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    • 1. 发明授权
    • Compact high-voltage variable resistor
    • 紧凑型高压可变电阻
    • US5721526A
    • 1998-02-24
    • US683706
    • 1996-07-18
    • Kazufumi DaimonTsuyoshi OhtaKenichi Hiraki
    • Kazufumi DaimonTsuyoshi OhtaKenichi Hiraki
    • H01C10/32H01C10/30
    • H01C10/32
    • A high-voltage variable resistor capable of significantly reducing a circuit board as compared with a prior art. Terminal fitments each are arranged so as to function as a connector for forming electrical connection between a slide element slid on each of variable resistance patterns and a terminal acting as an output section. A contact point between a contact on a contact support of the terminal fitment and a plate-like member of the slide element is positioned apart from a surface of the circuit board. The terminal fitment includes a positioner, which is positioned outside the pattern in a radial direction thereof, so that the positioner intersects the pattern while being spaced therefrom.
    • 与现有技术相比,能够显着地减少电路板的高压可变电阻器。 端子配件各自布置成用作用于在滑动每个可变电阻图案的滑动元件和用作输出部分的端子之间形成电连接的连接器。 端子配件的触点支撑件上的触点与滑动元件的板状元件之间的接触点位于与电路板的表面分开的位置。 端子配件包括定位器,其定位在图案的径向方向外侧,使得定位器与图案间隔开。
    • 2. 发明授权
    • Terminal fitment for lead wire connection and high-voltage variable resistor unit with relay terminal fitment
    • 引线连接端子配件和带继电器端子配件的高压可变电阻单元
    • US06200156B1
    • 2001-03-13
    • US09449788
    • 1999-11-26
    • Kenichi HirakiTsuyoshi OhtaKazufumi Daimon
    • Kenichi HirakiTsuyoshi OhtaKazufumi Daimon
    • H01R1120
    • H01R4/26H01C13/00H01R13/6616
    • A lead wire connection terminal fitment capable of permitting a plurality of lead wires to be readily press-fitted in a single lead wire press fit groove. The terminal fitment may be in the form of a relay terminal fitment, which includes a metal plate formed with a lead wire press fit groove by machining in which lead wires are press-fitted. A pair of inner surfaces of the metal plate defining the lead wire press fit groove therebetween are formed thereon with a plurality of projections and recesses engaged with an outer periphery of lead wires. The projections biting into the lead wires are so arranged that a space defined between the projections opposite to each other is reduced in width at a position thereof spaced by a distance in a depth direction of the lead wire press fit groove, resulting in being divided into a first space portion increased in width and a second space portion decreased in width.
    • 一种能够使多根引线容易地压入单个引线压配合槽的引线连接端子配件。 端子配件可以是中继端子配件的形式,其包括通过加工而形成有引线压配合槽的金属板,其中压配有引线。 金属板的一对内表面在其间形成有引线压配合槽,其上形成有与引线的外周接合的多个突起和凹部。 引入引线的突起被布置成使得彼此相对的突起之间限定的空间在与引线压配合槽的深度方向上间隔距离的位置处宽度减小,从而被分成 宽度增加的第一空间部分和宽度减小的第二空间部分。
    • 4. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20070145416A1
    • 2007-06-28
    • US11616603
    • 2006-12-27
    • Tsuyoshi OhtaBungo Tanaka
    • Tsuyoshi OhtaBungo Tanaka
    • H01L29/76
    • H01L29/7813H01L29/0649H01L29/0696H01L29/4236H01L29/42372H01L29/4925H01L29/4958H01L29/7397
    • A semiconductor device comprises on a surface of a first semiconductor layer of the first conduction type a second semiconductor layer of the first conduction type. A semiconductor base layer of the second conduction type is formed on the second semiconductor layer, and a semiconductor diffusion layer of the first conduction type is formed on a surface of the semiconductor base layer. A trench is formed from the surface of the semiconductor diffusion layer to a depth reaching the second semiconductor layer. A gate electrode is formed of a conductor film buried in the trench with a gate insulator interposed therebetween. The conductor film includes a first conductor film formed along the gate electrode to have a recess and a second conductor film formed to fill the recess.
    • 半导体器件包括在第一导电类型的第一半导体层的表面上的第一导电类型的第二半导体层。 第二导电类型的半导体基层形成在第二半导体层上,并且在半导体基底层的表面上形成第一导电类型的半导体扩散层。 从半导体扩散层的表面到到达第二半导体层的深度形成沟槽。 栅电极由埋在沟槽中的导体膜形成,栅极绝缘体插入其间。 导体膜包括沿着栅电极形成以具有凹部的第一导体膜和形成为填充凹部的第二导体膜。
    • 5. 发明授权
    • Negatively chargeable electrophotographic photoreceptor
    • 可负电荷的电子照相感光体
    • US5556729A
    • 1996-09-17
    • US464466
    • 1995-06-05
    • Yuzuru FukudaTsuyoshi OhtaMasato OnoTaketoshi HigashiShigeru Yagi
    • Yuzuru FukudaTsuyoshi OhtaMasato OnoTaketoshi HigashiShigeru Yagi
    • G03G5/08G03G5/082G03G5/147
    • G03G5/08235G03G5/08278
    • An electrophotographic photoreceptor comprising: an electrically conductive substrate, a charge injection blocking layer formed on said electrically conductive substrate, a photoconductive layer comprising a single layer formed on said charge injection blocking layer, said photoconductive layer comprising amorphous silicon containing boron, a positive hole capturing layer formed on said photoconductive layer, said positive hole capturing layer being selected from the group comprising amorphous silicon containing less than 50 ppm boron and amorphous silicon being substantially composed of hydrogen and silicon atoms, and a surface layer formed on said positive hole capturing layer. The boron concentration contained in said photoconductive layer is 0.01-1000 ppm. The surface layer is formed by amorphous silicon nitride, amorphous silicon oxide, amorphous silicon carbide or amorphous carbon as a main body. The charge injection blocking layer has amorphous silicon as a main body and contains a group V element. The electrophotographic photoreceptor is excellent in the dark attenuation, the sensitivity and electrification capacity and does not cause image flow or image fogging on copied images obtained by using the photoreceptor.
    • 一种电子照相感光体,其特征在于,具有:导电性基板,形成在所述导电性基板上的电荷注入阻挡层,含有形成于所述电荷注入阻挡层上的单层的光电导层,所述光电导层含有含硼的非晶硅, 所述空穴捕获层选自含有小于50ppm硼的非晶硅和基本上由氢和硅原子组成的非晶硅,以及形成在所述正空穴捕获层上的表面层。 所述光电导层中含有的硼浓度为0.01〜1000ppm。 表面层由非晶氮化硅,非晶氧化硅,非晶碳化硅或无定形碳作为主体形成。 电荷注入阻挡层以非晶硅为主体,含有V族元素。 电子照相感光体在黑暗衰减,灵敏度和带电能力方面优异,并且不会对通过使用感光体获得的复印图像上的图像流动或图像起雾。
    • 10. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08629526B2
    • 2014-01-14
    • US13233941
    • 2011-09-15
    • Tsuyoshi OhtaMasatoshi AraiMiwako Suzuki
    • Tsuyoshi OhtaMasatoshi AraiMiwako Suzuki
    • H01L29/47
    • H01L29/872H01L29/0619H01L29/36H01L29/402H01L29/66136H01L29/66143H01L29/861
    • According to one embodiment, a semiconductor device includes a first semiconductor layer of a first conductivity type, a plurality of second semiconductor regions of a second conductivity type, a third semiconductor region of the second conductivity type and a first electrode. The second regions are provided separately on a first major surface side of the first layer. The third region is provided on the first major surface side of the first layer so as to surround the second regions. The first electrode is provided on the first layer and the second regions. The first layer has a first portion and a second portion. The second portion has a lower resistivity than the first portion. The second portion is provided between the second regions and between the first portion and the first major surface and is provided outside the third region and between the first portion and the first major surface.
    • 根据一个实施例,半导体器件包括第一导电类型的第一半导体层,第二导电类型的多个第二半导体区域,第二导电类型的第三半导体区域和第一电极。 第二区域分别设置在第一层的第一主表面侧。 第三区域设置在第一层的第一主表面侧,以围绕第二区域。 第一电极设置在第一层和第二区域上。 第一层具有第一部分和第二部分。 第二部分具有比第一部分更低的电阻率。 第二部分设置在第二区域之间以及第一部分与第一主表面之间,并且设置在第三区域的外部以及第一部分与第一主表面之间。