专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10271782B2 Liquid collecting apparatus and liquid collecting method 有权
公开(公告)号：US10271782B2
公开(公告)日：2019-04-30
申请号：US14425317
申请日：2012-09-03
申请人： Nobuya Hashizume , Keishi Kitamura , Takahiro Nishimoto , Yuichi Kimura , Hiroshi Toyama , Takashi Yamada
发明人： Nobuya Hashizume , Keishi Kitamura , Takahiro Nishimoto , Yuichi Kimura , Hiroshi Toyama , Takashi Yamada
IPC分类号： A61B5/155 , A61B5/15 , A61B5/153 , A61B5/157
摘要： A suction drain device of a disclosed liquid collecting apparatus actively pushes and pulls blood. This achieves liquid collection at high speed even under decreased pressure depending on a physiological state of an animal. Moreover, the liquid collecting apparatus includes a first flow path and a second flow path having a given length. Accordingly, the flow path with a given length set in advance and thus a known volume allows collection of a given amount volume of blood without measuring a length and an amount of blood using a volume measuring device. Accordingly, no need of the measuring device allows reduction in size of the liquid collecting apparatus. Consequently, the liquid collecting apparatus can be installed adjacent to the animal to achieve reduction in dead volume. Moreover, blood is flown to a fourth flow path branched with a connecting terminal, and is also flown to the second flow path branched with a connecting terminal. The blood flown in the second flow path is collected at the highest priority. This obtains collection of fresh blood from a collecting source as a blood supply source.

2. 发明申请

US20180138815A1 VOLTAGE CONVERTING DEVICE 审中-公开
公开(公告)号：US20180138815A1
公开(公告)日：2018-05-17
申请号：US15812056
申请日：2017-11-14
申请人： Takashi Yamada , Yasumichi Omoto
发明人： Takashi Yamada , Yasumichi Omoto
IPC分类号： H02M3/158 , G05F3/08 , G05F1/565 , H02M3/07 , H02M3/28 , H02M1/32
CPC分类号： H02M3/1584 , G05F1/565 , G05F3/08 , H02M1/32 , H02M3/07 , H02M3/158 , H02M3/285 , H02M3/33507 , H02M3/337 , H02M2001/0058 , H02M2001/0074 , H02M2001/009 , H02M2003/072 , Y02B70/1491
摘要： A voltage converting device is provided between a DC power supply and a load and includes parallelly-connected first and second voltage converting circuits and a control unit. The second voltage converting circuit has a rated output greater than that of the first voltage converting circuit. Under a condition where the load is a small load, the control unit operates only the first voltage converting circuit and stops an operation of the second voltage converting circuit. Under a condition where the load is a large load, the control unit operates both the first and second voltage converting circuits. In a process where the load is switched from the small load to the large load, the control unit stops the first voltage converting circuit and operates only the second voltage converting circuit, and then operates the first voltage converting circuit.

3. 发明申请

US20160165716A1 POWER CONVERSION APPARATUS 有权
标题翻译：功率转换装置
公开(公告)号：US20160165716A1
公开(公告)日：2016-06-09
申请号：US14957935
申请日：2015-12-03
申请人： Yusaku Ido , Takashi Yamada , Akihiro Fujiwara
发明人： Yusaku Ido , Takashi Yamada , Akihiro Fujiwara
IPC分类号： H05K1/02 , H02M7/06 , H02M3/04
CPC分类号： H05K1/0272 , H05K2201/064
摘要： An AC/DC converter of a power conversion apparatus includes filters, a PFC circuit, a first full bridge circuit, a first transformer, and a first rectifier circuit and converts an AC voltage supplied from the outside to a DC voltage. A DC/DC converter includes filters, a second full bridge circuit, a second transformer, and a second rectifier circuit and lowers a DC voltage output from the AC/DC converter. Constituent circuits of the AC/DC converter located on the primary side of the first transformer are mounted on the upper face of a cooling chassis which cools both the converters. Constituent circuits of the AC/DC converter located on the secondary side of the first transformer and constituent circuits of the DC/DC converter are mounted on the lower face of the cooling chassis.
摘要翻译：功率转换装置的AC / DC转换器包括滤波器，PFC电路，第一全桥电路，第一变压器和第一整流器电路，并将从外部提供的AC电压转换为DC电压。 DC / DC转换器包括滤波器，第二全桥电路，第二变压器和第二整流器电路，并且降低从AC / DC转换器输出的DC电压。位于第一变压器初级侧的AC / DC转换器的组成电路安装在冷却两个转换器的冷却底盘的上表面上。位于第一变压器的次级侧的AC / DC转换器的组成电路和DC / DC转换器的组成电路安装在冷却底盘的下表面上。

4. 发明授权

US09272835B2 Squeeze container 有权
标题翻译：挤压容器
公开(公告)号：US09272835B2
公开(公告)日：2016-03-01
申请号：US13638988
申请日：2011-04-01
申请人： Takashi Yamada , Yoshinori Inagawa
发明人： Takashi Yamada , Yoshinori Inagawa
IPC分类号： B65D83/00 , B05B9/08 , B05B11/04 , B05B11/00
CPC分类号： B65D83/0055 , A45D19/02 , A45D34/042 , A45D2024/345 , A45D2200/052 , A45D2200/056 , A61M35/00 , B05B9/0822 , B05B9/0838 , B05B11/00 , B05B11/00412 , B05B11/00414 , B05B11/0056 , B05B11/0097 , B05B11/048 , B65D25/56
摘要： A squeeze container includes a concave storage portion in which a content is stored, a sheet-shaped elastic body arranged to cover an opening portion of the storage portion, pressurization mechanism configured to swell the elastic body to the storage portion side with gas pressure, and a delivery passage which provides communication between the inside and outside of the storage portion and which delivers the content squeezed by the elastic body to the outside. The pressurization mechanism is structured to be capable of gradually swelling the elastic body by repeating squeezing with a hand and releasing thereof.
摘要翻译：挤压容器包括存储内容物的凹形存储部分，布置成覆盖存储部分的开口部分的片状弹性体，被配置为使气体压力将弹性体膨胀到储存部分的加压机构，以及输送通道，其提供储存部分的内部和外部之间的连通并且将由弹性体挤压的内容输送到外部。加压机构构造成能够通过用手重复挤压并释放弹性体而逐渐膨胀。

5. 发明授权

US09041221B2 Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body 有权
标题翻译：电子元件实施结构中间体，电子元件实施结构体和电子元件实施结构体的制造方法
公开(公告)号：US09041221B2
公开(公告)日：2015-05-26
申请号：US13993714
申请日：2011-09-12
申请人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
发明人： Shozo Ochi , Kazuya Ushirokawa , Keiichi Kusumoto , Takashi Yamada , Ken Yasue
IPC分类号： H01L23/538 , H01L23/00 , H01L25/065 , H01L25/18 , H01L23/498
CPC分类号： H01L23/5386 , H01L23/49816 , H01L23/49833 , H01L23/4985 , H01L24/05 , H01L24/14 , H01L24/16 , H01L24/73 , H01L24/80 , H01L24/81 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/1403 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73207 , H01L2224/73253 , H01L2224/73265 , H01L2224/81193 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/00015 , H01L2924/00012 , H01L2924/00
摘要： An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.
摘要翻译：一种实现结构中间体，包括：具有第一连接端子的第一芯片; 第二芯片，其具有面向所述第一芯片的面中的第二连接端子; 并且具有设置在第一芯片和第二芯片之间的一个面中的具有第三连接端子的膜布线基板被装载在具有第五连接端子的芯片装载基板上，使得第一芯片的另一个面由此面对。在薄膜配线基板中，存在位于第一芯片和第二芯片的外侧的部分，在前端部设置有通过布线与第三连接端子连接的第四连接端子，一部分第一连接端子与第二连接端子连接，第三连接端子与第一连接端子的另一部分连接，第五连接端子连接到第四连接端子。

6. 发明授权

US09002228B2 Image forming apparatus with control section to control contact pressure between heating member and pressure member and control method thereof 有权
标题翻译：具有用于控制加热构件和压力构件之间的接触压力的控制部分的图像形成装置及其控制方法
公开(公告)号：US09002228B2
公开(公告)日：2015-04-07
申请号：US13845991
申请日：2013-03-18
申请人： Tsutomu Sakamaki , Takashi Yamada
发明人： Tsutomu Sakamaki , Takashi Yamada
IPC分类号： G03G15/20 , G03G15/16
CPC分类号： G03G15/205 , G03G15/2032 , G03G15/2064
摘要： An image forming apparatus is provided that includes: a heating member that heats a recording sheet; a pressure member that presses the recording sheet between the heating member and the pressure member; an adjustment mechanism that causes the heating member and the pressure member to contact or to separate; and a control section that, at a time of a warm-up operation or an idling operation, based on a predetermined condition, controls the adjustment mechanism so as to cause the heating member and the pressure member to contact at a contact pressure that is lower than a contact pressure between the heating member and the pressure member at a time of image formation or is approximately identical to the contact pressure at a time of image formation.
摘要翻译：提供一种图像形成装置，其包括：加热记录纸张的加热构件; 压力构件，其在所述加热构件和所述压力构件之间按压所述记录片材; 使加热构件和压力构件接触或分离的调节机构; 以及控制部，其在预热操作或空转操作时基于预定条件，控制所述调节机构，以使所述加热部件和所述加压部件以较低的接触压力接触比图像形成时加热构件和压力构件之间的接触压力大致相同于图像形成时的接触压力。

7. 发明授权

US08964897B2 Transmitting device and transmitting method 有权
标题翻译：传输设备和传输方式
公开(公告)号：US08964897B2
公开(公告)日：2015-02-24
申请号：US13421334
申请日：2012-03-15
申请人： Yosuke Tomita , Hidemitsu Kawashima , Takashi Yamada
发明人： Yosuke Tomita , Hidemitsu Kawashima , Takashi Yamada
IPC分类号： H04L27/12
CPC分类号： H04L27/12
摘要： A transmitting device that transmits a FSK-modulated wireless signal to a receiving device includes a controller that determines a transmitting content transmitted to the receiving device and a value of a maximum frequency shift in the FSK modulation, and outputs output information including the transmitting content, the value of the maximum frequency shift, and a value of a center frequency in the FSK modulation; a generator that generates a FSK modulation signal based on the transmitting content, the value of the maximum frequency shift, and the value of the center frequency, which are output from the controller; and a transmitting antenna that transmits the FSK modulation signal, which is generated by the generator, in a form of a wireless signal.
摘要翻译：将FSK调制的无线信号发送到接收装置的发送装置包括控制器，其确定发送到接收装置的发送内容和FSK调制中的最大频移值，并输出包括发送内容的输出信息，最大频移的值和FSK调制中的中心频率的值; 基于从控制器输出的发送内容，最大频移值和中心频率值，生成FSK调制信号的发生器; 以及以无线信号的形式发送由发生器生成的FSK调制信号的发送天线。

8. 发明授权

US08918589B2 Memory controller, memory system, semiconductor integrated circuit, and memory control method 有权
标题翻译：存储控制器，存储器系统，半导体集成电路和存储器控制方法
公开(公告)号：US08918589B2
公开(公告)日：2014-12-23
申请号：US12988396
申请日：2009-04-21
申请人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
发明人： Koji Asai , Tetsuji Mochida , Daisuke Imoto , Takashi Yamada , Wataru Ohkoshi
IPC分类号： G06F12/02 , G06F13/16 , G06F12/08 , G06F9/45
CPC分类号： G06F13/1642 , G06F8/4442 , G06F12/0862 , G06F2212/6022
摘要： A memory controller (101) according to this invention includes: a command generation unit (102) which generates access commands each including a physical address, based on an access request including a logical address indicating a rectangular area in image data; and a command issuance unit (105) which issues, to a memory (0), the access commands generated by the command generation unit (102). The command generation unit (102) includes a group determination unit (104) which determines a group to which a bank including data to be accessed belongs, based on the physical address corresponding to the access request. The command generation unit (102) generates a pair of a first and a second access commands which share a prefetch buffer between two banks belonging to different groups, when data to be accessed is continuous across two banks belonging to different groups.
摘要翻译：根据本发明的存储器控制器（101）包括：命令产生单元（102），其基于包括指示图像数据中的矩形区域的逻辑地址的访问请求，生成包括物理地址的访问命令; 以及向存储器（0）发出由命令生成单元（102）生成的访问命令的命令发布单元（105）。命令生成单元（102）包括：组决定单元（104），其基于与访问请求对应的物理地址，确定包含要访问的数据的存储体所属的组。命令生成单元（102）生成一对第一和第二访问命令，当要访问的数据在属于不同组的两个存储体中是连续的时，共享一个属于不同组的两个存储体之间的预取缓冲器。

9. 发明授权

US08815019B2 Bonding wire for semiconductor 有权
标题翻译：半导体用导线
公开(公告)号：US08815019B2
公开(公告)日：2014-08-26
申请号：US12993401
申请日：2010-02-12
申请人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Ryo Oishi , Daizo Oda
发明人： Tomohiro Uno , Shinichi Terashima , Takashi Yamada , Ryo Oishi , Daizo Oda
IPC分类号： B23K35/34
CPC分类号： C22C5/02 , B32B15/018 , C22C5/04 , C22C5/06 , C22C9/00 , C22C21/02 , C22C21/12 , H01L24/43 , H01L24/45 , H01L2224/05624 , H01L2224/43 , H01L2224/43848 , H01L2224/43986 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45169 , H01L2224/45565 , H01L2224/45572 , H01L2224/45644 , H01L2224/45664 , H01L2224/45686 , H01L2224/4569 , H01L2224/48011 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85186 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00011 , H01L2924/00015 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , Y10T428/12222 , H01L2924/01001 , H01L2924/00014 , H01L2924/20754 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/01202 , H01L2924/01007 , H01L2924/01205 , H01L2224/45639 , H01L2224/45669 , H01L2224/45655 , H01L2224/45657 , H01L2224/45671 , H01L2224/45666 , H01L2924/20656 , H01L2924/20652 , H01L2924/20645 , H01L2924/20654 , H01L2924/20655 , H01L2924/00 , H01L2224/48227 , H01L2224/48824 , H01L2924/013 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/00013 , H01L2924/01049 , H01L2924/01006
摘要： It is an object of the present invention to provide a multilayer wire which can accomplish both ball bonding property and wire workability simultaneously, and which enhances a loop stability, a pull strength, and a wedge bonding property. A semiconductor bonding wire comprises a core member mainly composed of equal to or greater than one kind of following elements: Cu, Au, and Ag, and an outer layer formed on the core member and mainly composed of Pd. A total hydrogen concentration contained in a whole wire is within a range from 0.0001 to 0.008 mass %.
摘要翻译：本发明的目的是提供一种能够同时实现滚珠接合性能和线加工性的多层线材，并且提高了环路稳定性，拉伸强度和楔形粘合性能。半导体接合线包括主要由等于或大于一种以下元素构成的芯部件：Cu，Au和Ag，以及形成在芯部件上并主要由Pd构成的外层。总线中含有的总氢浓度在0.0001〜0.008质量％的范围内。

10. 发明授权

US08653668B2 Copper bonding wire for semiconductor device and bonding structure thereof 有权
标题翻译：半导体器件用铜接合线及其接合结构
公开(公告)号：US08653668B2
公开(公告)日：2014-02-18
申请号：US13577199
申请日：2011-02-03
申请人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda
发明人： Tomohiro Uno , Takashi Yamada , Atsuo Ikeda
IPC分类号： H01L23/49
CPC分类号： H01L24/48 , B23K35/0244 , B23K35/3046 , C22C9/00 , C22F1/08 , H01L24/05 , H01L24/43 , H01L24/45 , H01L24/85 , H01L2224/04042 , H01L2224/05624 , H01L2224/43848 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45639 , H01L2224/45644 , H01L2224/45664 , H01L2224/48453 , H01L2224/48463 , H01L2224/48507 , H01L2224/48799 , H01L2224/48824 , H01L2224/85 , H01L2224/85203 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/10253 , H01L2924/181 , H01L2924/20104 , H01L2924/20105 , H01L2924/01032 , H01L2924/00012 , H01L2924/00 , H01L2924/013 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/01049 , H01L2924/01203 , H01L2924/00013 , H01L2924/01004 , H01L2924/01204
摘要： A bonding structure and a copper bonding wire for semiconductor device include a ball-bonded portion formed by bonding to the aluminum electrode a ball formed on a front end of the copper bonding wire. After being heated at any temperature between 130° C. and 200° C., the ball-bonded portion exhibits a relative compound ratio R1 of 40-100%, the relative compound ratio R1 being a ratio of a thickness of a Cu—Al intermetallic compound to thicknesses of intermetallic compounds that are composed of Cu and Al and formed on a cross-sectional surface of the ball-bonded portion.
摘要翻译：用于半导体器件的接合结构和铜接合线包括通过将形成在铜接合线的前端上的球接合到铝电极而形成的滚珠接合部。在130℃至200℃之间的任何温度下加热后，球形接合部分的相对化合物比率R1为40-100％，相对化合物比例R1为Cu-Al 金属间化合物与由Cu和Al组成并形成在球形接合部分的横截面上的金属间化合物的厚度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式