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1. 发明授权

US07387741B2 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 有权
标题翻译：通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备
公开(公告)号：US07387741B2
公开(公告)日：2008-06-17
申请号：US10397429
申请日：2003-03-27
申请人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
发明人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H05K3/068 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H05K3/0085 , H01L2924/00
摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed. Further, the integrally bonded member 10 is pressed with an appropriate pressure from a base plate 11 side so that a boundary surface between a portion 23 surrounding the window portion in the masking member and an exposed surface 16 of the ceramic substrate which is exposed in a metal-ceramic bonded member 14 has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution 33 for wet treatment is injected from an injection pipe 35 to be in contact with the circuit pattern forming metal plate 13.
摘要翻译：本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。在陶瓷基板12的一部分上接合有电路图案形成用金属板13，从而在整体接合部件10中露出陶瓷基板12的外周缘部，将整体接合部件10设置在处理装置同时被具有窗口部分22的掩模构件20覆盖，整体接合构件10的电路图案形成金属板13从该窗口部分22露出。此外，整体接合部件10以适当的压力从基板11侧按压，使得围绕掩模部件中的窗口部分的部分23与露出在掩模部件中的陶瓷基板的暴露表面16之间的边界面金属陶瓷接合部件14具有不允许液体通过的状态。之后，从注入管35注入湿润处理用处理液33，与电路图案形成金属板13接触。

2. 发明申请

US20080230515A1 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 审中-公开
标题翻译：通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备
公开(公告)号：US20080230515A1
公开(公告)日：2008-09-25
申请号：US12153431
申请日：2008-05-19
申请人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
发明人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
IPC分类号： C23F1/02
CPC分类号： H05K3/068 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H05K3/0085 , H01L2924/00
摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.
摘要翻译：本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。在电路图案形成用金属板接合在陶瓷基板的一部分上，以将整体接合部件露出陶瓷基板的外周缘部之后，将整体接合部件设置在处理装置上，同时被覆盖掩模构件具有窗口部分，整体结合构件的电路图案形成金属板从该窗口部分露出。此外，整体结合部件从基板侧以适当的压力被按压，使得掩蔽部件中的窗部分周围的部分与陶瓷基板的暴露在金属 - 陶瓷结合的表面之间的边界面构件具有不允许液体通过的状态。此后，从喷射管注入用于湿处理的处理液，以与电路图形形成金属板接触。

3. 发明授权

US06912130B2 Combined member of aluminum-ceramics 有权
标题翻译：铝陶瓷组合成员
公开(公告)号：US06912130B2
公开(公告)日：2005-06-28
申请号：US10669550
申请日：2003-09-24
申请人： Hideyo Osanai , Makoto Namioka , Ken Iyoda
发明人： Hideyo Osanai , Makoto Namioka , Ken Iyoda
IPC分类号： B22D19/00 , C04B37/02 , H01L23/36 , H01L23/373 , H01L23/40 , H01L23/473 , H05K1/02 , H05K7/20
CPC分类号： H01L23/473 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.
摘要翻译：本发明提供铝 - 陶瓷的组合构件。组合构件包括陶瓷板，形成在陶瓷板的一个表面上的保持电子部件的导电构件和直接粘结在陶瓷板的另一个表面上的铝或铝合金的水冷却套。

4. 发明授权

US07256353B2 Metal/ceramic bonding substrate and method for producing same 有权
标题翻译：金属/陶瓷接合基材及其制造方法
公开(公告)号：US07256353B2
公开(公告)日：2007-08-14
申请号：US10747837
申请日：2003-12-29
申请人： Hideyo Osanai , Susumu Ibaraki , Ken Iyoda , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaraki , Ken Iyoda , Makoto Namioka
IPC分类号： H05K1/00
CPC分类号： H01L23/13 , H01L23/3735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3511 , H05K1/0271 , H05K1/0306 , H05K3/0058 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14, a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.
摘要翻译：提供了一种金属/陶瓷接合基板，其能够防止其逆向大的翘曲，从而即使被加热用于焊接也是凹的。在金属/陶瓷接合基板中，金属电路板12接合在陶瓷基板10的一侧，并且散热板（金属基板）14接合到其另一侧。在散热板14上，通过喷丸硬化形成加固硬化层16。在金属/陶瓷接合基板的金属电路板12上焊接半导体芯片（Si芯片）18（焊料层20）。然后，通过预定的处理产生功率模块。在功率模块的相反（加工硬化层16的侧面）上，散热片26经由导热油脂24通过螺钉22等安装。

5. 发明授权

US06737173B2 Pretreating method before plating and composites having a plated coat 失效
标题翻译：电镀前的预处理方法和镀层的复合材料
公开(公告)号：US06737173B2
公开(公告)日：2004-05-18
申请号：US10400817
申请日：2003-03-27
申请人： Ken Iyoda , Susumu Shimada
发明人： Ken Iyoda , Susumu Shimada
IPC分类号： C23C1832
CPC分类号： H01L21/4871 , C23C18/1893 , H01L23/3735 , H01L2924/0002 , Y10T428/12493 , Y10T428/12528 , Y10T428/12736 , Y10T428/1275 , H01L2924/00
摘要： The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.
摘要翻译：将由金属和非金属材料制成的复合材料镀覆的表面进行脱脂，然后进行清洗并浸入用碳酸氢盐调节的钯活化剂，pH为2〜5。在这种预处理过程之后，复合材料镀有金属，并且变得最适合用作混合IC上的散热材料，因为它可以被有效地焊接并具有更好的耐腐蚀性。

6. 发明申请

US20050175773A1 Metal/ceramic bonding member and method for producing same 审中-公开
标题翻译：金属/陶瓷结合部件及其制造方法
公开(公告)号：US20050175773A1
公开(公告)日：2005-08-11
申请号：US11046614
申请日：2005-01-28
申请人： Nobuyoshi Tsukaguchi , Ken Iyoda
发明人： Nobuyoshi Tsukaguchi , Ken Iyoda
IPC分类号： B23K1/19 , B23K1/20 , C23C18/16 , C23C18/18 , C23C18/32 , H01L21/48 , H01L23/12 , H01L23/373 , H05K1/03 , H05K1/09 , H05K3/24 , B05D3/02
CPC分类号： H01L23/3735 , C23C18/1608 , C23C18/1696 , C23C18/1831 , C23C18/32 , H01L21/4846 , H01L2924/0002 , H05K1/0306 , H05K1/09 , H05K3/24 , H05K3/243 , H05K2201/0355 , H05K2203/072 , H05K2203/0793 , H01L2924/00
摘要： In a method for producing a metal/ceramic bonding member wherein an electroless nickel alloy plating layer 18 is formed on a predetermined portion of the surface of an aluminum plate 12 which is bonded to at least one side of a ceramic substrate 10 and which is formed so as to have a predetermined circuit pattern, an alkali peeling type resist 16 having a predetermined shape is applied on the surface of the aluminum plate 12 before forming the electroless nickel alloy plating layer 18, and then, a portion of the surface of the aluminum plate 12, on which the resist 16 is not applied, is activated with an acidic zinc immersion solution containing a fluoride or silicofluoride. Then, after the electroless nickel alloy plating layer 18 is formed, the resist 16 is removed with an alkali.
摘要翻译：在金属/陶瓷接合部件的制造方法中，在铝板12的与陶瓷基板10的至少一侧接合并形成的金属/陶瓷接合部件的表面的规定部分上形成有化学镀镍合金镀层18，为了具有预定的电路图案，在形成无电镀镍合金镀层18之前，在铝板12的表面上施加具有预定形状的碱剥离型抗蚀剂16，然后将铝的一部分表面未施加抗蚀剂16的板12用含有氟化物或氟化硅的酸性锌浸渍溶液活化。然后，在形成化学镀镍合金镀层18之后，用碱除去抗蚀剂16。

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