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1. 发明授权

US06936918B2 MEMS device with conductive path through substrate 有权
标题翻译：具有导电通路的MEMS器件通过衬底
公开(公告)号：US06936918B2
公开(公告)日：2005-08-30
申请号：US10827680
申请日：2004-04-19
申请人： Kieran P. Harney , Lawrence E. Felton , Thomas Kieran Nunan , Susan A. Alie , Bruce Wachtmann
发明人： Kieran P. Harney , Lawrence E. Felton , Thomas Kieran Nunan , Susan A. Alie , Bruce Wachtmann
IPC分类号： B81B7/00 , B81B7/02 , H01L23/12
CPC分类号： B81B7/007 , B81B2201/0235 , B81C2203/019 , H01L2224/16225 , H01L2924/1461
摘要： A MEMS device has at least one conductive path extending from the top facing side of its substrate (having MEMS structure) to the bottom side of the noted substrate. The at least one conductive path extends through the substrate as noted to electrically connect the bottom facing side with the MEMS structure.
摘要翻译： MEMS器件具有从其衬底（具有MEMS结构）的顶面侧延伸到所述衬底的底侧的至少一个导电路径。所述至少一个导电路径延伸穿过衬底，如将所述底面朝向侧面与MEMS结构电连接。

2. 发明授权

US07040922B2 Multi-surface mounting member and electronic device 有权
标题翻译：多表面安装构件和电子设备
公开(公告)号：US07040922B2
公开(公告)日：2006-05-09
申请号：US10454999
申请日：2003-06-05
申请人： Kieran P. Harney , Lawrence E. Felton , Lewis Long
发明人： Kieran P. Harney , Lawrence E. Felton , Lewis Long
IPC分类号： H01R11/01 , H01R9/00 , H01R13/00 , G01D11/00
CPC分类号： G01C21/16 , B81B7/0074 , Y10S439/913
摘要： An electrical interconnect apparatus has a mounting member with a plurality of sides. The mounting member is formed from an insulator as a cuboid. Moreover, the mounting member also may be formed from a flexible circuit. Among other things, the plurality of sides includes an interface side. At least two of the plurality of sides are in electrical communication with the interface side.
摘要翻译：电互连装置具有多个侧面的安装构件。安装构件由作为长方体的绝缘体形成。此外，安装构件也可以由柔性电路形成。其中，多个侧面包括界面侧。多个侧面中的至少两个与接口侧电连通。

3. 发明申请

US20080150104A1 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE 审中-公开
标题翻译：具有不同拓扑的LEADFRAME用于MEMS封装
公开(公告)号：US20080150104A1
公开(公告)日：2008-06-26
申请号：US11875130
申请日：2007-10-19
申请人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
发明人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
IPC分类号： H01L23/495 , H01L21/02
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
摘要翻译：描述了用于微机电（MEMS）装置的封装。预制的引线框架底座具有相对的顶部和底部表面。每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

4. 发明授权

US06931170B2 Fiber-attached optical devices with in-plane micromachined mirrors 有权
标题翻译：光纤连接的光学器件具有平面内微加工镜
公开(公告)号：US06931170B2
公开(公告)日：2005-08-16
申请号：US10274496
申请日：2002-10-18
申请人： Chang-Han Yun , Shanti Bhattacharya , Yakov Reznichenko , John R. Martin , Lawrence E. Felton , Jeffrey Swift , Kieran P. Harney , Michael W. Judy
发明人： Chang-Han Yun , Shanti Bhattacharya , Yakov Reznichenko , John R. Martin , Lawrence E. Felton , Jeffrey Swift , Kieran P. Harney , Michael W. Judy
IPC分类号： G02B6/26 , G02B6/35 , G02B6/42
CPC分类号： G02B6/3512 , G02B6/266 , G02B6/3556
摘要： A fiber-attached optical device with in-plane micromachined mirrors includes a cover having at least one reflector formed on one side and a substrate having a plurality of micromachined optical mirrors formed substantially on a single plane on a side facing toward the mirrored side of the cover. The micromachined optical mirrors are controllable to reflect optical signals between a plurality of optical fiber segments via the at least one reflector. The plurality of optical fiber segments can be attached to either the cover or the substrate so as to form an integrated package including the substrate, the cover, and the plurality of optical fiber segments. The mirrors can be controlled to variably attenuate the optical signals.
摘要翻译：具有面内微加工反射镜的光纤附接光学器件包括具有在一侧形成的至少一个反射器的盖，以及具有多个微加工光学镜的基板，所述多个微机械光学镜基本上在面向所述镜面侧的一侧的单个平面上形成盖。微加工的光学镜可被控制以经由至少一个反射器反射多个光纤段之间的光信号。多个光纤段可以附着到盖或基板上，以形成包括基板，盖和多个光纤段的集成封装。可以控制镜子以可变地衰减光信号。

5. 发明授权

US07357017B2 Wafer level capped sensor 有权
标题翻译：晶圆级封面传感器
公开(公告)号：US07357017B2
公开(公告)日：2008-04-15
申请号：US11836205
申请日：2007-08-09
申请人： Lawrence E. Felton , Kieran P. Harney , Carl M. Roberts
发明人： Lawrence E. Felton , Kieran P. Harney , Carl M. Roberts
IPC分类号： G01N19/02 , H01N23/14
CPC分类号： G01P15/0802 , B81B7/007 , B81B2201/0235 , B81B2201/0242 , B81B2207/095 , B81C1/0023 , B81C1/00301 , B81C2203/0118 , G01P1/023 , G01P15/125 , Y10T29/49007 , Y10T29/49117 , Y10T29/49204 , Y10T29/49213
摘要： A sensor has a die (with a working portion), a cap coupled with the die to at least partially cover the working portion, and a conductive pathway extending through the cap to the working portion. The pathway provides an electrical interface to the working portion.
摘要翻译：传感器具有模具（具有工作部分），与模具耦合以至少部分地覆盖工作部分的帽以及延伸穿过帽部到工作部分的导电通路。该通道为工作部分提供电接口。

6. 发明申请

US20110266639A1 Method of Producing a MEMS Device 有权
标题翻译：生产MEMS器件的方法
公开(公告)号：US20110266639A1
公开(公告)日：2011-11-03
申请号：US13182924
申请日：2011-07-14
申请人： Manolo G. Mena , Elmer S. Lacsamana , William A. Webster , Lawrence E. Felton
发明人： Manolo G. Mena , Elmer S. Lacsamana , William A. Webster , Lawrence E. Felton
IPC分类号： H01L21/56 , H01L29/84
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.
摘要翻译：制造MEMS器件的方法在其可移动结构形成之后移除器件晶片的底侧。为此，该方法提供了具有初始底侧的器件晶片。接下来，该方法在器件晶片上形成可移动结构，然后基本上去除器件晶片的整个初始底侧。整个初始底部的移除有效地形成最终底部。

7. 发明申请

US20080225505A1 Method of producing a MEMS device 审中-公开
公开(公告)号：US20080225505A1
公开(公告)日：2008-09-18
申请号：US12129283
申请日：2008-05-29
申请人： John R. Martin , Manolo G. Mena , Elmer S. Lacsamana , Michael P. Duffy , William A. Webster , Lawrence E. Felton , Maurice S. Karpman
发明人： John R. Martin , Manolo G. Mena , Elmer S. Lacsamana , Michael P. Duffy , William A. Webster , Lawrence E. Felton , Maurice S. Karpman
IPC分类号： H01L21/50 , H05K7/00
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device removes the bottom side of a device wafer after its movable structure is formed. To that end, the method provides the device wafer, which has an initial bottom side. Next, the method forms the movable structure on the device wafer, and then removes substantially the entire initial bottom side of the device wafer. Removal of the entire initial bottom side effectively forms a final bottom side.

8. 发明授权

US06352935B1 Method of forming a cover cap for semiconductor wafer devices 有权
标题翻译：形成用于半导体晶片装置的盖帽的方法
公开(公告)号：US06352935B1
公开(公告)日：2002-03-05
申请号：US09484991
申请日：2000-01-18
申请人： David J. Collins , Craig E. Core , Lawrence E. Felton , Jing Luo
发明人： David J. Collins , Craig E. Core , Lawrence E. Felton , Jing Luo
IPC分类号： H01L21302
CPC分类号： H01L21/50 , H01L23/10 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for capping active areas of a semiconductor wafer uses photolithography to define areas of sealant on the cap wafer to thereby reduce the amount of space required for attaching the cap wafer to the semiconductor wafer carrying active areas to be capped. Using photolithography in this manner increases the amount of space on the semiconductor wafer that can be used to form active areas which, in turn, improves the density of active area on the semiconductor wafer. In one embodiment, the method includes the steps of applying a photoimageable layer, photoimaging the photoimageable layer to define a pattern including remaining regions of the photoimageable layer and removed regions of the photoimageable layer, and using the pattern to define the sealant regions on the semiconductor wafer. The method may further include one or more steps, such as applying sealant to the sealant regions defined by the pattern, curing the sealant, removing the remaining regions after applying the sealant to the sealant regions, removing excess sealant not within the sealant regions, and using the sealant material to form at least one seal around at least one active area formed on the second semiconductor substrate.
摘要翻译：用于封盖半导体晶片的有源区域的方法使用光刻法来限定盖晶片上的密封剂的面积，从而减少将盖晶片附接到承载要被封盖的有源区域的半导体晶片所需的空间量。以这种方式使用光刻增加了可用于形成有源区域的半导体晶片上的空间量，这又提高了半导体晶片上的有效面积的密度。在一个实施例中，该方法包括以下步骤：应用可光成像层，对可光成像层进行成像，以定义包括可光成像层的剩余区域和去除了可光成像层的区域的图案，并且使用图案来限定半导体上的密封剂区域晶圆。该方法还可以包括一个或多个步骤，例如将密封剂施加到由图案限定的密封剂区域，固化密封剂，在将密封剂施加到密封剂区域之后移除其余区域，去除密封剂区域内的多余的密封剂，以及使用密封剂材料在形成在第二半导体衬底上的至少一个有效区域周围形成至少一个密封件。

9. 发明授权

US07521363B2 MEMS device with non-standard profile 有权
标题翻译：具有非标准型材的MEMS器件
公开(公告)号：US07521363B2
公开(公告)日：2009-04-21
申请号：US10914575
申请日：2004-08-09
申请人： John R. Martin , Lawrence E. Felton
发明人： John R. Martin , Lawrence E. Felton
IPC分类号： H01L29/84
CPC分类号： B81C1/00896
摘要： A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness when its outer diameter equals the wafer outer diameter. In illustrative embodiments, however, the non-standard thickness is smaller than the standard thickness. The method then forms structure on the non-standard device wafer.
摘要翻译： MEMS器件的制造方法在非标准器件晶片上形成结构。为此，该方法提供了所述非标准器件晶片，其具有晶片外径和非标准厚度。如本领域技术人员已知的，当其外径等于晶片外径时，标准器件晶片具有标准厚度。然而，在说明性实施例中，非标准厚度小于标准厚度。该方法然后在非标准器件晶片上形成结构。

10. 发明授权

US07338705B2 Static dissipation treatments for optical package windows 有权
标题翻译：光学封装窗口的静电消除处理
公开(公告)号：US07338705B2
公开(公告)日：2008-03-04
申请号：US11384719
申请日：2006-03-20
申请人： John R. Martin , Maurice Karpman , Lawrence E. Felton
发明人： John R. Martin , Maurice Karpman , Lawrence E. Felton
IPC分类号： B32B15/08 , B32B27/00 , B32B27/18 , B32B27/30 , G02B26/00
CPC分类号： C03C17/007 , C03C2217/445 , C03C2217/475 , G02B1/105 , G02B1/116 , G02B1/16 , G02B6/3512 , G02B6/3582 , H01B1/122 , Y10S977/75 , Y10S977/753 , Y10T428/25 , Y10T428/31504 , Y10T428/31544 , Y10T428/31678 , Y10T428/31855 , Y10T428/31935
摘要： An optically transparent conductive material is disposed directly or indirectly on an inside surface of a cover material for static dissipation in an optical switching device. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection. An additional coating may be disposed directly or indirectly on an outside surface of the cover material.
摘要翻译：光学透明导电材料直接或间接地设置在用于光学开关装置中的用于静电耗散的覆盖材料的内表面上。光学透明导电材料形成电连续的膜。光学透明导电材料也可用于抗反射。另外的涂层可以直接或间接地设置在覆盖材料的外表面上。

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