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1. 发明申请

US20090293380A1 FRICTION DAMPER 审中-公开
标题翻译：摩擦阻尼器
公开(公告)号：US20090293380A1
公开(公告)日：2009-12-03
申请号：US12306709
申请日：2007-06-27
申请人： Kazuhiko Sasaki , Mitsuru Miyazaki , Kazuaki Shiki , Kazuhiro Nagashima
发明人： Kazuhiko Sasaki , Mitsuru Miyazaki , Kazuaki Shiki , Kazuhiro Nagashima
IPC分类号： E04H9/02
CPC分类号： E04H9/02 , E04H9/028 , F16F7/08
摘要： To provide a friction damper with simple construction having characteristics that there is little difference in resistance forces between at initial shock and after slide, and it is difficult to deform slide member under large fastening force, and large frictional force can stably be generated. The friction damper 1 comprising: a cylinder box 2; a cylinder member 6 axially fixed in the cylinder box; a slide bearing 7 press-fitted into an inner peripheral surface of the cylinder member; and a shaft 3 made of metal, the shaft being axially slidably press-fitted into an inner peripheral surface of the slide bearing; wherein when the cylinder box and the shaft move axially in relation to each other, an outer peripheral surface of the shaft and the inner peripheral surface of the slide bearing frictionally slide in relation to each other to absorb vibration energy. When the friction damper of the present invention is mounted to an intermediate portion or an end portion of a structural member of a building structure such that the cylinder box and the shaft relatively axially movable with each other, and repeated tensile and compressive forces are added to the structural member of the building structure due to earthquake or the like, the inner peripheral surface of the slide bearing press-fitted into the cylinder member and the outer peripheral surface of the shaft frictionally slide with each other to absorb vibration energy.
摘要翻译：为了提供具有简单结构的摩擦阻尼器，其特征在于初始冲击和滑动之后的阻力几乎没有差异，并且在大的紧固力下难以使滑动构件变形，并且可以稳定地产生大的摩擦力。摩擦阻尼器1包括：气缸箱2; 轴向固定在汽缸箱中的缸体6; 滑动轴承7压配合到气缸构件的内周面中; 以及由金属制成的轴3，所述轴可轴向滑动地压配合到所述滑动轴承的内周表面中; 其中，当所述气缸箱和所述轴相对于彼此轴向移动时，所述轴的外周表面和所述滑动轴承的内周表面相对于彼此摩擦滑动以吸收振动能。当将本发明的摩擦阻尼器安装到建筑结构的结构构件的中间部分或端部时，使得气缸箱和轴可以相对轴向移动，并且反复的拉伸和压缩力被加到由于地震等引起的建筑结构的结构构件，压入缸体的滑动轴承的内周面与轴的外周面摩擦滑动以吸收振动能。

2. 发明授权

US09530676B2 Substrate processing apparatus, substrate transfer method and substrate transfer device 有权
标题翻译：基板处理装置，基板转印方法和基板转印装置
公开(公告)号：US09530676B2
公开(公告)日：2016-12-27
申请号：US13483118
申请日：2012-05-30
申请人： Toshio Yokoyama , Junji Kunisawa , Mitsuru Miyazaki , Kenichi Suzuki , Hiroshi Sotozaki
发明人： Toshio Yokoyama , Junji Kunisawa , Mitsuru Miyazaki , Kenichi Suzuki , Hiroshi Sotozaki
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687 , B25J11/00
CPC分类号： H01L21/67718 , B25J11/0095 , H01L21/6704 , H01L21/67173 , H01L21/67196 , H01L21/67219 , H01L21/67706 , H01L21/67742 , H01L21/68707
摘要： A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.
摘要翻译：基板处理装置可以防止由于基板的被处理表面暴露于光而导致的铜互连的光腐蚀，并且可以执行基板表面的处理，例如清洁基板表面，同时防止光蚀刻，例如，由于曝光而导致的铜互连。基板处理装置包括容纳其中已进行遮光处理的处理单元的多个处理区域; 以及至少一个传送区域，其中容纳有传送机器人并设置在所述多个处理区域中的两个相邻处理区域之间。在传送区域和两个相邻的处理区域中的每一个之间设置遮光壁，并且为传送区域的前开口设置遮光维护门。处理单元以遮光方式耦合到遮光壁。

3. 发明授权

US07976362B2 Substrate polishing apparatus and method 有权
标题翻译：基材抛光装置及方法
公开(公告)号：US07976362B2
公开(公告)日：2011-07-12
申请号：US12534465
申请日：2009-08-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B29/00
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

4. 发明申请

US20090260304A1 Damper and vibration damping structure using the same 有权
公开(公告)号：US20090260304A1
公开(公告)日：2009-10-22
申请号：US12457728
申请日：2009-06-19
申请人： Masami Mochimaru , Sumio Kawaguchi , Mitsuru Miyazaki , Akio Suzuki
发明人： Masami Mochimaru , Sumio Kawaguchi , Mitsuru Miyazaki , Akio Suzuki
IPC分类号： E04H9/02 , E04B1/98
CPC分类号： F16F9/103 , E04H2009/026 , F16F9/303
摘要： A damper includes a hollow outer elongated body; a hollow inner elongated body; a liquid viscous body or liquid viscoelastic body disposed in a gap between an inner surface of the elongated body and an outer surface of the elongated body in such a manner as to be in contact with the inner surface and the outer surface of these elongated bodies, respectively; and first and second attaching structures. Further, a controller may be provided to control an increase or decrease in the internal pressure of the liquid viscous body or the liquid viscoelastic body.

5. 发明授权

US07585205B2 Substrate polishing apparatus and method 有权
标题翻译：基材抛光装置及方法
公开(公告)号：US07585205B2
公开(公告)日：2009-09-08
申请号：US11905687
申请日：2007-10-03
申请人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
发明人： Seiji Katsuoka , Masahiko Sekimoto , Junji Kunisawa , Mitsuru Miyazaki , Teruyuki Watanabe , Kenichi Kobayashi , Masayuki Kumekawa , Toshio Yokoyama
IPC分类号： B24B49/00
CPC分类号： B24B37/04 , B24B55/02 , Y10S451/914
摘要： A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.
摘要翻译：一种基板研磨装置，具备：具有保持被研磨基板的头部的基板保持机构，以及具备安装有研磨垫的研磨台的研磨机构。由头部保持的基板被压靠在抛光台上的抛光垫上，以通过基板和抛光垫的相对运动来抛光基板。基板抛光装置还包括用于将要抛光的基板输送到头部并且接收经抛光的基板的基板传送机构。基板转印机构包括用于接收待抛光的基板的待抛光基板和用于接收被抛光的基板的抛光的基板接收器。

6. 发明申请

US20060236929A1 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US20060236929A1
公开(公告)日：2006-10-26
申请号：US11455736
申请日：2006-06-20
申请人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
发明人： Seiji Katsuoka , Masahiko Sekimoto , Toshio Yokoyama , Teruyuki Watanabe , Takahiro Ogawa , Kenichi Kobayashi , Mitsuru Miyazaki , Yasuyuki Motoshima , Akira Owatari , Naoki Dai
IPC分类号： B05C3/02
CPC分类号： H01L21/67161 , C23C18/1628 , C23C18/1893 , C25D7/123 , C25D17/001 , C25D17/08 , H01L21/67051 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/6723 , H01L21/67742 , H01L21/67751 , H01L21/67766 , H01L21/67781 , H01L21/68707 , H01L21/68721 , Y10S134/902 , Y10T279/11
摘要： The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

7. 发明授权

US09165799B2 Substrate processing method and substrate processing unit 有权
标题翻译：基板加工方法和基板处理单元
公开(公告)号：US09165799B2
公开(公告)日：2015-10-20
申请号：US13455529
申请日：2012-04-25
申请人： Xinming Wang , Mitsuru Miyazaki , Kunimasa Matsushita
发明人： Xinming Wang , Mitsuru Miyazaki , Kunimasa Matsushita
IPC分类号： H01L21/02 , B08B3/02 , H01L21/67
CPC分类号： H01L21/67051 , B08B3/024
摘要： A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×rα=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and α represents a power index.
摘要翻译：基板处理方法包括：从流体喷嘴朝向旋转基板表面喷射至少一种流体，同时使流体喷嘴从旋转基板的中心向周边移动。流体喷嘴以恒定的初始移动速度从基板的中心移动到预定点。流体喷嘴随后以满足以下关系式的运动速度V（r）从预定点移动：V（r）×rα= C（常数），其中V（r）表示流体喷嘴的移动速度当其与衬底表面上距离衬底中心距离“r”的位置相对应的位置时，α表示功率指数。

8. 发明授权

US08795032B2 Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method 有权
标题翻译：基板处理装置，基板处理方法，基板保持机构和基板保持方法
公开(公告)号：US08795032B2
公开(公告)日：2014-08-05
申请号：US12457175
申请日：2009-06-03
申请人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
发明人： Mitsuru Miyazaki , Seiji Katsuoka , Naoki Matsuda , Junji Kunisawa , Kenichi Kobayashi , Hiroshi Sotozaki , Hiroyuki Shinozaki , Osamu Nabeya , Shinya Morisawa , Takahiro Ogawa , Natsuki Makino
IPC分类号： B24B51/00
CPC分类号： B24B37/345 , H01L21/30625 , H01L21/67219 , H01L21/67739 , H01L21/67742 , H01L21/67754 , Y10T137/0318 , Y10T137/8593
摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.
摘要翻译：公开了一种用于处理衬底的设备。该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。清洗部具有多个用于清洗多个基板的清洗线。多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

9. 发明申请

US20120318304A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING UNIT 有权
标题翻译：基板处理方法和基板处理单元
公开(公告)号：US20120318304A1
公开(公告)日：2012-12-20
申请号：US13455529
申请日：2012-04-25
申请人： Xinming WANG , Mitsuru Miyazaki , Kunimasa Matsushita
发明人： Xinming WANG , Mitsuru Miyazaki , Kunimasa Matsushita
IPC分类号： B08B3/02 , B08B3/04
CPC分类号： H01L21/67051 , B08B3/024
摘要： A substrate processing method includes jetting at least one fluid from a fluid nozzle toward a rotating substrate surface while moving the fluid nozzle from a center toward a periphery of the rotating substrate. The fluid nozzle is moved from the center of the substrate to a predetermined point at a constant initial movement speed. The fluid nozzle is subsequently moved from the predetermined point at a movement speed V(r) which satisfies the following relational expression: V(r)×rα=C (constant), where V(r) represents the movement speed of the fluid nozzle when it passes a position corresponding to a position on the substrate surface at a distance “r” from the center of the substrate, and α represents a power index.
摘要翻译：基板处理方法包括：从流体喷嘴朝向旋转基板表面喷射至少一种流体，同时使流体喷嘴从旋转基板的中心向周边移动。流体喷嘴以恒定的初始移动速度从基板的中心移动到预定点。流体喷嘴随后以满足以下关系式的运动速度V（r）从预定点移动：V（r）×rα= C（常数），其中V（r）表示流体喷嘴的移动速度当其从基板的中心经过与基板表面上位置相对应的距离r的位置时，α表示功率指数。

10. 发明申请

US20120266547A1 ACTIVE DYNAMIC VIBRATION ABSORBER 有权
标题翻译：主动动态振动吸收器
公开(公告)号：US20120266547A1
公开(公告)日：2012-10-25
申请号：US13513683
申请日：2010-11-12
申请人： Ikuo Shimoda , Mitsuru Miyazaki , Yuichi Iwasaki
发明人： Ikuo Shimoda , Mitsuru Miyazaki , Yuichi Iwasaki
IPC分类号： E04B1/98 , F16F7/104 , F16F7/10
CPC分类号： F16F7/1005 , F16F7/104
摘要： An active dynamic vibration absorber 1 includes a weight 2; a frame 3 which is adjacent to the weight 2 in such a manner as to surround the weight 2 with clearances X1 and Y1; a holding mechanism 4 which is interposed between the weight 2 and the frame 3 and holds the weight 2 movably in an X direction with respect to the frame 3, while holding the weight 2 immovably in a Y direction and a vertical direction V; a detecting means 5 for detecting the relative vibration of a predetermined value in the X direction of the weight 2 with respect to the frame 3; and a moving means 6 for relatively moving the weight 2 in the X direction with respect to the frame 3 on the basis of a detection signal from the detecting means 5 such that the relative movement of the weight 2 in the X direction with respect to the frame 3 is allowed, while the vibrational displacement of the weight 2 in the X direction with respect to the frame 3 is reduced.
摘要翻译：主动式振动吸收器1包括重物2; 与重物2相邻的框架3，以围绕重物2的间隙X1和Y1的方式; 保持机构4，其夹持在配重2和框架3之间，并且将重物2相对于框架3以X方向可移动地保持，同时将重物2不动地保持在Y方向和垂直方向V上; 检测装置5，用于检测重量2相对于框架3的X方向上的预定值的相对振动; 以及用于基于来自检测装置5的检测信号相对于框架3相对于X方向相对移动配重2的移动装置6，使得配重2相对于X方向的相对运动而重量2相对于框架3在X方向上的振动位移减小，因此允许框架3。

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