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1. 发明申请

US20090301771A1 CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME 审中-公开
标题翻译：导电布，其形成方法和使用其的电子元件安装结构
公开(公告)号：US20090301771A1
公开(公告)日：2009-12-10
申请号：US12477227
申请日：2009-06-03
申请人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
发明人： Shozo Ochi , Kazuya Ushirokawa , Takayuki Higuchi
IPC分类号： H05K1/16 , H05K1/11 , H01R43/02
CPC分类号： H05K3/4007 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/90 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/1132 , H01L2224/114 , H01L2224/11552 , H01L2224/11554 , H01L2224/116 , H01L2224/11901 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83192 , H01L2224/90 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K1/095 , H05K2201/0367 , H05K2201/0373 , H05K2201/09827 , H05K2203/0514 , H05K2203/1476 , Y10T29/49213 , H01L2924/00014 , H01L2224/13099 , H01L2924/3512 , H01L2924/00
摘要： A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.
摘要翻译：形成在电子部件的电极上的导电凸块。导电凸块由在电极上形成有一层或多层的第一凸块组成，并且包括至少包含球形导电填料的树脂和形成在第一凸块的上表面上的第二凸块，并且包括含有鳞片状导电填料。

2. 发明授权

US08663383B2 Expansive material and its preparation process 有权
标题翻译：膨胀材料及其制备工艺
公开(公告)号：US08663383B2
公开(公告)日：2014-03-04
申请号：US13261027
申请日：2010-05-20
申请人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
发明人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
IPC分类号： C04B2/02
CPC分类号： C04B40/0039 , C04B38/02 , Y02P40/18 , C04B7/02 , C04B22/064 , C04B22/143 , C04B40/0082 , C04B40/0231
摘要： The invention provides an expansive material that allows for large expansion of concrete at a material age of 2 to 7 days after pouring and permits concrete to have higher initial compressive strength and makes sure good storage stability, and a process for preparing that expansive material.The invention provides an expansive material and a process for preparing that expansive material, characterized in that clinker or pulverized clinker containing free lime, a hydraulic compound and calcium sulfate anhydrite is heat treated in a carbon dioxide gas atmosphere to form calcium carbonate in it. Preferably, the expansive material contains a particle in which the free lime, hydraulic compound, calcium sulfate anhydrite and calcium carbonate are all present; the content of calcium carbonate is 0.5 to 10% by mass; and the expansive material has a Blaine's specific surface area of 1,500 to 90,000 cm2/g. The expansive material is blended with cement into a cement composition. The preparation conditions are preferably a carbon dioxide gas flow rate of 0.01 to 0.1 L/min. and a temperature of 200 to 800° C., under which conditions there is calcium carbonate formed.
摘要翻译：本发明提供了一种膨胀材料，其允许混凝土在浇筑后2至7天的时间内大量膨胀，并允许混凝土具有较高的初始抗压强度并确保良好的储存稳定性，以及制备该膨胀材料的方法。本发明提供了一种膨胀材料和一种制备膨胀材料的方法，其特征在于，在二氧化碳气氛中对含有游离石灰的熟料或粉碎熟料，水硬性化合物和硫酸钙无水石膏进行热处理，以形成碳酸钙。优选地，膨胀材料包含其中存在游离石灰，水硬性化合物，硬脂酸钙和碳酸钙的颗粒; 碳酸钙的含量为0.5〜10质量％膨胀材料的Blaine比表面积为1500〜90,000cm2 / g。膨胀材料与水泥混合成水泥组合物。制备条件优选为0.01〜0.1L / min的二氧化碳气体流量。温度为200〜800℃，在此条件下形成碳酸钙。

3. 发明授权

US08540903B2 Electrically conductive paste, and electrical and electronic device comprising the same 有权
标题翻译：导电膏，以及包含该导电膏的电气和电子设备
公开(公告)号：US08540903B2
公开(公告)日：2013-09-24
申请号：US12744994
申请日：2008-11-21
申请人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
发明人： Takayuki Higuchi , Hidenori Miyakawa , Atsushi Yamaguchi , Arata Kishi , Naomichi Ohashi
IPC分类号： H01B1/02 , H01B1/22 , H01B1/12 , H05K3/20 , H05K3/30 , H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H05K3/321 , H01B1/22 , H05K2201/0272 , H05K2203/0425 , Y10T29/49128 , Y10T29/4913
摘要： Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.
摘要翻译：公开了一种导电性糊剂，其能够通过使用导电性糊料，在电路板的电子部件的实施中使导电性糊剂固化后的接合部形成的导电路径中的空隙生长水平降低，其含有减少量的粘度调节/触变性添加剂。选择具有不同熔点和不同平均粒径的两种含Sn的低熔点合金颗粒作为用于导电浆料的导电填料组分，并将两种合金颗粒以预定的比例混合使用。

4. 发明授权

US08436253B2 Method of manufacturing mounting structure and mounting structure 有权
标题翻译：制造安装结构和安装结构的方法
公开(公告)号：US08436253B2
公开(公告)日：2013-05-07
申请号：US12992306
申请日：2009-03-23
申请人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
发明人： Takayuki Higuchi , Yoshihiro Tomura , Kazuhiro Nobori , Kentaro Kumazawa
IPC分类号： H05K1/00
CPC分类号： H05K3/305 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05155 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/29298 , H01L2224/32225 , H01L2224/731 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0665 , H01L2924/10253 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/3011 , H05K2201/0187 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A mounting structure is provided which includes an electronic component; a circuit board; a first insulating resin and a second insulating resin which are placed between the electronic component and the circuit board, for sealing; a plurality of bumps are formed on the electronic component or the circuit board; a plurality of counter electrodes of the circuit board or the electronic component, connected to the plurality of bumps; and a plurality of joining regions. The plurality of joining regions are formed by the second insulating resin, a plurality of first insulating resin regions are disposed around the joining regions so that the joining regions are sandwiched by the plurality of first insulating resin regions, the first insulating resin and the second insulating resin each contain filler, and the second insulating resin has a higher curing temperature than the curing temperature of the first insulating resin.
摘要翻译：提供一种安装结构，其包括电子部件; 电路板; 第一绝缘树脂和第二绝缘树脂，其被放置在电子部件和电路板之间用于密封; 在电子部件或电路基板上形成多个凸块; 连接到所述多个凸块的所述电路板或所述电子部件的多个对置电极; 和多个接合区域。多个连接区域由第二绝缘树脂形成，多个第一绝缘树脂区域设置在接合区域周围，使得接合区域被多个第一绝缘树脂区域夹持，第一绝缘树脂和第二绝缘树脂区域树脂各自含有填料，第二绝缘树脂的固化温度比第一绝缘树脂的固化温度高。

5. 发明授权

US08163599B2 Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus 失效
标题翻译：倒装芯片安装方法，倒装芯片安装装置和倒装芯片安装装置中使用的工具保护片
公开(公告)号：US08163599B2
公开(公告)日：2012-04-24
申请号：US12933819
申请日：2009-03-30
申请人： Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
发明人： Yoshihiro Tomura , Kentaro Kumazawa , Takayuki Higuchi , Koujiro Nakamura
IPC分类号： H01L21/44
CPC分类号： H01L24/75 , H01L21/563 , H01L21/568 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75304 , H01L2224/75315 , H01L2224/75317 , H01L2224/75501 , H01L2224/81005 , H01L2224/81203 , H01L2224/81209 , H01L2224/81801 , H01L2224/81907 , H01L2224/83102 , H01L2224/83192 , H01L2224/83203 , H01L2224/83209 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/9205 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , Y10T428/249954 , H01L2924/00
摘要： A flip-chip mounting apparatus has a shield film (18) on the side of a pressurizing film (10b) of a tool protection sheet (10). When a semiconductor chip (1) is heated and pressurized via the tool protection sheet (10), the pressurizing film (10b) is released from a mold by a sheet fixing jig (9), and is expanded by a pressurizing/heating tool (11) to abut against an insulating resin film (5) protruding from the periphery of the semiconductor chip (1) and cure the insulating resin film (5) with an external pressure being applied.
摘要翻译：倒装芯片安装装置在工具保护片（10）的加压膜（10b）侧具有屏蔽膜（18）。当通过工具保护片（10）对半导体芯片（1）加热加压时，加压膜（10b）通过片材固定夹具（9）从模具中释放，并通过加压/加热工具 11）抵靠从半导体芯片（1）的周围突出的绝缘树脂膜（5），并施加外部压力使绝缘树脂膜（5）固化。

6. 发明授权

US07527689B2 Cement admixture, cement composition, and method for suppressing carbonation using the same 有权
标题翻译：水泥外加剂，水泥组合物及使用其的碳酸化抑制方法
公开(公告)号：US07527689B2
公开(公告)日：2009-05-05
申请号：US11923010
申请日：2007-10-24
申请人： Minoru Morioka , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
发明人： Minoru Morioka , Takayuki Higuchi , Hiroyuki Ohashi , Yasuhiro Nakashima
IPC分类号： C04B7/14 , C04B7/153
CPC分类号： C04B14/042 , C04B14/043 , C04B28/08 , C04B28/082 , C04B2111/10 , C04B2111/1068 , C04B2111/22 , C04B20/008 , C04B2103/0089 , C04B7/02
摘要： A cement admixture and a cement composition having a carbonation suppressing effect and a heat-of-hydration suppressing effect are provided. A cement admixture containing one or more non-hydraulic compounds selected from the group consisting of γ-2CaO.SiO2, α-CaO.SiO2 and calcium magnesium silicate, a cement composition containing said admixture, and a carbonation suppressing method by use of said cement admixture or cement composition. According to the present invention, a remarkable carbonation suppressing effect can be obtained particularly when used in portland blast-furnace slag cement. This leads to an effective use of steelmaking slag and the like, and the load of clinker can be reduced, so that a cement composition of a low environmental load type can be attained. Further, this is suitable for cements in conformity with the EN standards, which are used in civil engineering and building industries.
摘要翻译：提供了具有碳酸化抑制效果和水合热抑制效果的水泥混合物和水泥组合物。一种含有一种或多种选自γ-2CaO.SiO2，α-CaO.SiO2和硅酸镁镁的非水力化合物的水泥混合物，含有所述混合物的水泥组合物和使用所述水泥的碳酸化抑制方法外加剂或水泥组合物。根据本发明，特别是当用于波特兰高炉矿渣水泥时，可以获得显着的碳酸化抑制效果。这导致有效地利用炼钢炉渣等，并且可以减少熟料的负荷，从而可以获得低环境负荷型的水泥组合物。此外，这适用于符合在土木工程和建筑行业使用的EN标准的水泥。

7. 发明申请

US20130247796A1 CEMENT ADMIXTURE, CEMENT COMPOSITION, AND METHOD FOR REDUCING HEXAVALENT CHROMIUM USING THE SAME 有权
标题翻译：水泥组合物，水泥组合物和减少使用其的十六烷基铬的方法
公开(公告)号：US20130247796A1
公开(公告)日：2013-09-26
申请号：US13991524
申请日：2011-10-24
申请人： Takayuki Higuchi , Tsutomu Kida , Ryoetsu Yoshino
发明人： Takayuki Higuchi , Tsutomu Kida , Ryoetsu Yoshino
IPC分类号： C04B7/28
CPC分类号： C04B7/28 , C04B28/02 , C04B28/04 , C04B40/0039 , C04B2111/00025 , Y02W30/92 , C04B7/02 , C04B22/008 , C04B22/064 , C04B22/142 , C04B22/143 , C04B2103/58 , C04B18/105 , C04B14/06 , C04B14/28
摘要： The invention provides a cement admixture that improves the ability of concrete to bring about high initial strength, works in favor of enhancing the effect on hexavalent chromium reductions, and is less likely to decrease in the effect on hexavalent chromium reductions even upon storage as well as a method for reducing hexavalent chromium. The invention is embodied as (1) A cement admixture, characterized by comprising an expanding material containing free lime, a hydraulic compound and calcium sulfate anhydrite, and a tin sulfate-containing substance; (2) The cement admixture according to (1), characterized in that the tin sulfate-containing substance is contained in an amount of 0.2 to 8 parts by mass—as calculated on a tin sulfate basis—in a total of 100 parts by mass of the expanding material and the tin sulfate-containing substance; (3) The cement admixture according to (1) or (2), characterized in that the expanding material has been treated with carbon dioxide gas to form calcium carbonate therein; (4) The cement admixture according to any one of (1) to (3), characterized in that the expanding material has been surface treated with a shrinkage reducer; (5) A cement composition, characterized by containing cement, and the cement admixture according to any one of (1) to (4); and (6) A method for reducing hexavalent chromium, characterized by use of the cement composition according to (5).
摘要翻译：本发明提供了一种提高混凝土产生高初始强度的能力的水泥混合物，有利于增加对六价铬还原的影响，并且即使在储存时也不太可能降低对六价铬还原的影响，一种降低六价铬的方法。本发明体现为：（1）一种水泥混合物，其特征在于包含含有游离石灰的膨胀材料，水硬性化合物和无水硫酸钙，以及含硫酸锡物质; （2）根据（1）所述的水泥混合物，其特征在于，所述含硫酸锡物质的含量为0.2〜8质量份（以硫酸锡为基准），总计为100质量份的膨胀材料和含硫酸锡物质; （3）根据（1）或（2）所述的水泥外加剂，其特征在于，所述膨胀材料已经用二氧化碳气体处理以在其中形成碳酸钙; （4）如（1）〜（3）中任一项所述的水泥外加剂，其特征在于，所述膨胀材料用减缩剂进行表面处理; （5）一种水泥组合物，其特征在于含有水泥，和（1）〜（4）中任一项所述的水泥混合物; （6）一种减少六价铬的方法，其特征在于使用（5）所述的水泥组合物。

8. 发明申请

US20130068513A1 WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE 审中-公开
标题翻译：接线板，其生产方法，通过PASTE
公开(公告)号：US20130068513A1
公开(公告)日：2013-03-21
申请号：US13700999
申请日：2011-12-19
申请人： Shogo Hirai , Tsuyoshi Himori , Hiroyuki Ishitomi , Takayuki Higuchi , Satoru Tomekawa , Yutaka Nakayama
发明人： Shogo Hirai , Tsuyoshi Himori , Hiroyuki Ishitomi , Takayuki Higuchi , Satoru Tomekawa , Yutaka Nakayama
IPC分类号： H01B1/02 , H05K3/10 , H05K1/09
CPC分类号： H01B1/02 , H05K1/09 , H05K1/095 , H05K3/10 , H05K3/4069 , H05K3/4652 , H05K2201/0272 , H05K2203/0425 , Y10T29/49155
摘要： Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.
摘要翻译：公开了一种具有通孔导体的多层布线板，该通孔导体包括金属部分和树脂部分。金属部分包括第一金属区域，其包括形成电连接第一布线和第二布线的路径的铜颗粒的连接; 主要由选自锡，锡 - 铜合金和锡 - 铜金属间化合物的金属组成的第二金属区域; 主要由铋组成的第三金属区域; 以及由锡 - 铋焊料颗粒组成的第四金属区域。该连接件具有平面至平面的接触部分，其中铜颗粒彼此面对面地接触。第二金属区域的至少一部分与第一金属区域接触。由树脂部分包围的锡 - 铋焊料颗粒散布在通孔导体中。

9. 发明申请

US20130008698A1 MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE 审中-公开
标题翻译：多层接线板，其生产方法和通过浆料
公开(公告)号：US20130008698A1
公开(公告)日：2013-01-10
申请号：US13636055
申请日：2011-12-06
申请人： Tsuyoshi Himori , Shogo Hirai , Takayuki Higuchi , Satoru Tomekawa , Yutaka Nakayama
发明人： Tsuyoshi Himori , Shogo Hirai , Takayuki Higuchi , Satoru Tomekawa , Yutaka Nakayama
IPC分类号： H05K1/09 , B23K35/24 , H05K3/46
CPC分类号： H01B1/22 , H05K1/095 , H05K3/4069 , H05K3/4652 , H05K2201/0272 , H05K2203/0425
摘要： A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi).
摘要翻译：一种多孔布线基板，其具有导通导体，该多孔布线基板以布线的方式电连接多个布线，使得绝缘树脂层位于布线之间，其中：所述通孔导体各自包括铜，锡和铋，第一金属区域，包括铜颗粒彼此平面接触的连接部，所述连接部电连接布线，主要由锡，锡 - 铜合金和锡中的一种或多种构成的第二金属区域 - 金属间化合物和主要由铋组成的第三金属区域; 所述第二金属区域的至少一部分与所述铜粒子的表面接触，所述表面除了所述连接体的所述平面对接触部分的面积; 并且金属部分中的Cu，Sn和Bi具有比重（Cu：Sn：Bi）的组成。

10. 发明申请

US20120067251A1 EXPANSIVE MATERIAL AND ITS PREPARATION PROCESS 有权
标题翻译：膨胀材料及其制备工艺
公开(公告)号：US20120067251A1
公开(公告)日：2012-03-22
申请号：US13261027
申请日：2010-05-20
申请人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
发明人： Takayuki Higuchi , Taiichiro Mori , Hideaki Ishida , Ryoetsu Yoshino , Minoru Morioka
IPC分类号： C04B14/28 , C04B22/10
CPC分类号： C04B40/0039 , C04B38/02 , Y02P40/18 , C04B7/02 , C04B22/064 , C04B22/143 , C04B40/0082 , C04B40/0231
摘要： The invention provides an expansive material that allows for large expansion of concrete at a material age of 2 to 7 days after pouring and permits concrete to have higher initial compressive strength and makes sure good storage stability, and a process for preparing that expansive material.The invention provides an expansive material and a process for preparing that expansive material, characterized in that clinker or pulverized clinker containing free lime, a hydraulic compound and calcium sulfate anhydrite is heat treated in a carbon dioxide gas atmosphere to form calcium carbonate in it. Preferably, the expansive material contains a particle in which the free lime, hydraulic compound, calcium sulfate anhydrite and calcium carbonate are all present; the content of calcium carbonate is 0.5 to 10% by mass; and the expansive material has a Blaine's specific surface area of 1,500 to 90,000 cm2/g. The expansive material is blended with cement into a cement composition. The preparation conditions are preferably a carbon dioxide gas flow rate of 0.01 to 0.1 L/min. and a temperature of 200 to 800° C., under which conditions there is calcium carbonate formed.
摘要翻译：本发明提供了一种膨胀材料，其允许混凝土在浇筑后2至7天的时间内大量膨胀，并允许混凝土具有较高的初始抗压强度并确保良好的储存稳定性，以及制备该膨胀材料的方法。本发明提供了一种膨胀材料和一种制备膨胀材料的方法，其特征在于，在二氧化碳气氛中对含有游离石灰的熟料或粉碎熟料，水硬性化合物和硫酸钙无水石膏进行热处理，以形成碳酸钙。优选地，膨胀材料包含其中存在游离石灰，水硬性化合物，硬脂酸钙和碳酸钙的颗粒; 碳酸钙的含量为0.5〜10质量％膨胀材料的Blaine比表面积为1500〜90,000cm2 / g。膨胀材料与水泥混合成水泥组合物。制备条件优选为0.01〜0.1L / min的二氧化碳气体流量。温度为200〜800℃，在此条件下形成碳酸钙。

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