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1. 发明授权

US06423977B1 Pattern size evaluation apparatus 失效
标题翻译：图案尺寸评估装置
公开(公告)号：US06423977B1
公开(公告)日：2002-07-23
申请号：US09030510
申请日：1998-02-25
申请人： Kei Hayasaki , Shinichi Ito , Kenji Kawano , Soichi Inoue , Katsuya Okumura
发明人： Kei Hayasaki , Shinichi Ito , Kenji Kawano , Soichi Inoue , Katsuya Okumura
IPC分类号： G01N2186
CPC分类号： G01N21/956
摘要： A pattern size evaluation apparatus comprising an illumination optical system for projecting parallel light rays of a predetermined wavelength on a monitoring area formed on an object, the monitoring area being formed at a position different from a device pattern formed on the object, a light intensity detection optical system for detecting diffracted light from the monitoring area, and a device pattern size evaluation section for evaluating a size of the device pattern based on an intensity of diffracted light from the monitoring area.
摘要翻译：一种图案尺寸评估装置，包括用于在形成在物体上的监视区域上投射预定波长的平行光线的照明光学系统，所述监视区域形成在与形成在物体上的装置图案不同的位置，光强度检测用于检测来自监视区域的衍射光的光学系统，以及用于基于来自监视区域的衍射光的强度来评估装置图案的尺寸的装置图案尺寸评估部。

2. 发明授权

US07018932B2 Method for manufacturing a semiconductor device and apparatus for manufacturing a semiconductor device 失效
标题翻译：半导体装置的制造方法以及半导体装置的制造装置
公开(公告)号：US07018932B2
公开(公告)日：2006-03-28
申请号：US10377597
申请日：2003-03-04
申请人： Shinichi Ito , Tatsuhiko Higashiki , Katsuya Okumura , Kenji Kawano , Soichi Inoue
发明人： Shinichi Ito , Tatsuhiko Higashiki , Katsuya Okumura , Kenji Kawano , Soichi Inoue
IPC分类号： H01L21/027 , G03F9/00
CPC分类号： G03F7/70625 , G03F7/70633 , G03F7/70641 , G03F7/70675 , H01J2237/30438
摘要： A method for manufacturing a semiconductor device including, forming a photosensitive-film on a substrate, carrying the substrate on which the photosensitive-film is formed, to an exposure device provided with a mask in which an on-mask-inspection-mark and an on-mask-device-pattern are formed, selectively exposing the photosensitive-film to light to transfer the on-mask-inspection-mark to the photosensitive-film to form a latent-image of the inspection-mark on the photosensitive-film, heating at least that area of the photosensitive-film in which the latent-image of the inspection-mark is formed, measuring the inspection-mark, changing set-values for the exposure device used for the selective exposure, on the basis of result of the measurement so that exposure conditions conform to the set-values, exposing the photosensitive-film on the basis of the changed set-values to transfer the on-mask-device-pattern to the photosensitive-film to form a latent image of the device-pattern on the photosensitive-film, heating an entire surface of the photosensitive-film, and developing the photosensitive-film.
摘要翻译：一种半导体器件的制造方法，其特征在于，在将基板上形成有感光膜的基板上形成感光膜的制造方法，设置在具有掩模检查标记和掩模检查标记的掩模的曝光装置形成掩模装置图案，选择性地将感光膜曝光以将掩模检查标记转印到感光膜上，以在感光膜上形成检查标记的潜像，至少加热其中形成有检查标记的潜像的感光膜的面积，测量检查标记，改变用于选择性曝光的曝光装置的设定值，基于所述测量使得曝光条件符合设定值，基于改变的设定值曝光感光膜以将掩模设备图案转印到感光膜上以形成该设备的潜像 p图案在p 感光膜，加热感光膜的整个表面，并显影感光膜。

3. 发明申请

US20060102614A1 Apparatus for processing substrate and method of processing the same 失效
公开(公告)号：US20060102614A1
公开(公告)日：2006-05-18
申请号：US11304549
申请日：2005-12-16
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： H05B3/68
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.

4. 发明授权

US06441351B2 Heating device, method for evaluating heating device and pattern forming method 失效
标题翻译：加热装置，加热装置的评价方法和图案形成方法
公开(公告)号：US06441351B2
公开(公告)日：2002-08-27
申请号：US09734924
申请日：2000-12-13
申请人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
发明人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
IPC分类号： H05B102
CPC分类号： H01L21/67115 , G03F7/168 , G03F7/38
摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.
摘要翻译：用于在曝光前后施加抗蚀剂的晶片上进行热处理的加热装置包括用于加热放置在加热板上的晶片的加热板，用于在晶片上照射光以检测反射的强度的光强度检测装置来自晶片上的抗蚀剂的光，以及控制部分，用于根据检测到的反射光强度控制由加热板进行的加热，使得施加到多个晶片的加热量变得恒定。因此，可以将晶片的加热量控制为恒定，并且可以减小抗蚀剂图案的尺寸变化。

5. 发明授权

US07662546B2 Apparatus for processing substrate and method of processing the same 失效
标题翻译：基板处理装置及其处理方法
公开(公告)号：US07662546B2
公开(公告)日：2010-02-16
申请号：US11304549
申请日：2005-12-16
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： H05B3/68
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.
摘要翻译：用涂膜处理的基板的加热装置具有内部空间的室，在内部空间中加热被处理基板的加热板和分隔构件。加热板具有支撑表面，该支撑表面支撑在腔室内待处理的基底。分隔构件布置在腔室中以面向支撑表面。分隔构件将内部空间分隔成第一和第二空间，并且具有允许第一和第二空间彼此连通的多个孔。加热板的支撑表面设置在第一空间中。形成空气流的气流形成机构设置在第二空间中。该机理将从光致抗蚀剂膜蒸发的物质排出。

6. 发明授权

US06191397B1 Heating device, method for evaluating heating device and pattern forming method 失效
标题翻译：加热装置，加热装置的评价方法和图案形成方法
公开(公告)号：US06191397B1
公开(公告)日：2001-02-20
申请号：US09345749
申请日：1999-07-01
申请人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
发明人： Kei Hayasaki , Shinichi Ito , Kenji Kawano
IPC分类号： H01L21205
CPC分类号： H01L21/67115 , G03F7/168 , G03F7/38
摘要： A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.
摘要翻译：用于在曝光前后施加抗蚀剂的晶片上进行热处理的加热装置包括用于加热放置在加热板上的晶片的加热板，用于在晶片上照射光以检测反射的强度的光强度检测装置来自晶片上的抗蚀剂的光，以及控制部分，用于根据检测到的反射光强度控制由加热板进行的加热，使得施加到多个晶片的加热量变得恒定。因此，可以将晶片的加热量控制为恒定，并且可以减小抗蚀剂图案的尺寸变化。

7. 发明授权

US07364839B2 Method for forming a pattern and substrate-processing apparatus 失效
标题翻译：形成图案的方法和基板处理装置
公开(公告)号：US07364839B2
公开(公告)日：2008-04-29
申请号：US10624593
申请日：2003-07-23
申请人： Kei Hayasaki , Shinichi Ito , Tomoyuki Takeishi , Kenji Kawano , Tatsuhiko Ema
发明人： Kei Hayasaki , Shinichi Ito , Tomoyuki Takeishi , Kenji Kawano , Tatsuhiko Ema
IPC分类号： G03F7/26
CPC分类号： G03F7/40
摘要： A pattern forming method comprises forming a photosensitive resin film on a substrate, exposing the photosensitive resin film, forming a pattern of the photosensitive resin film by supplying a developing solution to the photosensitive resin film, and slimming to remove a surface layer of the pattern by causing the pattern to contact with an activated water.
摘要翻译：图案形成方法包括在基板上形成感光性树脂膜，使感光性树脂膜曝光，通过向感光性树脂膜供给显影液而形成感光性树脂膜的图案，通过使感光性树脂膜变薄，从而除去图案的表面层导致图案与活性水接触。

8. 发明申请

US20050158670A1 Apparatus for processing substrate and method of processing the same 失效
公开(公告)号：US20050158670A1
公开(公告)日：2005-07-21
申请号：US11030135
申请日：2005-01-07
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： B05C5/02 , B05C9/14 , B05C11/08 , B05D1/40 , B05D3/02 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/38 , H01L21/00 , H01L21/027 , G03F7/00
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.

9. 发明申请

US20050118536A1 Apparatus for processing substrate and method of processing the same 失效
公开(公告)号：US20050118536A1
公开(公告)日：2005-06-02
申请号：US11030064
申请日：2005-01-07
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： B05C5/02 , B05C9/14 , B05C11/08 , B05D1/40 , B05D3/02 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/38 , H01L21/00 , H01L21/027 , G03F7/40
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.

10. 发明授权

US06881058B2 Apparatus for processing substrate and method of processing the same 失效
标题翻译：基板处理装置及其处理方法
公开(公告)号：US06881058B2
公开(公告)日：2005-04-19
申请号：US10026419
申请日：2001-12-26
申请人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
发明人： Kenji Kawano , Shinichi Ito , Eishi Shiobara , Daisuke Kawamura , Kei Hayasaki
IPC分类号： B05C5/02 , B05C9/14 , B05C11/08 , B05D1/40 , B05D3/02 , G03F7/16 , G03F7/20 , G03F7/30 , G03F7/38 , H01L21/00 , H01L21/027 , F27D7/06
CPC分类号： H01L21/6715 , B05C5/0254 , B05C11/08 , G03F7/168 , G03F7/3021 , G03F7/38 , G03F7/70358 , G03F7/70558 , H01L21/67109 , H01L21/67115
摘要： A heating apparatus for a substrate to be processed with a coating film has a chamber with an inner space, a heating plate heating the substrate to be processed in the inner space, and a partition member. The heating plate has a support surface which supports the substrate to be processed within the chamber. The partition member is arranged in the chamber so as to face the support surface. The partition member partitions the inner space into first and second spaces, and has a plurality of pores which allow the first and second spaces to communicate with each other. The support surface of the heating plate is set in the first space. An air stream formation mechanism forming an air stream is arranged in the second space. This mechanism discharges a substance evaporated from the photoresist film.
摘要翻译：用涂膜处理的基板的加热装置具有内部空间的室，在内部空间中加热被处理基板的加热板和分隔构件。加热板具有支撑表面，该支撑表面支撑在腔室内待处理的基底。分隔构件布置在腔室中以面向支撑表面。分隔构件将内部空间分隔成第一和第二空间，并且具有允许第一和第二空间彼此连通的多个孔。加热板的支撑表面设置在第一空间中。形成空气流的气流形成机构设置在第二空间中。该机理将从光致抗蚀剂膜蒸发的物质排出。

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