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1. 发明授权

US07287975B2 Resin mold material and resin mold 有权
标题翻译：树脂模具材料和树脂模具
公开(公告)号：US07287975B2
公开(公告)日：2007-10-30
申请号：US10855210
申请日：2004-05-26
申请人： Kazuhiko Bandoh , Keiji Maeda , Takaki Kuno , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Kazuhiko Bandoh , Keiji Maeda , Takaki Kuno , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B29C33/10
CPC分类号： B29C33/56 , B29C33/10 , B29C45/14655 , B29C45/34 , B29C70/72 , H01L2224/48091 , Y10S425/812 , H01L2924/00014
摘要： A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 μm; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.
摘要翻译：树脂模具材料包括从模具表面基本上线性延伸并且具有从1nm到小于10μm的直径的一维连通孔; 包括模具表面和一维连通孔的表面层; 覆盖表层的背面的支撑层; 以及与支撑层中的一维连通孔相通并且具有比一维连通孔的直径大的直径的三维连通孔。因此，液体树脂不太可能进入一维连通孔，从而减小了模具表面和液体树脂的接触面积，即模具表面对液体树脂是排斥性的。由模具表面界定的模腔中的气体依次通过一维和三维连通孔排出。因此，来自模具表面的成型体的剥离性提高，空隙的产生被抑制。

2. 发明申请

US20110233821A1 COMPRESSION RESIN SEALING AND MOLDING METHOD FOR ELECTRONIC COMPONENT AND APPARATUS THEREFOR 审中-公开
标题翻译：电子元器件及其设备的压缩树脂密封和成型方法
公开(公告)号：US20110233821A1
公开(公告)日：2011-09-29
申请号：US13121554
申请日：2009-09-25
申请人： Kazuhiko Bandoh , Keiji Maeda , Kunihiko Fujiwara , Noritoshi Nakano
发明人： Kazuhiko Bandoh , Keiji Maeda , Kunihiko Fujiwara , Noritoshi Nakano
IPC分类号： B29C45/14 , B29C47/88
CPC分类号： B29C43/34 , B29C43/18 , B29C43/36 , B29C48/06 , B29C48/08 , B29C48/9135 , B29C2043/3444 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A compression resin sealing apparatus includes cooling means (64, 104) for each of an upper die (6) and a lower die (10). A gate nozzle (15) including cooling means (154a) is provided in the upper die (6). A cavity (106) for mounting a single substrate is provided in the lower die (10). In this apparatus, a liquid thermosetting resin material (R) in a required amount is supplied into the cavity (106) through the gate nozzle (15). Then, a substrate is supplied between the upper die (6) and the lower die (10), and the upper die (6) and the lower die (10) are clamped to each other. As a result, an electronic component on the substrate is immersed in the liquid thermosetting resin material (R) in the cavity (106). That is, compression resin molding is performed. Here, a temperature of the liquid thermosetting resin material (R) is controlled by the gate nozzle (15) and the cooling means (154a, 64, 104).
摘要翻译：压缩树脂密封装置包括用于上模（6）和下模（10）中的每一个的冷却装置（64,104）。在上模具（6）中设有包括冷却装置（154a）的浇口（15）。用于安装单个基板的空腔（106）设置在下模具（10）中。在该装置中，通过浇口（15）向所述空腔（106）供给所需量的液态热固性树脂材料（R）。然后，在上模（6）和下模（10）之间提供基板，并且上模（6）和下模（10）彼此夹紧。结果，将基板上的电子部件浸渍在空腔（106）中的液体热固性树脂材料（R）中。也就是说，进行压缩树脂成型。这里，液态热固性树脂材料（R）的温度由栅极喷嘴（15）和冷却装置（154a，64,104）控制。

3. 发明申请

US20070069422A1 Method of resin-seal-molding electronic component and apparatus therefor 审中-公开
标题翻译：树脂密封成型电子部件的方法及其装置
公开(公告)号：US20070069422A1
公开(公告)日：2007-03-29
申请号：US11523715
申请日：2006-09-20
申请人： Kazuhiko Bandoh
发明人： Kazuhiko Bandoh
IPC分类号： B29C45/14
CPC分类号： H01L21/565 , B29C45/02 , B29C45/14065 , B29C45/14655 , B29C45/32 , B29C45/64 , B29C2045/14147 , B29C2045/648 , H01L2924/0002 , H01L2924/00
摘要： A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. A plurality of mold structure units are arranged as stacked, wherein a substrate supplying portion for supplying a single before-resin-seal-molding substrate having an electronic component mounted thereon is provided at a mold face (PL) of the molds. Further, a clamp mechanism for simultaneously applying clamping pressure to each of the plurality of mold structure units arranged as stacked. With this structure, the overall structure of the mold for resin-seal-molding an electronic component mounted on the substrate can be simplified. Additionally, resin flash formation on the substrate surface due to variation in the thicknesses of the substrates when resin-seal-molding the electronic component is prevented.
摘要翻译：用于树脂密封成型电子部件的模具由第一模具和第二模具构成。多个模具结构单元被堆叠地布置，其中在模具的模具面（PL）处设置用于供应其上安装有电子部件的单个树脂前密封成型基板的基板供给部。此外，还具有夹持机构，用于同时向堆叠的多个模具结构单元中的每一个施加夹紧压力。通过这种结构，可以简化用于树脂密封成型安装在基板上的电子部件的模具的整体结构。另外，防止了树脂密封成型电子部件时由于基板的厚度的变化而在基板表面上形成树脂。

4. 发明授权

US06594889B1 Method for processing leadframe 失效
标题翻译：处理引线框的方法
公开(公告)号：US06594889B1
公开(公告)日：2003-07-22
申请号：US09436315
申请日：1999-11-08
申请人： Kazuhiko Bandoh , Michio Osada , Tsuyoshi Amakawa , Yoshihiko Kojima , Fumio Takashima , Kouichi Kawamura
发明人： Kazuhiko Bandoh , Michio Osada , Tsuyoshi Amakawa , Yoshihiko Kojima , Fumio Takashima , Kouichi Kawamura
IPC分类号： H01R4300
CPC分类号： H01L21/67144 , H01L2924/0002 , Y10T29/49121 , Y10T29/5137 , Y10T29/53187 , H01L2924/00
摘要： A method of processing a leadframe involves steps of transporting a leadframe to load it into a lead processing unit including plural sets of processing presses; adjusting a press pitch of the processing presses according to a work pitch of workpieces on the leadframe by rotating a nut member that is coupled to at least one of the processing presses and engaged on a non-rotating screw shaft extending in the transport direction of the leadframe, so that the nut member moves along the screw shaft and the respective processing press coupled thereto moves with the nut member; and performing a predetermined lead processing on the leadframe using the processing presses after the step of adjusting the press pitch.
摘要翻译：一种处理引线框架的方法涉及输送引线框架以将其加载到包括多组加工印刷机的引线处理单元中的步骤; 通过旋转与至少一个处理压力机连接的螺母构件，并且在沿着输送方向的延伸方向延伸的非旋转螺杆轴上啮合，根据工件在引线框架上的工作间距来调整加工压力机的压头间距引线框架，使得螺母构件沿着螺杆轴移动，并且与其连接的相应的处理压力机与螺母构件一起移动; 以及在调整压头间距的步骤之后使用处理机按压在引线框上执行预定的引线处理。

5. 发明授权

US6007316A Apparatus for molding resin to seal electronic parts 失效
标题翻译：用于模塑树脂以密封电子部件的装置
公开(公告)号：US6007316A
公开(公告)日：1999-12-28
申请号：US977827
申请日：1997-11-25
申请人： Kazuhiko Bandoh
发明人： Kazuhiko Bandoh
IPC分类号： B29C45/14 , B29C31/08 , B29C45/02 , B29C45/18 , B29C45/42
CPC分类号： B29C45/1468 , Y10S425/201
摘要： A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.
摘要翻译：用于模塑树脂以密封电子部件的方法和设备适于使用模制单元与模制树脂材料密封安装在引线框架上的电子部件。相对于成型装置中已经设置的第一模制单元可拆卸地安装附加的模制单元，从而可以任意调整模制单元的数量。以这种方式，可以容易地重新配置或重新布置方法和装置，以适应相同或不同类型的模制部件的批量生产或小批量生产。通过同时进行各种处理步骤，总体处理时间减少。

6. 发明授权

US5750059A Method of molding resin to seal electronic parts 失效
标题翻译：树脂密封电子零件的方法
公开(公告)号：US5750059A
公开(公告)日：1998-05-12
申请号：US268849
申请日：1994-06-29
申请人： Kazuhiko Bandoh
发明人： Kazuhiko Bandoh
IPC分类号： B29C45/14 , B29C33/30 , B29C45/02
CPC分类号： B29C45/1468 , H01L2924/0002
摘要： A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.
摘要翻译：用于模塑树脂以密封电子部件的方法和设备适于使用模制单元与模制树脂材料密封安装在引线框架上的电子部件。相对于成型装置中已经设置的第一模制单元可拆卸地安装附加的模制单元，从而可以任意调整模制单元的数量。以这种方式，可以容易地重新配置或重新布置方法和装置，以适应相同或不同类型的模制部件的批量生产或小批量生产。通过同时进行各种处理步骤，总体处理时间减少。

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