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1. 发明申请

US20080230515A1 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 审中-公开
标题翻译：通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备
公开(公告)号：US20080230515A1
公开(公告)日：2008-09-25
申请号：US12153431
申请日：2008-05-19
申请人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
发明人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
IPC分类号： C23F1/02
CPC分类号： H05K3/068 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H05K3/0085 , H01L2924/00
摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.
摘要翻译：本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。在电路图案形成用金属板接合在陶瓷基板的一部分上，以将整体接合部件露出陶瓷基板的外周缘部之后，将整体接合部件设置在处理装置上，同时被覆盖掩模构件具有窗口部分，整体结合构件的电路图案形成金属板从该窗口部分露出。此外，整体结合部件从基板侧以适当的压力被按压，使得掩蔽部件中的窗部分周围的部分与陶瓷基板的暴露在金属 - 陶瓷结合的表面之间的边界面构件具有不允许液体通过的状态。此后，从喷射管注入用于湿处理的处理液，以与电路图形形成金属板接触。

2. 发明授权

US06912130B2 Combined member of aluminum-ceramics 有权
标题翻译：铝陶瓷组合成员
公开(公告)号：US06912130B2
公开(公告)日：2005-06-28
申请号：US10669550
申请日：2003-09-24
申请人： Hideyo Osanai , Makoto Namioka , Ken Iyoda
发明人： Hideyo Osanai , Makoto Namioka , Ken Iyoda
IPC分类号： B22D19/00 , C04B37/02 , H01L23/36 , H01L23/373 , H01L23/40 , H01L23/473 , H05K1/02 , H05K7/20
CPC分类号： H01L23/473 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a combined member of aluminum-ceramics. The combined member comprises a ceramic board, a conductive member holding electronic parts thereon, formed on one surface of the ceramic board, and a water cooling jacket of aluminum or aluminum alloy bonded directly on the other surface of the ceramic board.
摘要翻译：本发明提供铝 - 陶瓷的组合构件。组合构件包括陶瓷板，形成在陶瓷板的一个表面上的保持电子部件的导电构件和直接粘结在陶瓷板的另一个表面上的铝或铝合金的水冷却套。

3. 发明授权

US07256353B2 Metal/ceramic bonding substrate and method for producing same 有权
标题翻译：金属/陶瓷接合基材及其制造方法
公开(公告)号：US07256353B2
公开(公告)日：2007-08-14
申请号：US10747837
申请日：2003-12-29
申请人： Hideyo Osanai , Susumu Ibaraki , Ken Iyoda , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaraki , Ken Iyoda , Makoto Namioka
IPC分类号： H05K1/00
CPC分类号： H01L23/13 , H01L23/3735 , H01L2924/0002 , H01L2924/09701 , H01L2924/3511 , H05K1/0271 , H05K1/0306 , H05K3/0058 , Y10T428/12007 , Y10T428/12493 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side of a ceramic substrate 10, and a heat sink plate (metal base plate) 14 is bonded to the other side thereof. On the heat sink plate 14, a work-hardened layer 16 is formed by shot peening. On the metal circuit plate 12 of the metal/ceramic bonding substrate, semiconductor chips (Si chips) 18 are soldered (solder layer 20). Then, a power module is produced by a predetermined process. On the reverse (the side of the work-hardened layer 16) of the power module, a radiating fin 26 is mounted via a thermal grease 24 by means of screws 22 or the like.
摘要翻译：提供了一种金属/陶瓷接合基板，其能够防止其逆向大的翘曲，从而即使被加热用于焊接也是凹的。在金属/陶瓷接合基板中，金属电路板12接合在陶瓷基板10的一侧，并且散热板（金属基板）14接合到其另一侧。在散热板14上，通过喷丸硬化形成加固硬化层16。在金属/陶瓷接合基板的金属电路板12上焊接半导体芯片（Si芯片）18（焊料层20）。然后，通过预定的处理产生功率模块。在功率模块的相反（加工硬化层16的侧面）上，散热片26经由导热油脂24通过螺钉22等安装。

4. 发明授权

US07387741B2 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 有权
标题翻译：通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备
公开(公告)号：US07387741B2
公开(公告)日：2008-06-17
申请号：US10397429
申请日：2003-03-27
申请人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
发明人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： H05K3/068 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H05K3/0085 , H01L2924/00
摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed. Further, the integrally bonded member 10 is pressed with an appropriate pressure from a base plate 11 side so that a boundary surface between a portion 23 surrounding the window portion in the masking member and an exposed surface 16 of the ceramic substrate which is exposed in a metal-ceramic bonded member 14 has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution 33 for wet treatment is injected from an injection pipe 35 to be in contact with the circuit pattern forming metal plate 13.
摘要翻译：本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。在陶瓷基板12的一部分上接合有电路图案形成用金属板13，从而在整体接合部件10中露出陶瓷基板12的外周缘部，将整体接合部件10设置在处理装置同时被具有窗口部分22的掩模构件20覆盖，整体接合构件10的电路图案形成金属板13从该窗口部分22露出。此外，整体接合部件10以适当的压力从基板11侧按压，使得围绕掩模部件中的窗口部分的部分23与露出在掩模部件中的陶瓷基板的暴露表面16之间的边界面金属陶瓷接合部件14具有不允许液体通过的状态。之后，从注入管35注入湿润处理用处理液33，与电路图案形成金属板13接触。

5. 发明授权

US07340828B2 Method for producing metal/ceramic bonding circuit board 有权
标题翻译：金属/陶瓷接合电路板的制造方法
公开(公告)号：US07340828B2
公开(公告)日：2008-03-11
申请号：US10948695
申请日：2004-09-22
申请人： Hideyo Osanai , Makoto Namioka , Susumu Ibaraki
发明人： Hideyo Osanai , Makoto Namioka , Susumu Ibaraki
IPC分类号： H05K3/02
CPC分类号： H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/061 , H05K3/101 , H05K2203/0108 , H05K2203/128 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
摘要： There is provided a method for producing a metal/ceramic bonding circuit board, which can form a fine pattern even if a circuit forming metal plate is thick and which can shorten the time required to carry out etching, when a molten metal is caused to contact to a ceramic substrate to be cooled and solidified to bond the circuit forming metal plate to the ceramic substrate to etch the circuit forming metal plate to form a metal circuit plate having a desired circuit pattern. A molten metal is caused to contact both sides of a ceramic substrate 10 to be cooled and solidified. Thus, a circuit forming metal plate 12 having a shape similar to a desired circuit pattern is bonded to one side of the ceramic substrate 10, and a metal base plate 14 is bonded to the other side thereof.
摘要翻译：提供了一种用于制造金属/陶瓷接合电路板的方法，即使电路形成金属板厚，并且当熔融金属接触时可以缩短进行蚀刻所需的时间，其可以形成精细图案到要冷却和固化的陶瓷基板，以将电路形成金属板结合到陶瓷基板上，以蚀刻电路形成金属板，以形成具有所需电路图案的金属电路板。使熔融金属接触待冷却和固化的陶瓷基板10的两侧。因此，具有与期望的电路图案相似的形状的电路形成金属板12接合到陶瓷基板10的一侧，并且金属基板14与另一侧接合。

6. 发明授权

US07122243B2 Metal/ceramic bonding substrate and method for producing same 有权
标题翻译：金属/陶瓷接合基材及其制造方法
公开(公告)号：US07122243B2
公开(公告)日：2006-10-17
申请号：US10969360
申请日：2004-10-19
申请人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
发明人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
IPC分类号： B32B3/00 , H01L23/10 , H01L23/34
CPC分类号： H01L23/142 , H01L23/13 , H01L23/3735 , H01L2924/0002 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
摘要翻译：提供了具有提高热循环可靠性的金属/陶瓷接合基板及其制造方法。在其中将电路形成金属板14接合到陶瓷基板12的一侧的金属/陶瓷接合基板10和散热金属基板16的另一侧接合，至少部分陶瓷基板12被嵌入在金属基板16中。陶瓷基板12被布置成基本上平行于金属基件16。

7. 发明申请

US20070017652A1 Apparatus, mold, and method for manufacturing metal-ceramic composite member 有权
标题翻译：用于制造金属 - 陶瓷复合材料的装置，模具和方法
公开(公告)号：US20070017652A1
公开(公告)日：2007-01-25
申请号：US11528425
申请日：2006-09-28
申请人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
IPC分类号： B22D19/00 , B22D11/00
CPC分类号： C04B37/026 , B22D19/00 , B32B2311/12 , B32B2311/24 , C04B2237/122 , C04B2237/402 , C04B2237/407 , H05K1/0306 , H05K3/101 , H05K2203/128 , Y10T428/24917
摘要： To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.
摘要翻译：提供一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件和制造方法。制造金属 - 陶瓷复合构件的制造装置，该装置包括：多个处理区域，即气氛置换/加热部件11，熔融金属推出部件21和冷却部件31; 以及用于允许模具通过这些多个处理区域的引导件48，其中放置有陶瓷构件86的模具60被连续地插入到设置在该引导件48中的模具入口43中，以实质上穿过引导件48处于屏蔽状态在熔融金属推出部21中注入熔融金属53，在冷却部31中使熔融金属53冷却固化，使金属与陶瓷结合，由此制造金属 - 陶瓷复合部件。

8. 发明授权

US06997233B2 Mold and method for manufacturing metal-ceramic composite member 有权
标题翻译：金属陶瓷复合材料制造用模具及其制造方法
公开(公告)号：US06997233B2
公开(公告)日：2006-02-14
申请号：US10668342
申请日：2003-09-24
申请人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
IPC分类号： B22D19/00 , B22D19/02 , B22D19/04 , B22D10/08
CPC分类号： B22D19/00
摘要： To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite member 3 according to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substrates 30 are placed in a mold main body 11 constituting a mold 1, with a ceramic substrate 31 side thereof facing upward, an atmosphere inside and outside the mold 1 is replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metal 42 is poured and filled in a first joining portion 14 that is formed by the molten metal main body 11 and an upper container 13 and that has a shrinkage cavity inducing portion 16 on a metal material holding portion side and a shrinkage cavity inducing portion 18 on an air vent side, and the molten metal 42 is cooled.
摘要翻译：为了提供能够制造金属陶瓷复合构件的模具，其中预定数量的陶瓷构件接合到大的接合金属上，大的接合金属在其表面上没有膨胀和收缩空腔，并且尺寸精度高。制造本实施方式的金属 - 陶瓷复合构件3，将规定数量的金属陶瓷接合基板30配置在构成模具1的模具主体11内，陶瓷基板31侧面朝上模具1内部和外部的气氛被来自大气的惰性气体如氮气置换，熔融金属42被注入并填充在由熔融金属主体11形成的第一接合部分14和上部容器13，并且在金属材料保持部侧具有收缩空腔诱导部分16，在通风口侧具有收缩空腔诱导部分18，并且熔融金属42被冷却。

9. 发明申请

US20050084704A1 Metal/ceramic bonding substrate and method for producing same 有权
标题翻译：金属/陶瓷接合基材及其制造方法
公开(公告)号：US20050084704A1
公开(公告)日：2005-04-21
申请号：US10969360
申请日：2004-10-19
申请人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
发明人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
IPC分类号： H01L23/12 , H01L23/13 , H01L23/14 , H01L23/373 , B32B15/04
CPC分类号： H01L23/142 , H01L23/13 , H01L23/3735 , H01L2924/0002 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and amethod for producing the same. Inametal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
摘要翻译：提供了具有提高的热循环可靠性的金属/陶瓷接合基板及其制造方法。将陶瓷基板12的一侧的电路形成用金属板14与散热用金属基板16接合的其他陶瓷接合基板10的另一侧，至少部分陶瓷基板12嵌入金属基板16.陶瓷基板12大致平行于金属基体16配置。

10. 发明授权

US07073703B2 Aluminum/ceramic bonding substrate and method for producing same 失效
标题翻译：铝/陶瓷接合基板及其制造方法
公开(公告)号：US07073703B2
公开(公告)日：2006-07-11
申请号：US10673993
申请日：2003-09-29
申请人： Takayuki Takahashi , Hideyo Osanai , Makoto Namioka
发明人： Takayuki Takahashi , Hideyo Osanai , Makoto Namioka
IPC分类号： B23K1/19 , B23K35/24 , B23K31/02
CPC分类号： B32B15/20 , B32B15/04 , B32B18/00 , B32B2309/02 , B32B2309/022 , B32B2309/62 , B32B2311/24 , B32B2315/02 , C04B37/021 , C04B37/026 , C04B2235/658 , C04B2235/6581 , C04B2235/72 , C04B2235/96 , C04B2237/121 , C04B2237/128 , C04B2237/32 , C04B2237/343 , C04B2237/366 , C04B2237/402 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： An aluminum plate 12 having a purity of 99.5% or more, preferably 99.9% or more, is caused to contact at least one side of a ceramic substrate 10 of aluminum nitride or alumina to be heated at a temperature of 620 to 650° C. in an inert gas to bond the aluminum plate 12 directly to the ceramic substrate 10.
摘要翻译：使纯度为99.5％以上，优选为99.9％以上的铝板12与620〜650℃的加热氮化铝或氧化铝的陶瓷基板10的至少一面接触。在惰性气体中将铝板12直接接合到陶瓷基板10上。

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