32B37/00 , B32B38/00
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

3. 发明授权

US08357443B2 Laminate including water soluble release layer for producing circuit board and method of producing circuit board 有权
标题翻译：包括用于生产电路板的水溶性释放层和生产电路板的方法的层压板
公开(公告)号：US08357443B2
公开(公告)日：2013-01-22
申请号：US12551802
申请日：2009-09-01
申请人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa Narahashi , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B9/00 , B32B33/00 , B32B17/10 , B32B27/08 , G11B11/105 , G11B5/64 , C09J7/02 , H05K1/00 , H05K1/03 , B29C53/82
CPC分类号： H05K3/025 , B32B37/025 , B32B38/10 , B32B2038/0076 , B32B2311/00 , B32B2457/08 , H05K3/386 , H05K2201/0358 , H05K2203/0264 , H05K2203/0769 , H05K2203/0786 , Y10T428/14 , Y10T428/1438 , Y10T428/1443 , Y10T428/1476 , Y10T428/26 , Y10T428/263 , Y10T428/264 , Y10T428/265 , Y10T428/266 , Y10T428/269
摘要： Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity.
摘要翻译：通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性。

4. 发明申请

US20100230382A1 METAL-CLAD LAMINATE 有权
标题翻译：金属层压板
公开(公告)号：US20100230382A1
公开(公告)日：2010-09-16
申请号：US12723165
申请日：2010-03-12
申请人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
发明人： Hirohisa NARAHASHI , Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B44C1/22 , B32B38/10 , C23C14/34 , B32B38/04
CPC分类号： H05K3/381 , H05K3/025 , H05K2203/072 , H05K2203/0786 , H05K2203/1152 , Y10T29/49155
摘要： Metal-clad laminates in which a conductor layer having superior peel strength is formed on a smooth surface of an insulating layer can be obtained by a method comprising (A) a step of preparing a metal-clad laminate precursor by providing one or more sheets of prepreg between two sheets of film having a metal film layer on a support layer, and heating and pressing them under reduced pressure, (B) a step of removing the support layer, (C) a step of removing the metal film layer, and (D) a step of forming a metal film layer on the surface of an insulating layer by electroless plating.
摘要翻译：在绝缘层的光滑表面上形成具有优良剥离强度的导体层的覆金属层压体可以通过以下方法获得：（A）通过提供一层或多层片材来制备覆金属层压板前体的步骤在支撑层上具有金属膜层的两片薄膜之间的预浸料坯，并且在减压下加热和加压它们;（B）去除支撑层的步骤，（C）去除金属膜层的步骤和（ D）通过化学镀在绝缘层的表面上形成金属膜层的步骤。

5. 发明授权

US06739040B1 Method of manufacturing multilayered printed wiring board using adhesive film 有权
标题翻译：使用粘合膜制造多层印刷线路板的方法
公开(公告)号：US06739040B1
公开(公告)日：2004-05-25
申请号：US09696179
申请日：2000-10-26
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： H05K636
CPC分类号： H05K3/4069 , H05K3/0035 , H05K3/0094 , H05K3/246 , H05K3/381 , H05K3/426 , H05K3/4661 , H05K2201/0347 , H05K2201/09509 , H05K2201/0959 , H05K2203/0191 , H05K2203/066 , H05K2203/068 , H05K2203/085 , H05K2203/1383 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： The present invention relates to a method of manufacturing a multilayered printed wiring board by a buildup system in which a conductive circuit layer and an insulating layer are alternately piled up. This method also involves using an adhesive film to facilitate manufacturing the multilayered printed wiring board having excellent surface smoothness at satisfactory yields.
摘要翻译：本发明涉及一种通过积层系统制造多层印刷线路板的方法，其中导电电路层和绝缘层交替堆叠。该方法还涉及使用粘合膜以便于以令人满意的产率制造具有优异表面平滑度的多层印刷线路板。

6. 发明授权

US08337655B2 Process for producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US08337655B2
公开(公告)日：2012-12-25
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

7. 发明授权

US07208062B2 Method of producing multilayer printed wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US07208062B2
公开(公告)日：2007-04-24
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C09J163/00 , B32B37/14
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： Adhesive films which are useful for preparing laminated circuit boards may be produced by laminating a resin composition layer made of a layer A and layer B on a support base film, in which layer A is a layer of a thermosetting resin composition that has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface which after roughening, allows forming a conductor layer by plating, and is solid at ambient temperature, layer B is a layer of a thermosetting resin composition that has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature, layer A is laminated adjacent to the support base film, and layer B layer has a fluidity that allows the filling of a resin into a through hole and/or a via hole.
摘要翻译：可用于制备层压电路板的粘合膜可以通过将由A层和B层制成的树脂组合物层压在支撑基底膜上来制备，其中层A是具有无机填料的热固性树脂组合物层含量为0〜40重量％以下，具有经粗糙化后的固化表面，可以通过电镀形成导体层，在环境温度下为固体，B层为具有无机填料的热固性树脂组合物层含量为40重量％以上，并且在环境温度下为固体，层A邻近支撑基膜层压，并且层B层具有允许将树脂填充到通孔和/或通孔中的流动性孔。

8. 发明授权

US07037586B2 Film for circuit board 失效
标题翻译：电路板胶片
公开(公告)号：US07037586B2
公开(公告)日：2006-05-02
申请号：US10754618
申请日：2004-01-12
申请人： Tadahiko Yokota , Shigeo Nakamura
发明人： Tadahiko Yokota , Shigeo Nakamura
IPC分类号： B32B15/00 , B32B27/38 , C08L63/00
CPC分类号： H05K3/387 , B32B15/08 , B32B27/08 , H05K1/036 , H05K3/181 , H05K3/381 , H05K2201/0141 , H05K2201/0154 , H05K2201/0394 , H05K2203/0264 , Y10S428/901 , Y10T428/24917 , Y10T428/2495 , Y10T428/265 , Y10T428/2804 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film.A layer: a heat-resistant resin layer with a thickness of from 2 to 250 μm which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, andB layer: a roughenable cured resin layer with a thickness of from 5 to 20 μm which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.
摘要翻译：本发明涉及一种用于电路板的薄膜，其特征在于在本申请中公开了以下A层与以下B层相邻。通过使用该膜，可以容易地制造出导体层的粘合强度优异的电路板。层：厚度为2〜250μm的耐热树脂层，该层由玻璃化转变点为200℃以上或分解温度为300℃的耐热性树脂构成，或更多和B层：厚度为5〜20μm的可粗化固化树脂层，该层由至少含有至少两种以上环氧基的环氧树脂组分（a）的热固性树脂组合物的固化产物形成，在环氧固化剂的分子和组分（b）中，固化产物能够用氧化剂粗化。

9. 发明申请

US20050005437A1 Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board 有权
公开(公告)号：US20050005437A1
公开(公告)日：2005-01-13
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B7/12 , B32B15/02 , H05K3/38 , H05K3/46 , B44C1/00 , H05K3/02
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： The present invention provides a laminating method, when a multilayer printed wiring board is produced according to a build-up technique, for easily introducing an insulating layer that, under the lamination conditions, allows filling a resin inside a through hole and/or a via hole simultaneously with laminating a circuit board, is low in the thermal expansion coefficient of a formed insulating layer, and, after roughening a surface of the insulating layer, is excellent in the adhesiveness with a conductor layer that is formed according to plating. The present invention also provides a method of forming the insulating layer; and a method of producing the multilayer printed wiring board; and furthermore an adhesive film that is used in these methods. The laminating method is a method of laminating a circuit board characterized in that the adhesive film formed by laminating a resin composition layer made of the following A layer and B layer on a support base film; Layer A is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface obtained by thermally curing which after roughening with an alkaline permanganic acid solution, allows forming a conductor layer according to the plating, and is solid at ambient temperature, and; Layer B is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature; Layer A is laminated adjacent to the support base film; Layer B layer has a fluidity that allows under lamination conditions the filling of a resin into a through hole and/or a via hole simultaneously with the lamination of the circuit board; and The lamination is carried out while keeping the B layer directly in contact with the circuit board.

10. 发明授权

US06221972B1 Photosensitive resin and photosensitive resin composition containing the same 失效
标题翻译：感光树脂和含有它们的感光性树脂组合物
公开(公告)号：US06221972B1
公开(公告)日：2001-04-24
申请号：US08927086
申请日：1997-09-10
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08F830
CPC分类号： G03F7/038 , C08G59/1433 , C09D163/10 , G03F7/029 , Y10S522/904
摘要： The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
摘要翻译：本发明涉及一种可在水中显影并可用作感光性树脂组合物的新型感光性树脂。更具体地说，本发明涉及可用作印刷电路板的感光性抗蚀剂的组合物。

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