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1. 发明授权

US06887580B2 Adhesive polyimide resin and adhesive laminate 失效
标题翻译：粘合聚酰亚胺树脂和粘合剂层压板
公开(公告)号：US06887580B2
公开(公告)日：2005-05-03
申请号：US10182402
申请日：2001-01-26
申请人： Kiwamu Tokuhisa , Akira Tokumitsu , Kazuaki Kaneko
发明人： Kiwamu Tokuhisa , Akira Tokumitsu , Kazuaki Kaneko
IPC分类号： B32B15/08 , B32B27/34 , C08G73/10 , C08G77/455 , C09J179/08 , C09J183/10 , H01L21/58 , H01L23/498 , H05K1/03 , H05K3/46 , B32B27/00
CPC分类号： B32B15/08 , B32B7/12 , B32B27/281 , B32B27/34 , B32B2311/12 , B32B2311/16 , B32B2311/24 , B32B2311/30 , B32B2379/08 , C08G73/106 , C08G77/455 , C09J179/08 , C09J183/10 , H01L23/49894 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/19042 , H05K1/0346 , H05K3/4626 , Y10T156/10 , Y10T428/31504 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , H01L2924/0715 , H01L2924/07025 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
摘要翻译：一种粘合性聚酰亚胺树脂，其包含由（A）芳族四羧酸二酐获得的硅氧烷聚酰亚胺树脂和（B）二胺成分，所述二胺成分包含（B1）具有酚羟基，羧基或乙烯基的二胺作为可交联反应性基团，（B2）硅氧烷二胺，玻璃化转变温度为50〜250℃，在250℃下的杨氏模量（储能模量）为10〜5Pa以上; 以及层叠体，其包含基板，所述基板包括具有至少一个聚酰亚胺树脂层的导体层和绝缘支撑层，并且在所述基板的表面上设置包括所述粘合性聚酰亚胺树脂层的粘合剂层。粘合性聚酰亚胺树脂和层压体即使在暴露于高达270℃的高温下也具有令人满意的粘合强度，并且在回流炉中还具有优异的耐热性。因此，它们适用于电子部件的接合。

2. 发明申请

US20130310535A1 POLYCARBONATE RESIN AND PROCESS FOR PRODUCTION THEREOF 审中-公开
标题翻译：聚碳酸酯树脂及其生产方法
公开(公告)号：US20130310535A1
公开(公告)日：2013-11-21
申请号：US13981702
申请日：2012-01-23
申请人： Noriyuki Kato , Yuki Kumagai , Shu Yoshida , Takashi Ishii , Kazuaki Kaneko , Kazuya Sekihara
发明人： Noriyuki Kato , Yuki Kumagai , Shu Yoshida , Takashi Ishii , Kazuaki Kaneko , Kazuya Sekihara
IPC分类号： C08G64/06
CPC分类号： C08G64/06 , C08G64/1608 , C08G64/24 , C08J5/18 , C08J2369/00 , G02B1/04 , G02B5/3033 , C08L69/00
摘要： The present invention provides a polycarbonate resin containing a structural unit represented by general formula (I). In formula (I), R's independently represent a halogen atom, an alkyl group having 1-9 carbon atoms, an aryl group having 6-12 carbon atoms, an alkenyl group having 2-5 carbon atoms, an alkoxy group having 1-5 carbon atoms, or an aralkyl group having 7-17 carbon atoms; n's independently mean the number of R's which substitute on the benzene ring and independently represent an integer of 0-4; Y represents an alkylene group having 1-4 carbon atoms; and p represents an integer of 0-4.
摘要翻译：本发明提供含有由通式（I）表示的结构单元的聚碳酸酯树脂。式（I）中，R独立地表示卤素原子，具有1-9个碳原子的烷基，具有6-12个碳原子的芳基，具有2-5个碳原子的链烯基，具有1-5个碳原子或具有7-17个碳原子的芳烷基; n独立地表示在苯环上取代的R的数目，独立地表示0-4的整数; Y表示具有1-4个碳原子的亚烷基; p表示0〜4的整数。

3. 发明申请

US20110201762A1 POLYCARBONATE RESIN COMPOSITION AND OPTICAL MATERIALS USING THE SAME 审中-公开
标题翻译：聚碳酸酯树脂组合物和使用它的光学材料
公开(公告)号：US20110201762A1
公开(公告)日：2011-08-18
申请号：US13055669
申请日：2009-07-23
申请人： Noriyuki Kato , Toshiaki Yamada , Shu Yoshida , Jun Hagiwara , Kazuaki Kaneko
发明人： Noriyuki Kato , Toshiaki Yamada , Shu Yoshida , Jun Hagiwara , Kazuaki Kaneko
IPC分类号： C08L69/00
CPC分类号： C08G64/0208 , C08G64/1608 , C08L69/00 , C08L2666/18
摘要： To provide a polycarbonate resin composition excellent in low-birefringence and environment resistance properties to be used for optical materials such as lenses, films or sheets.Disclosed is a polycarbonate resin composition comprising a polycarbonate resin (A) prepared by forming carbonate bonds in a dihydroxy compound represented by formula (1) with a diester carbonate, and a polycarbonate resin (B) prepared by forming carbonate bonds in 2,2-bis(4-hydroxyphenyl)propane with a diester carbonate or phosgene. In the formula, R1 and R2 each independently represent a hydrogen atom or methyl.
摘要翻译：提供用于透镜，膜或片等光学材料的低双折射性和耐环境性优异的聚碳酸酯树脂组合物。公开了一种聚碳酸酯树脂组合物，其包含通过在式（1）表示的二羟基化合物中与碳酸二酯形成碳酸酯键而制备的聚碳酸酯树脂（A）和通过在二甲苯中形成碳酸酯键制备的聚碳酸酯树脂（B）双（4-羟基苯基）丙烷与碳酸二酯或光气。在该式中，R 1和R 2各自独立地表示氢原子或甲基。

4. 发明申请

US20090173444A1 SURFACE PROCESSING APPARATUS 审中-公开
标题翻译：表面加工设备
公开(公告)号：US20090173444A1
公开(公告)日：2009-07-09
申请号：US12397150
申请日：2009-03-03
申请人： Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Daisuke Kondo , Osamu Morita
发明人： Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Daisuke Kondo , Osamu Morita
IPC分类号： C23F1/08 , C23C16/54
CPC分类号： C23C16/4557 , C23C16/45565 , C23C16/45572 , C23C16/5096 , H01J37/3244
摘要： The invention is to realize a gas ejection mechanism, which makes it possible to form a uniform gas flow and to control the temperature and its distribution over a gas plate, and thereby to provide a surface processing apparatus which can continuously carry out uniform processing. A surface processing apparatus of this invention comprises: a process chamber in which a substrate holding mechanism and a gas ejection mechanism are arranged to face each other; an exhaust means; and a gas supply means; wherein a gas distribution mechanism, a cooling or the heating mechanism provided with a coolant channel or a heater to cool or heat a gas plate and a number of gas passages, and the gas plate having a number of gas outlets communicated with the gas passages are arranged in that order from the upper stream to construct the gas ejection mechanism, and wherein the gas plate is fixed to the cooling or heating mechanism with a clamping member or with an electrostatic chucking mechanism. A second gas distribution mechanism may be installed between the gas plate and the cooling or heating mechanism so as to form gas outlets under the coolant channel.
摘要翻译：本发明是为了实现气体喷射机构，其能够形成均匀的气流并且控制温度及其在气板上的分布，从而提供能够连续进行均匀处理的表面处理装置。本发明的表面处理装置包括：处理室，其中基板保持机构和气体喷射机构彼此相对配置; 排气装置; 和气体供给装置; 其特征在于，具有冷却通道的冷却或加热机构，或用于冷却或加热气板和多个气体通道的加热机构以及具有与气体通路连通的多个气体出口的气体板的气体分配机构，从上游按顺序排列构成气体排出机构，其中，气板用夹紧构件或静电吸附机构固定在冷却或加热机构上。第二气体分配机构可以安装在气体板和冷却或加热机构之间，以在冷却剂通道下形成气体出口。

5. 发明授权

US07026743B2 Surface acoustic wave device having high dielectric strength and process for manufacturing the same 有权
标题翻译：具有高介电强度的表面声波装置及其制造方法
公开(公告)号：US07026743B2
公开(公告)日：2006-04-11
申请号：US10689811
申请日：2003-10-21
申请人： Haruhiko Fujimoto , Satoshi Waga , Takashi Sato , Kyosuke Ozaki , Yutaka Matsuo , Takeshi Ikeda , Kazuaki Kaneko , Takuo Kudo
发明人： Haruhiko Fujimoto , Satoshi Waga , Takashi Sato , Kyosuke Ozaki , Yutaka Matsuo , Takeshi Ikeda , Kazuaki Kaneko , Takuo Kudo
IPC分类号： H01L41/08
CPC分类号： H03H9/02929 , Y10T428/12368 , Y10T428/12493
摘要： A surface acoustic wave device includes a piezoelectric substrate and an electrode section, disposed on the piezoelectric substrate, having a thin-film structure. The electrode section includes interdigital electrodes and junction electrodes connected to the interdigital electrodes. The interdigital electrodes each include corresponding first base layers containing Ta and Cu layers or Cu—M alloy layers each disposed on the corresponding first base layers, wherein M represents one or more elements selected from the group consisting of Ag, Sn, and C.
摘要翻译：表面声波装置包括压电基片和设置在压电基片上的具有薄膜结构的电极部分。电极部分包括连指电极的交叉指状电极和结电极。叉指电极各自包括相应的第一基层，每个第一基层含有分别设置在相应的第一基层上的Ta和Cu层或Cu-M合金层，其中M表示选自Ag，Sn和C的一种或多种元素。

6. 发明授权

US06838807B2 Surface acoustic wave device suitable for use in GHz band 失效
标题翻译：表面声波装置适用于GHz频段
公开(公告)号：US06838807B2
公开(公告)日：2005-01-04
申请号：US10701831
申请日：2003-11-05
申请人： Kyosuke Ozaki , Satoshi Waga , Haruhiko Fujimoto , Takashi Sato , Yutaka Matsuo , Takeshi Ikeda , Kazuaki Kaneko , Takuo Kudo
发明人： Kyosuke Ozaki , Satoshi Waga , Haruhiko Fujimoto , Takashi Sato , Yutaka Matsuo , Takeshi Ikeda , Kazuaki Kaneko , Takuo Kudo
IPC分类号： H03H3/08 , H03H9/02 , H03H9/145 , H03H9/25 , H01L41/08
CPC分类号： H03H9/02559 , H03H3/08 , H03H9/14538
摘要： IDT electrodes are formed by a Cu alloy. When the wavelength of a SAW propagating in the direction of the X axis of a piezoelectric substrate is indicated by λ, and when the thickness of the IDT electrodes is indicated by H, the standardized thickness H/λ of the IDT electrodes ranges from 0.045 to 0.070, and the piezoelectric substrate is a rotated Y-cut LiTaO3 substrate whose rotational cut angle θ from the Y axis to the Z axis around the X axis ranges from 52.0° to 58.0°. With this arrangement, the reflection coefficient S11 becomes 0.88 or higher.
摘要翻译： IDT电极由Cu合金形成。当通过λ表示在压电基板的X轴方向上传播的SAW的波长，并且当IDT电极的厚度由H表示时，IDT电极的标准化厚度H /λ范围为0.045〜 0.070，并且压电基板是旋转的Y切割LiTaO 3基板，其旋转切角θ从Y轴到围绕X轴的Z轴在52.0°至58.0°之间。由此，反射系数S11变为0.88以上。

7. 发明授权

US09163116B2 Polycarbonate resin composition 有权
标题翻译：聚碳酸酯树脂组合物
公开(公告)号：US09163116B2
公开(公告)日：2015-10-20
申请号：US13383734
申请日：2010-07-12
申请人： Noriyuki Kato , Hiroki Furuhashi , Shu Yoshida , Kazuaki Kaneko , Keiichi Kameyama
发明人： Noriyuki Kato , Hiroki Furuhashi , Shu Yoshida , Kazuaki Kaneko , Keiichi Kameyama
IPC分类号： C08L69/00 , C08G64/16
CPC分类号： C08G64/1608 , C08L69/00 , C08L2205/02 , C08L2666/18
摘要： To provide a polycarbonate resin composition excellent in low-birefringence and strength.Disclosed is a polycarbonate resin composition prepared by blending a polycarbonate resin (A) prepared by forming carbonate bonds in a 95-5% by mole of dihydroxy compound represented by formula (1) and a 5-95% by mole of dihydroxy compound represented by formula (2) with a diester carbonate, and a polycarbonate resin (B) prepared by forming carbonate bonds in dihydroxy compound represented by formula (3) with a diester carbonate or phosgene in a 45-85% ratio by weight of (100×(A))/((A)+(B)). (in the formula, R1 and R2 represent a hydrogen atom or methyl respectively.)
摘要翻译：提供低双折射和强度优异的聚碳酸酯树脂组合物。公开了一种聚碳酸酯树脂组合物，其通过将95-5摩尔％的由式（1）表示的二羟基化合物和5-95摩尔％的由式（1）表示的二羟基化合物形成碳酸酯键制备的聚碳酸酯树脂（A）式（2）表示的碳酸酯和通过在式（3）表示的二羟基化合物中形成碳酸酯键的碳酸酯树脂（B）与碳酸二酯或碳酰氯以（重量比）为100重量％ A））/（（A）+（B））。（式中，R 1和R 2分别表示氢原子或甲基。）

8. 发明申请

US20120178886A1 POLYCARBONATE RESIN COMPOSITION 有权
标题翻译：聚碳酸酯树脂组合物
公开(公告)号：US20120178886A1
公开(公告)日：2012-07-12
申请号：US13383734
申请日：2010-07-12
申请人： Noriyuki Kato , Hiroki Furuhashi , Shu Yoshida , Kazuaki Kaneko , Keiichi Kameyama
发明人： Noriyuki Kato , Hiroki Furuhashi , Shu Yoshida , Kazuaki Kaneko , Keiichi Kameyama
IPC分类号： C08L69/00
CPC分类号： C08G64/1608 , C08L69/00 , C08L2205/02 , C08L2666/18
摘要： To provide a polycarbonate resin composition excellent in low-birefringence and strength.Disclosed is a polycarbonate resin composition prepared by blending a polycarbonate resin (A) prepared by forming carbonate bonds in a 95-5% by mole of dihydroxy compound represented by formula (1) and a 5-95% by mole of dihydroxy compound represented by formula (2) with a diester carbonate, and a polycarbonate resin (B) prepared by forming carbonate bonds in dihydroxy compound represented by formula (3) with a diester carbonate or phosgene in a 45-85% ratio by weight of (100×(A))/((A)+(B)). (in the formula, R1 and R2 represent a hydrogen atom or methyl respectively.)
摘要翻译：提供低双折射和强度优异的聚碳酸酯树脂组合物。公开了一种聚碳酸酯树脂组合物，其通过将95-5摩尔％的由式（1）表示的二羟基化合物和5-95摩尔％的由式（1）表示的二羟基化合物形成碳酸酯键制备的聚碳酸酯树脂（A）式（2）表示的碳酸酯和通过在式（3）表示的二羟基化合物中形成碳酸酯键的碳酸酯树脂（B）与碳酸二酯或碳酰氯以（重量比）为100重量％ A））/（（A）+（B））。（式中，R 1和R 2分别表示氢原子或甲基。）

9. 再颁专利

USRE42175E1 Electrostatic chucking stage and substrate processing apparatus 有权
标题翻译：静电吸附台和基板处理装置
公开(公告)号：USRE42175E1
公开(公告)日：2011-03-01
申请号：US12470231
申请日：2009-05-21
申请人： Yasumi Sago , Kazuaki Kaneko , Takuji Okada , Masayoshi Ikeda , Toshihiro Tachikawa , Tadashi Inokuchi , Takashi Kayamoto
发明人： Yasumi Sago , Kazuaki Kaneko , Takuji Okada , Masayoshi Ikeda , Toshihiro Tachikawa , Tadashi Inokuchi , Takashi Kayamoto
IPC分类号： H01L21/00 , C23C16/00 , C23C14/00
CPC分类号： B25B11/002 , Y10T279/23
摘要： This application discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer. The moderation layer and the covering layer have the thermal expansion coefficients between the dielectric plate and the chucking electrode. This application also discloses the structure of an ESC stage where a chucking electrode is sandwiched by a moderation layer and a covering layer, which have internal stress directed oppositely to that of the chucking electrode. This application further discloses a substrate processing apparatus for carrying out a process onto a substrate as the substrate is maintained at a temperature higher than room temperature, comprising the electrostatic chucking stage for holding the substrate during the process.
摘要翻译：本申请公开了一种ESC阶段的结构，其中夹持电极被中间层和覆盖层夹持。调节层和覆盖层在电介质板和夹持电极之间具有热膨胀系数。本申请还公开了一种ESC台的结构，其中夹持电极被夹持在与夹持电极相反的内部应力的调节层和覆盖层。本申请进一步公开了一种用于在基板保持在高于室温的温度下进行基板上的处理的基板处理装置，其包括在该过程期间保持基板的静电夹持台。

10. 发明授权

US07615133B2 Electrostatic chuck module and cooling system 失效
标题翻译：静电吸盘模块和冷却系统
公开(公告)号：US07615133B2
公开(公告)日：2009-11-10
申请号：US10497720
申请日：2002-12-03
申请人： Noriaki Tateno , Jun Miyaji , Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Tomio Takamura , Tadashi Hirayama , Yoshiyuki Ikemura , Masahiko Tamaru
发明人： Noriaki Tateno , Jun Miyaji , Yasumi Sago , Masayoshi Ikeda , Kazuaki Kaneko , Tomio Takamura , Tadashi Hirayama , Yoshiyuki Ikemura , Masahiko Tamaru
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306 , H01L21/683
CPC分类号： H01L21/67103 , H01L21/6831 , H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck module for a semiconductor manufacturing apparatus which can be cooled with water and in which there is no penetration leak includes an electrostatic chuck plate of alumina and a cooling plate which is bonded to the electrostatic chuck, wherein the cooling plate is formed by forging processing to a Cu-based composite material comprising Cu—W, Cu—W—Ni, Cu—Mo, or Cu—Mo—Ni. By adjusting the ratio of Cu and Ni having a great thermal expansion coefficient and W and Mo having a small thermal expansion coefficient in a Cu-based composite material, it is possible to obtain a highly thermally conductive material having the same thermal expansion coefficient as an alumina material for an electrostatic chuck. However, since such a composite material has a penetration leak, it cannot be used in a vacuum system. According to the present invention, by conducting forging processing, a penetration leak can be prevented. Also, corrosion resistance which is important for a cooling plate can be improved by applying a Ni, Cr or Cu film by plating or sputtering.
摘要翻译：一种用于半导体制造装置的静电吸盘模块，其可以用水冷却并且其中没有渗透泄漏包括氧化铝的静电吸盘和与静电吸盘结合的冷却板，其中冷却板通过锻造形成对Cu-W，Cu-W-Ni，Cu-Mo或Cu-Mo-Ni的Cu基复合材料的加工。通过在Cu系复合材料中调节热膨胀系数大的Cu和Ni的比例以及热膨胀系数小的W和Mo，可以获得具有相同的热膨胀系数的高导热性材料用于静电卡盘的氧化铝材料。然而，由于这种复合材料具有渗透泄漏，所以不能用于真空系统。根据本发明，通过进行锻造处理，能够防止渗透泄漏。此外，通过电镀或溅射施加Ni，Cr或Cu膜，可以提高对冷却板重要的耐腐蚀性。

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