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    • 1. 发明授权
    • Structure and method for fabricating cladded conductive lines in magnetic memories
    • 在磁存储器中制造包覆导电线的结构和方法
    • US07833806B2
    • 2010-11-16
    • US12363404
    • 2009-01-30
    • Kenneth H. SmithNicholas D. RizzoSanjeev AggarwalAnthony CiancioBrian R. ButcherKelly Wayne Kyler
    • Kenneth H. SmithNicholas D. RizzoSanjeev AggarwalAnthony CiancioBrian R. ButcherKelly Wayne Kyler
    • H01L21/00
    • H01L27/222G11C11/161G11C11/1659H01L23/53238H01L2924/0002Y10S438/978H01L2924/00
    • A method of forming a magnetoelectronic device includes forming a dielectric material (114) surrounding a magnetic bit (112), etching the dielectric material (114) to define an opening (122) over the magnetic bit (112) without exposing the magnetic bit (112), the opening (122) having a sidewall, depositing a blanket layer (132) of cladding material over the dielectric material (118), including over the sidewall, removing by a sputtering process the blanket layer (132) in the bottom of the opening (122) and the dielectric material (124) over the magnetic bit (112), and forming a conductive material (146) within the opening (122) to form a bit line (154). This process reduces errors caused by process irregularities such as edges of the bits (112) protruding and thereby causing defects in the cladding layer (132) formed thereover. A bit line or digit line so formed may optionally be tapered at the ends (182, 184) to prevent magnetic reversal of the bit line magnetic moment that otherwise may occur due to external magnetic fields.
    • 一种形成磁电子器件的方法包括形成围绕磁头(112)的电介质材料(114),蚀刻电介质材料(114)以在磁头(112)上方限定开口(122),而不暴露磁头 112),所述开口(122)具有侧壁,在所述电介质材料(118)上沉积包覆材料的覆盖层(132),包括在所述侧壁上方,通过溅射工艺去除所述绝缘层 所述开口(122)和所述电介质材料(124)在所述磁头(112)上方,并且在所述开口(122)内形成导电材料(146)以形成位线(154)。 该过程减少了诸如位(112)的边缘突出的过程不规则性引起的错误,从而在其上形成的包层(132)中产生缺陷。 如此形成的位线或数字线可以可选地在端部(182,184)处是锥形的,以防止由于外部磁场而可能发生的位线磁矩的磁性反转。
    • 2. 发明授权
    • Method of fabricating flux concentrating layer for use with magnetoresistive random access memories
    • 制造用于磁阻随机存取存储器的磁通集中层的方法
    • US06211090B1
    • 2001-04-03
    • US09528971
    • 2000-03-21
    • Mark DurlamEugene Youjun ChenSaied N. TehraniJon Michael SlaughterGloria KerszykowskiKelly Wayne Kyler
    • Mark DurlamEugene Youjun ChenSaied N. TehraniJon Michael SlaughterGloria KerszykowskiKelly Wayne Kyler
    • H01L2100
    • H01L27/222B82Y10/00
    • A method of fabricating a flux concentrator for use in magnetic memory devices including the steps of providing at least one magnetic memory bit (10) and forming proximate thereto a material stack defining a copper (Cu) damascene bit line (56) including a flux concentrating layer (52). The method includes the steps of depositing a bottom dielectric layer (32), an optional etch stop (34) layer, and a top dielectric layer (36) proximate the magnetic memory bit (10). A trench (38) is etched in the top dielectric layer (36) and the bottom dielectric layer (32). A first barrier layer (42) is deposited in the trench (38). Next, a metal system (29) is deposited on a surface of the first barrier layer (42). The metal system (29) includes a copper (Cu) seed material (44), and a plated copper (Cu) material (46), a first outside barrier layer (50), a flux concentrating layer (52), and a second outside barrier layer (54). The metal system (29) is patterned and etched to define a copper (Cu) damascene bit line (56).
    • 一种制造用于磁存储器件的通量集中器的方法,包括以下步骤:提供至少一个磁存储器位(10),并在其附近形成限定铜(Cu)镶嵌位线(56)的材料堆,所述铜(Cu)镶嵌位线包括通量集中 层(52)。 该方法包括以下步骤:沉积底部电介质层(32),可选的蚀刻停止层(34)层和靠近磁存储器位(10)的顶部电介质层(36)。 在顶部电介质层(36)和底部电介质层(32)中蚀刻沟槽(38)。 第一阻挡层(42)沉积在沟槽(38)中。 接下来,金属系统(29)沉积在第一阻挡层(42)的表面上。 金属系统(29)包括铜(Cu)种子材料(44)和镀铜(Cu)材料(46),第一外部阻挡层(50),集流层(52)和第二 外部阻挡层(54)。 金属系统(29)被图案化和蚀刻以限定铜(Cu)镶嵌位线(56)。