专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06845836B2 Engine mounting structure for motorcycles 有权
标题翻译：摩托车发动机安装结构
公开(公告)号：US06845836B2
公开(公告)日：2005-01-25
申请号：US10274263
申请日：2002-10-21
申请人： Hiroshi Inaoka , Kazutaka Minami , Tetsuaki Maeda , Hirohisa Takahashi , Atsushi Ishida
发明人： Hiroshi Inaoka , Kazutaka Minami , Tetsuaki Maeda , Hirohisa Takahashi , Atsushi Ishida
IPC分类号： B62K11/10 , B62M7/02 , B62M7/12 , F02B61/02 , F02B75/18 , F02B75/20 , F16F15/08 , B62K11/00
CPC分类号： B62M7/12 , B62K2202/00 , F02B61/02 , F02B75/20 , F02B2075/1808 , F02B2275/18
摘要： An engine mounting structure for a motorcycle including a plurality of resilient members for connecting the engine to the vehicle body frame. The resilient member located at the position nearest to the rear wheel is given a resilient property being uniform in the vertical and fore-and-aft directions, and remaining resilient members are given a non-uniform resilient property being hard in the vertical direction and flexible in the fore-and-aft direction. With this configuration, even when the rear wheel moves horizontally in the lateral direction, the influence is attenuated while being transferred to the vehicle body frame. When a resilient member being hard in the vertical direction is used, the behavior of the rear wheel such as the vertical swinging motion or lateral turn can immediately be transferred to the vehicle body frame. Therefore, drivability of the motorcycle during high-speed driving is improved.
摘要翻译：一种用于摩托车的发动机安装结构，包括用于将发动机连接到车体框架的多个弹性构件。位于最靠近后轮的位置处的弹性构件具有在垂直方向和前后方向上均匀的弹性，并且剩余的弹性构件具有在垂直方向上硬的不均匀的弹性，并且具有柔性在前后方向。利用这种结构，即使当后轮在横向上水平移动时，影响在被转移到车身框架的同时被衰减。当使用在垂直方向上硬的弹性构件时，诸如垂直摆动或横向转动的后轮的动作可以立即被传递到车体框架。因此，提高了高速驾驶时的摩托车的驾驶性。

2. 发明授权

US06758296B2 Engine mounting structure in motorcycle 失效
标题翻译：发动机安装结构在摩托车
公开(公告)号：US06758296B2
公开(公告)日：2004-07-06
申请号：US09947607
申请日：2001-09-07
申请人： Hiroshi Inaoka , Tsutomu Takeuchi , Atsushi Ishida , Kazuo Satoh
发明人： Hiroshi Inaoka , Tsutomu Takeuchi , Atsushi Ishida , Kazuo Satoh
IPC分类号： B62K1102
CPC分类号： B62K11/10 , B62K25/283 , B62K2202/00 , B62M7/12 , F02B61/02
摘要： A scooter type motorcycle includes a rear fork for supporting a rear wheel of the motorcycle. A front portion of the rear fork is attached to a crankcase of an engine in a vertically swingable manner. The engine is mounted to a body frame through elastic members. The mounting arrangement enhances the comfort of the ride of the motorcycle by reducing vibrations from being transmitted from the rear wheel to the rider.
摘要翻译：摩托车型摩托车包括用于支撑摩托车的后轮的后叉。后叉的前部以垂直摆动的方式安装在发动机的曲轴箱上。发动机通过弹性构件安装到车架上。安装布置通过减少从后轮传递到骑手的振动来增强摩托车的乘坐舒适性。

3. 发明授权

US08541695B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08541695B2
公开(公告)日：2013-09-24
申请号：US12956826
申请日：2010-11-30
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/0271 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K2201/0347 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09827
摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.
摘要翻译：布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部，以及在所述第二穿透孔的相对端上的第二导电部分。第一导体连接第一电路和第二电路。第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。

4. 发明申请

US20110209905A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20110209905A1
公开(公告)日：2011-09-01
申请号：US12956753
申请日：2010-11-30
申请人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
发明人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/09 , H01K3/10
CPC分类号： H05K1/0222 , H05K1/185 , H05K3/4602 , H05K2201/10015
摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
摘要翻译：布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物，形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。第一个导体连接第一和第二个电路。第二导体连接第一和第二导电部分。第一电路的厚度被设定为大于第一导电部分的厚度。

5. 发明授权

US4787346A Valve operating apparatus for an internal combustion engine 失效
公开(公告)号：US4787346A
公开(公告)日：1988-11-29
申请号：US107345
申请日：1987-10-13
申请人： Yoshio Ajiki , Atsushi Ishida
发明人： Yoshio Ajiki , Atsushi Ishida
IPC分类号： F01L13/00 , F01L1/18 , F01L1/26 , F01L1/46 , F02F1/24 , F02F1/42 , F01L1/34
CPC分类号： F01L1/26 , F01L1/185 , F01L1/267 , F01L1/462 , F02F1/4214 , F02F2001/247
摘要： Apparatus for maintaining the cam follower for operating a valve for an internal combustion engine in biased engagement against the cam includes a first spring operative to bias the cam follower under a low speed engine operating condition and a second spring series-connected to the first spring and having a spring constant greater than that of the first spring operative to bias the cam follower under a high speed engine operating condition.

6. 发明授权

US4616610A Lubricating apparatus in internal combustion engine 失效
标题翻译：内燃机润滑装置
公开(公告)号：US4616610A
公开(公告)日：1986-10-14
申请号：US716820
申请日：1985-03-27
申请人： Atsushi Ishida
发明人： Atsushi Ishida
IPC分类号： F01M1/02 , F01M1/06 , F01M1/10 , F01M11/00 , F01M11/02 , F01M11/03 , F02B75/00 , F02F7/00 , F01M1/00
CPC分类号： F01M11/02 , F01M1/10 , F02F7/0053 , F01M2001/0269 , F01M2011/007 , F02B75/005
摘要： A lubricating apparatus in an internal combustion engine of the horizontal type in which a main oil gallery for feeding oil to engine portions to be lubricated is provided substantially parallel to the engine crank shaft in the bearing cap secured to engine block for rotatably supporting the crank shaft, and an oil filter is provided on the bearing cap at a central portion in the direction of the crank shaft. The oil pump is provided on one end of the crank shaft and oil passages are formed in the bearing cap for conducting the oil from the oil pump to the oil filter and then from the oil filter to the central portion of said main gallery.
摘要翻译：在水平型内燃机中的润滑装置，其中将用于将油供给到要润滑的发动机部分的油的主油槽设置成与固定到发动机缸体上的用于可旋转地支撑曲轴的轴承盖中的发动机曲轴相平行并且在所述轴承盖上在所述曲轴的方向的中央部设置有油过滤器。油泵设置在曲轴的一端，在轴承盖中形成有油通道，用于将油从油泵导入油过滤器，然后从油过滤器向主油箱的中心部分传导。

7. 发明授权

US08826530B2 Method for manufacturing substrate with metal film 有权
标题翻译：金属膜制造衬底的方法
公开(公告)号：US08826530B2
公开(公告)日：2014-09-09
申请号：US12732635
申请日：2010-03-26
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H01K3/10 , H05K3/46 , H05K3/00 , C25D7/12 , H05K3/42 , C25D5/02 , H05K3/38
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译：一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

8. 发明授权

US08624127B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08624127B2
公开(公告)日：2014-01-07
申请号：US12952864
申请日：2010-11-23
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译：布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路，衬底和第一或第二电路，以及在层间层上的第三导电电路。层间层在层间层中具有通孔导体，并连接第三电路和第二导体。衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体。通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

9. 发明申请

US20100243305A1 SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有金属膜的基板及其制造方法
公开(公告)号：US20100243305A1
公开(公告)日：2010-09-30
申请号：US12732635
申请日：2010-03-26
申请人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/00 , C08F2/48 , B05D3/06
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译：一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

10. 发明申请

US20090103240A1 CAPACITOR ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：电容阵列及其制造方法
公开(公告)号：US20090103240A1
公开(公告)日：2009-04-23
申请号：US12249032
申请日：2008-10-10
申请人： Katsumori Nagamiya , Atsushi Ishida , Akihiro Motoki
发明人： Katsumori Nagamiya , Atsushi Ishida , Akihiro Motoki
IPC分类号： H01G4/38 , H01G7/00
CPC分类号： H01G4/012 , H01G4/228 , H01G4/38 , Y10T29/435
摘要： A capacitor array includes mutually opposed first and second internal electrodes having a first capacitance portion and a second capacitance portion, respectively, a first lead portion and a second lead portion, respectively, which are electrically connected to a first outer terminal electrode and a second outer terminal electrode, and a first protrusion portion and a second protrusion portion, respectively, which partially protrude toward the second outer terminal electrode and the first outer terminal electrode. The outer terminal electrodes have plating films directly connected to the internal electrodes. The plating film is formed by electrolytic plating. In the electrolytic plating, deposition of plating proceeds while being prevented from spreading in width directions of the individual side surfaces by electric fields generated from the protrusion portions toward the vicinities of exposure portions of the respective lead portions on the side surfaces.
摘要翻译：电容器阵列包括分别具有第一电容部分和第二电容部分的相互相对的第一和第二内部电极，分别与第一外部端子电极和第二外部电极电连接的第一引线部分和第二引线部分端子电极，以及分别朝向第二外部端子电极和第一外部端子电极部分地突出的第一突出部分和第二突出部分。外部端子电极具有直接连接到内部电极的电镀膜。镀膜通过电解电镀形成。在电解电镀中，通过从突出部向侧面的各引线部的曝光部附近的电场防止在各个侧面的宽度方向上扩散镀层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式