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1. 发明申请

US20080150104A1 LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE 审中-公开
标题翻译：具有不同拓扑的LEADFRAME用于MEMS封装
公开(公告)号：US20080150104A1
公开(公告)日：2008-06-26
申请号：US11875130
申请日：2007-10-19
申请人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
发明人： Michael A. Zimmerman , Keith Smith , Kieran P. Harney , John R. Martin , Lawrence E. Felton
IPC分类号： H01L23/495 , H01L21/02
CPC分类号： B81B7/0064 , B81B2201/0257 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/10253 , H01L2924/1461 , H01L2924/19105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
摘要翻译：描述了用于微机电（MEMS）装置的封装。预制的引线框架底座具有相对的顶部和底部表面。每个表面由具有至少一个导电部分和至少一个非导电部分的拓扑结构限定，并且顶表面的拓扑与底表面的拓扑不同。

2. 发明申请

US20110064881A1 PLASTIC ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：塑料电子元件包装
公开(公告)号：US20110064881A1
公开(公告)日：2011-03-17
申请号：US12950528
申请日：2010-11-19
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： B05D3/10
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

3. 发明申请

US20080305355A1 Plastic electronic component package 审中-公开
标题翻译：塑料电子元件包装
公开(公告)号：US20080305355A1
公开(公告)日：2008-12-11
申请号：US12220543
申请日：2008-07-25
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： F16J15/02 , B32B15/08
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

4. 发明申请

US20180175372A1 BATTERY HAVING ALUMINUM ANODE AND SOLID POLYMER ELECTROLYTE 审中-公开
公开(公告)号：US20180175372A1
公开(公告)日：2018-06-21
申请号：US15580428
申请日：2016-06-07
申请人： Michael A. ZIMMERMAN , Alexei B. GAVRILOV , Ting LUI , Keith SMITH , IONIC MATERIALS, INC.
发明人： Michael A. Zimmerman , Alexei B. Gavrilov , Ting Liu , Keith Smith
IPC分类号： H01M4/134 , H01M4/136 , H01M4/1395 , H01M4/1399 , H01M10/0565 , H01M10/054 , H01M10/0562
CPC分类号： H01M4/602 , H01M4/131 , H01M4/134 , H01M4/136 , H01M4/1395 , H01M4/1399 , H01M4/381 , H01M4/463 , H01M4/466 , H01M4/50 , H01M4/624 , H01M10/054 , H01M10/0562 , H01M10/0565 , H01M10/24 , H01M2004/027 , H01M2004/028 , H01M2300/0082
摘要： A battery, having polyvalent aluminum metal as the electrochemically active anode material and also including a solid ionically conducting polymer material.

5. 发明授权

US08039945B2 Plastic electronic component package 有权
标题翻译：塑料电子元件包装
公开(公告)号：US08039945B2
公开(公告)日：2011-10-18
申请号：US12950528
申请日：2010-11-19
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： H01L23/48
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

6. 发明申请

US20080150064A1 Plastic electronic component package 审中-公开
公开(公告)号：US20080150064A1
公开(公告)日：2008-06-26
申请号：US12001792
申请日：2007-12-12
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： H01L31/0203 , H01L23/495 , H01L21/60
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.

7. 发明授权

US08950037B1 Rug rinsing table and method 有权
标题翻译：地毯冲洗台和方法
公开(公告)号：US08950037B1
公开(公告)日：2015-02-10
申请号：US13248130
申请日：2011-09-29
申请人： Michael A. Zimmerman
发明人： Michael A. Zimmerman
IPC分类号： A47L5/38 , A47B37/00
CPC分类号： D06G1/00
摘要： A low profile rinsing table is provided for cleaning rugs and other articles. The table includes an upper member having a series of apertures therein. Cleaning solutions can be scrubbed into the top of the rug and vacuum sources connected to the rinsing table will extract dirt, spent cleaning liquids and rinse water by pulling it through the rug, into a waste chamber and out for proper disposal. In an alternate embodiment of the rinsing table a roller extends along one side of the table to allow the rug to be easily indexed thereover.
摘要翻译：提供了一个低调的冲洗台，用于清洁地毯和其他物品。桌子包括在其中具有一系列孔的上部构件。清洁溶液可以擦洗到地毯的顶部，连接到冲洗台的真空源将通过将其通过地毯拉到废物室中并抽出污垢，废弃的清洁液体和冲洗水进行处理。在漂洗台的一个替代实施例中，辊子沿桌子的一侧延伸，以使得地毯可以容易地在其上进行索引。

8. 发明申请

US20120270979A1 BLEND COMPOSITION, FLEXIBLE TUBING MATERIAL AND METHOD OF MAKING THE BLEND 有权
标题翻译：混合组合物，柔性管材料和制造混合物的方法
公开(公告)号：US20120270979A1
公开(公告)日：2012-10-25
申请号：US13456146
申请日：2012-04-25
申请人： Shaw Ling Hsu , Sahas Rathi , Edward Bryan Coughlin , Xiaolang Chen , Charles S. Golub , Michael J. Tzivanis , Michael A. Zimmerman , Nicholas Orf , Choung H. Lai
发明人： Shaw Ling Hsu , Sahas Rathi , Edward Bryan Coughlin , Xiaolang Chen , Charles S. Golub , Michael J. Tzivanis , Michael A. Zimmerman , Nicholas Orf , Choung H. Lai
IPC分类号： C08L67/04 , B29C45/16 , C08K5/103
CPC分类号： C08L67/04 , B29C2045/0091 , C08K5/103 , C08L101/12 , C08L101/16 , C08L2205/02
摘要： A composition includes a blend of (a) a multi-block copolymer including at least one block of an elastomeric polymer and at least one block of a first polymer including a chiral polymer having a stereo isomeric configuration; and (b) a second polymer including an anti-chiral polymer corresponding to the chiral polymer in (a), wherein the second polymer includes an opposite handed stereo isomeric configuration to the chiral polymer in (a); wherein the blend of the chiral polymer and the anti-chiral polymer form stereo complex sites. A flexible tubing material further includes the blend. In an embodiment, a method of making the blend material is also provided.
摘要翻译：组合物包括（a）包含弹性体聚合物的至少一个嵌段和至少一个第一聚合物嵌段的多嵌段共聚物的混合物，所述第一聚合物包括具有立体异构构型的手性聚合物; 和（b）包含对应于（a）中的手性聚合物的抗手性聚合物的第二聚合物，其中所述第二聚合物包含与（a）中的手性聚合物相反的立体异构构型; 其中手性聚合物和抗手性聚合物的共混物形成立体复合物位点。柔性管材料还包括该混合物。在一个实施方案中，还提供了制备共混材料的方法。

9. 发明授权

US06361330B1 Mounting opto-electric modules on circuit boards 有权
标题翻译：在电路板上安装光电模块
公开(公告)号：US06361330B1
公开(公告)日：2002-03-26
申请号：US09680355
申请日：2000-10-05
申请人： Mark J Badcock , John Philip Franey , Robert D Yadvish , Michael A. Zimmerman
发明人： Mark J Badcock , John Philip Franey , Robert D Yadvish , Michael A. Zimmerman
IPC分类号： H01R1200
CPC分类号： G02B6/4292 , G02B6/4246 , G02B6/4255 , G02B6/426 , G02B6/4266 , G02B6/4274 , H01R12/7023 , H05K1/141 , H05K3/301 , H05K3/366 , H05K2201/10606
摘要： An opto-electric apparatus includes a circuit board, an opto-electric converter module with a plurality of electrical leads, a holder rigidly holding the opto-electric converter module, and a connection structure. The holder is rigidly fixed to the circuit board, and the connection structure is rigidly connected to the holder. The leads of the module protrude into holes in the structure. The structure electrically connects the circuit board to the leads.
摘要翻译：光电装置包括电路板，具有多个电引线的光电转换器模块，刚性地保持光电转换器模块的支架和连接结构。支架刚性地固定在电路板上，连接结构刚性地连接到支架上。模块的引线突出到结构中的孔中。该结构将电路板电连接到引线。

10. 发明授权

US5172213A Molded circuit package having heat dissipating post 失效
标题翻译：具有散热片的模制电路封装
公开(公告)号：US5172213A
公开(公告)日：1992-12-15
申请号：US704532
申请日：1991-05-23
申请人： Michael A. Zimmerman
发明人： Michael A. Zimmerman
IPC分类号： H01L23/28 , H01L23/29 , H01L23/433 , H01L23/495 , H01L33/00
CPC分类号： H01L23/49531 , H01L23/4334 , H01L23/49568 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/01079 , H01L2924/14 , H01L2924/1532 , H01L2924/15747 , H01L2924/181 , H01L2924/3011
摘要： A major issue in the semiconductor industry is the amount of power that a silicon device dissipates. As the density of silicon integrated circuits increases with improvements in wafer processing, so does the amount of heat which must be evacuated. If the power of the silicon devices exceeds one watt, the plastic encapsulating material normally yields to the more expensive ceramic or metal packages which can dissipate thermal energy more efficiently. The conventional molded package is a silicon device such as a chip mounted onto a copper paddle which spreads the heat radially in the material and is bonded to leads via thin wires. The three major paths for the heat to escape are by conduction through the molding compound to the surface of the package where removal is by convection, and by conduction from the silicon device through the thin wires to the leads of the package and then to the printed circuit board, and by a heat conducting paddle which radially spreads the heat through the molding compound. In each instance, the heat dissipating path is through a relatively poor thermal conductor. In accordance with the principles of the invention, there is provided an improved thermal path for conducting heat from the silicon device to the surface of the plastic package. The improved thermal path comprises a post of heat conducting material positioned to extend from the silicon device to a surface of the plastic package. One end of the post is positioned to receive heat generated by the silicon device and the other end is exposed to air at the surface of the plastic package. A waist section of the post located between the ends of the post has a dimension which is different than that of the end. Additionally the ends can have dimensions which are either equal or unequal. The post configuration enables the molded package to capture the post without creating cracks in the molded package.

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