会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Wiring board and method for manufacturing the same
    • 接线板及其制造方法
    • US08541695B2
    • 2013-09-24
    • US12956826
    • 2010-11-30
    • Atsushi IshidaRyojiro TominagaKenji Sakai
    • Atsushi IshidaRyojiro TominagaKenji Sakai
    • H05K1/11
    • H05K1/0222H05K1/0271H05K1/115H05K3/427H05K3/4602H05K2201/0347H05K2201/09563H05K2201/0959H05K2201/096H05K2201/09827
    • A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.
    • 布线基板包括具有第一表面和第二表面的基底,穿过基底的第一穿透孔,形成在第一孔的内壁上的第一通孔导体,填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体,在所述基板的第一表面上的第一导电电路,所述基板的第二表面上的第二导电电路,所述第二孔的一端上的第一导电部, 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成,并且连接第一导电部分和第二导电部分。
    • 4. 发明申请
    • WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • 接线板及其制造方法
    • US20110209905A1
    • 2011-09-01
    • US12956753
    • 2010-11-30
    • Haruhiko MoritaAtsushi IshidaRyojiro Tominaga
    • Haruhiko MoritaAtsushi IshidaRyojiro Tominaga
    • H05K1/09H01K3/10
    • H05K1/0222H05K1/185H05K3/4602H05K2201/10015
    • A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
    • 布线基板包括具有贯穿基板的第一穿透孔的基板,形成在第一贯通孔的内壁上的第一通孔导体,填充在第一导体内部并形成第二贯通孔的填充物, 形成在第二穿透孔中的通孔导体,形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部,以及形成在所述第二贯通孔的相对端的第二导电部。 第一个导体连接第一和第二个电路。 第二导体连接第一和第二导电部分。 第一电路的厚度被设定为大于第一导电部分的厚度。
    • 9. 发明授权
    • Wiring board and method for manufacturing the same
    • 接线板及其制造方法
    • US08624127B2
    • 2014-01-07
    • US12952864
    • 2010-11-23
    • Atsushi IshidaRyojiro TominagaKenji Sakai
    • Atsushi IshidaRyojiro TominagaKenji Sakai
    • H05K1/09
    • H05K3/4038H05K1/0222H05K1/0231H05K1/115H05K1/185H05K3/4602H05K2201/09563H05K2201/096H05K2201/09827H05K2201/10636Y02P70/611Y10T29/49165
    • A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
    • 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔,在基底的第一表面上的第一导电电路,在基底的第二表面上的第二导电电路, 衬底和第一或第二电路,以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体,并连接第三电路和第二导体。 衬底具有第一通孔导体,其连接第一和第二电路,并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物,以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。