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    • 1. 发明授权
    • Alignment film forming apparatus and method
    • 定向膜形成装置和方法
    • US09034151B2
    • 2015-05-19
    • US12174897
    • 2008-07-17
    • Shoichi DoiTatsuya Nishiwaki
    • Shoichi DoiTatsuya Nishiwaki
    • C23C14/00C23C14/32C25B9/00C25B11/00C25B13/00C23C14/34C23C14/06H01J37/34C23C14/04C23C14/46G02F1/1337C23C14/22
    • C23C14/221C23C14/042C23C14/0605C23C14/225C23C14/3442C23C14/46G02F1/133734G02F1/13378H01J37/3411H01J37/3426H01J2237/3146
    • An alignment film forming apparatus and a method are provided to form an alignment film for a liquid crystal in a single process of simultaneously executing a film deposition process of ion beam sputtering and an alignment process. The method greatly restricts the size of a substrate. An alignment film forming apparatus includes a target disposed on a top surface side of a substrate and having a sputtering surface defining a sharp angle to the top surface of the substrate, a transfer table that transfers the substrate in a predetermined direction, and an ion source disposed on the top surface side of the substrate in such a way that an ion beam is irradiated on the sputtering surface of the target. An ion beam reflected at the sputtering surface is irradiated on a sputtering film formed on the substrate. The apparatus includes a mask disposed in such a way as to cover a part of the top surface of the substrate on an upstream side of a position where the sputtering film is formed, and a temperature regulator which regulates the temperature of the target.
    • 提供了一种取向膜形成装置和方法,以在同时执行离子束溅射的成膜工艺和对准工艺的单个工艺中形成用于液晶的取向膜。 该方法大大限制了基板的尺寸。 取向膜形成装置包括:设置在基板的顶面侧的靶,具有与基板的上表面形成锐角的溅射面;将基板沿预定方向转印的转印台;离子源 设置在基板的顶面侧,使得离子束照射在靶的溅射表面上。 在溅射表面反射的离子束照射在形成在基板上的溅射膜上。 该装置包括掩模,其设置成覆盖形成溅射膜的位置的上游侧的基板顶表面的一部分,以及调节靶的温度的温度调节器。
    • 3. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120061753A1
    • 2012-03-15
    • US13053069
    • 2011-03-21
    • Tatsuya NISHIWAKI
    • Tatsuya NISHIWAKI
    • H01L29/78
    • H01L29/7813H01L29/0696H01L29/407H01L29/41741H01L29/41766H01L29/4238H01L29/66734
    • A semiconductor device includes: a drain layer; a drift layer provided on the drain layer; a base region provided on the drift layer; a source region selectively provided on a surface of the base region; a first gate; a field-plate; a second gate; a drain electrode; and a source electrode. The first gate electrode is provided in each of a plurality of first trenches via a first insulating film. The first trenches penetrate from a surface of the source region through the base region and contact the drift layer. The field-plate electrode is provided in the first trench under the first gate electrode via a second insulating film. The second gate electrode is provided in a second trench via a third insulating film. The second trench penetrates from the surface of the source region through the base region and contacts the drift layer between the first trenches.
    • 半导体器件包括:漏极层; 设置在漏极层上的漂移层; 设置在漂移层上的基极区域; 选择性地设置在所述基底区域的表面上的源极区域; 第一门 现场板; 第二门 漏电极; 和源电极。 第一栅电极经由第一绝缘膜设置在多个第一沟槽中的每一个中。 第一沟槽从源极区域的表面穿过基极区域并接触漂移层。 场板电极通过第二绝缘膜设置在第一栅电极下的第一沟槽中。 第二栅电极经由第三绝缘膜设置在第二沟槽中。 第二沟槽从源极区域的表面穿过基极区域并与第一沟槽之间的漂移层接触。
    • 6. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08629505B2
    • 2014-01-14
    • US13053069
    • 2011-03-21
    • Tatsuya Nishiwaki
    • Tatsuya Nishiwaki
    • H01L21/76
    • H01L29/7813H01L29/0696H01L29/407H01L29/41741H01L29/41766H01L29/4238H01L29/66734
    • A semiconductor device includes: a drain layer; a drift layer provided on the drain layer; a base region provided on the drift layer; a source region selectively provided on a surface of the base region; a first gate; a field-plate; a second gate; a drain electrode; and a source electrode. The first gate electrode is provided in each of a plurality of first trenches via a first insulating film. The first trenches penetrate from a surface of the source region through the base region and contact the drift layer. The field-plate electrode is provided in the first trench under the first gate electrode via a second insulating film. The second gate electrode is provided in a second trench via a third insulating film. The second trench penetrates from the surface of the source region through the base region and contacts the drift layer between the first trenches.
    • 半导体器件包括:漏极层; 设置在漏极层上的漂移层; 设置在漂移层上的基极区域; 选择性地设置在所述基底区域的表面上的源极区域; 第一门 现场板; 第二门 漏电极; 和源电极。 第一栅电极经由第一绝缘膜设置在多个第一沟槽中的每一个中。 第一沟槽从源极区域的表面穿过基极区域并接触漂移层。 场板电极通过第二绝缘膜设置在第一栅电极下的第一沟槽中。 第二栅电极经由第三绝缘膜设置在第二沟槽中。 第二沟槽从源极区域的表面穿过基极区域并与第一沟槽之间的漂移层接触。