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1. 发明授权

US07287975B2 Resin mold material and resin mold 有权
标题翻译：树脂模具材料和树脂模具
公开(公告)号：US07287975B2
公开(公告)日：2007-10-30
申请号：US10855210
申请日：2004-05-26
申请人： Kazuhiko Bandoh , Keiji Maeda , Takaki Kuno , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Kazuhiko Bandoh , Keiji Maeda , Takaki Kuno , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B29C33/10
CPC分类号： B29C33/56 , B29C33/10 , B29C45/14655 , B29C45/34 , B29C70/72 , H01L2224/48091 , Y10S425/812 , H01L2924/00014
摘要： A resin mold material includes one-dimensional communicating holes extending substantially linearly from a mold surface and having diameters from 1 nm to less than 10 μm; a surface layer including the mold surface and the one-dimensional communicating holes; a support layer covering a back of the surface layer; and three-dimensional communicating holes communicating with the one-dimensional communicating holes in the support layer and having diameters larger than those of the one-dimensional communicating holes. Accordingly, a liquid resin is unlikely to enter the one-dimensional communicating holes, thereby reducing a contact area of the mold surface and the liquid resin, i.e., the mold surface is repellant to the liquid resin. Gas in a mold cavity bounded by the mold surface is discharged through the one-dimensional and three-dimensional communicating holes sequentially. Consequently, a release property of a molded product from the mold surface is improved and generation of voids is suppressed.
摘要翻译：树脂模具材料包括从模具表面基本上线性延伸并且具有从1nm到小于10μm的直径的一维连通孔; 包括模具表面和一维连通孔的表面层; 覆盖表层的背面的支撑层; 以及与支撑层中的一维连通孔相通并且具有比一维连通孔的直径大的直径的三维连通孔。因此，液体树脂不太可能进入一维连通孔，从而减小了模具表面和液体树脂的接触面积，即模具表面对液体树脂是排斥性的。由模具表面界定的模腔中的气体依次通过一维和三维连通孔排出。因此，来自模具表面的成型体的剥离性提高，空隙的产生被抑制。

2. 发明申请

US20080296532A1 Low Adhesion Material, Resin Molding Die, and Soil Resistant Material 审中-公开
标题翻译：低粘合材料，树脂成型模和抗土材料
公开(公告)号：US20080296532A1
公开(公告)日：2008-12-04
申请号：US11920421
申请日：2006-12-27
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya , Seiichi Suda
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya , Seiichi Suda
IPC分类号： C09K3/00 , B28B1/00
CPC分类号： B29C33/56 , B29C33/60 , C04B35/50 , C04B35/505 , C04B35/645 , C04B2235/3213 , C04B2235/3225 , C04B2235/3227
摘要： A resin molding die has a molding surface formed of a low adhesion material formed of a solid solution of La—Y2O3 produced from Y2O3 and an other oxide of La2O3. La2O3 contains La, which has an ionic radius larger than Y3+, and is larger in basicity than Y2O3. The low adhesion material contains La2O3 at a predetermined ratio relative to a total of Y2O3 and La2O3. The low adhesion material thus has a large iconic radius contributing to a smaller number of sites per unit area than Y2O3, a larger basicity contributing to a smaller force binding the low adhesion material with a basic substance than Y2O3, and a ratio contributing to shape retention. The low adhesion material thus less adhesive and more shape-retentive than Y2O3 configures the molding surface. A low adhesion material that is less adhesive to a basic substance than Y2O3 is and excellently shape-retentive, and an excellently releasable and shape-retentive resin molding die can thus be obtained.
摘要翻译：树脂成形模具具有由由Y 2 O 3制成的La-Y 2 O 3和La 2 O 3的其它氧化物的固溶体形成的低粘合性材料形成的成型面。 La2O3含有大于Y3 +的离子半径的La，其碱度比Y2O3大。低粘附性材料相对于Y 2 O 3和La 2 O 3的总量以预定比例含有La 2 O 3。因此，低粘附性材料具有大的标志性半径，有助于每单位面积比Y2O3更少的位置数，较大的碱度有助于结合低粘合材料与碱性物质比Y2O3更小的力，以及有助于形状保持的比例。因此，低粘合性材料因此比Y2O3更少的粘合性和更形状保持性构成了模制表面。与Y 2 O 3相比，对碱性物质的粘合性较差的低粘合性材料具有良好的保持性，因此可以获得良好的脱模性和形状保持性的树脂成型模具。

3. 发明申请

US20080254286A1 Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin 有权
标题翻译：评价粘合性能，低粘合性材料和模塑树脂模具的方法
公开(公告)号：US20080254286A1
公开(公告)日：2008-10-16
申请号：US10571683
申请日：2005-03-03
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
IPC分类号： B32B7/06
CPC分类号： B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
摘要： A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：流体树脂与其接触的上模的模具表面具有氧化物。氧化物含有金属阳离子和离子。场强基于金属阳离子的价数和离子的离子半径计算。基于在强度值和固化树脂与模具表面之间的粘合强度之间建立的预定关系，评估固化树脂和模具表面之间的脱模性。由此，建立了评价固化树脂与模具表面之间的剥离性的方法。通过该评价方法，可以容易地提供具有高脱模性的材料。此外，如果将具有高脱模性的材料用于上模的模具表面，则可以获得具有优异的脱模性的树脂模制用模具。

4. 发明授权

US07732037B2 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material 失效
标题翻译：导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
公开(公告)号：US07732037B2
公开(公告)日：2010-06-08
申请号：US10557003
申请日：2005-01-25
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B32B3/24 , C04B38/02 , B29C33/38
CPC分类号： B29C43/18 , B29C33/10 , B29C33/3814 , B29C43/10 , B29C45/14639 , B29C45/345 , B29C2043/3222 , C04B38/02 , C04B2111/00267 , C04B2111/00293 , H01L2224/48091 , H01L2924/181 , Y10T428/24273 , Y10T428/24322 , Y10T428/249953 , Y10T428/249956 , Y10T428/249957 , Y10T428/249969 , Y10T428/249986 , C04B35/00 , H01L2924/00014 , H01L2924/00012
摘要： A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
摘要翻译：导电性多孔材料包括具有氧化物烧结体的基体，在基体中形成的连通孔，具有小直径并且可透气并且不可渗透气体以外的物质，导电层设置在内壁上连通开口并接收电流以产生热量。作为导电材料，有机物粘附在连通孔的内壁上。为了解决这个问题，导电层产生热分解，从而除去有机物质，从而防止连通开口堵塞。

5. 发明申请

US20090107361A1 Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material 有权
标题翻译：低粘合材料，树脂成型模具和抗土材料
公开(公告)号：US20090107361A1
公开(公告)日：2009-04-30
申请号：US11988802
申请日：2006-12-27
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： C09D1/00
CPC分类号： B29C33/38 , B29C33/56 , C04B37/001 , C04B2237/34 , C04B2237/348
摘要： An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).
摘要翻译：上模具（1）具有构成空腔（4）的内底面（5）的空腔构件（6）和周围构件（7）。空腔构件（6）由根据本发明的低粘合材料形成，并且包括主体部分（8）和形成在主体部分（8）的下表面（9）上的表面层（10）流体树脂。主体部分（8）由3YSZ的第一材料和以预定比例混合的ZrN的第二材料形成。表面层（10）由相对于固化树脂具有低粘合性的Y 2 O 3形成，并且具有比体部（8）的热膨胀系数小的热膨胀系数。通过在高温下接合主体部分（8）和表面层（10），然后将其冷却，由于其热膨胀系数的差异，在表面层（10）中引起压缩残余应力，压缩残余应力存在于表面层（10）中。

6. 发明授权

US07784764B2 Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material 有权
标题翻译：低粘合性材料，使用其的树脂成型用模具和防污染防止材料
公开(公告)号：US07784764B2
公开(公告)日：2010-08-31
申请号：US11262897
申请日：2005-11-01
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
IPC分类号： B29C33/38 , B32B3/24
CPC分类号： B29C33/60 , B29C33/56 , B29C45/02 , B29C45/37 , B29C70/72 , Y10T428/12549 , Y10T428/1259
摘要： A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：将含有稀土元素的低粘合材料作为层或膜形成在用于模制树脂的模具的模具表面上。低粘合性材料的主要成分是稀土类化合物，以Y2O3为例。低粘合性材料中的稀土类化合物的含量为40体积％以上。由此，能够得到脱模性优异的树脂成形用模具。

7. 发明授权

US07614293B2 Method of evaluating adhesion property, low-adhesion material, and mold for molding resin 有权
标题翻译：粘合性评价方法，低粘合性材料和树脂成形用模具
公开(公告)号：US07614293B2
公开(公告)日：2009-11-10
申请号：US10571683
申请日：2005-03-03
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima , Seiichi Suda , Masato Yoshiya , Norio Yamaguchi
IPC分类号： G01N19/04
CPC分类号： B29C33/38 , B29C33/56 , G01N19/04 , H01L2224/48091 , Y10T428/2839 , H01L2924/00014
摘要： A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：流体树脂与其接触的上模的模具表面具有氧化物。氧化物含有金属阳离子和离子。场强基于金属阳离子的价数和离子的离子半径计算。基于在强度值和固化树脂与模具表面之间的粘合强度之间建立的预定关系，评估固化树脂和模具表面之间的脱模性。由此，建立了评价固化树脂与模具表面之间的剥离性的方法。通过该评价方法，可以容易地提供具有高脱模性的材料。此外，如果将具有高脱模性的材料用于上模的模具表面，则可以获得具有优异的脱模性的树脂模制用模具。

8. 发明申请

US20060286346A1 Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material 失效
标题翻译：导电性多孔材料，使用其的树脂成型模具及制备导电性多孔材料的方法
公开(公告)号：US20060286346A1
公开(公告)日：2006-12-21
申请号：US10557003
申请日：2005-01-25
申请人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Keiji Maeda , Yoshinori Noguchi , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B32B3/10
CPC分类号： B29C43/18 , B29C33/10 , B29C33/3814 , B29C43/10 , B29C45/14639 , B29C45/345 , B29C2043/3222 , C04B38/02 , C04B2111/00267 , C04B2111/00293 , H01L2224/48091 , H01L2924/181 , Y10T428/24273 , Y10T428/24322 , Y10T428/249953 , Y10T428/249956 , Y10T428/249957 , Y10T428/249969 , Y10T428/249986 , C04B35/00 , H01L2924/00014 , H01L2924/00012
摘要： A conductive porous material includes a matrix having a sintered compact of an oxide, a communicating opening formed in the matrix, having a small diameter and being permeable to gas and impermeable to substance other than gas, and a conductive layer provided on an internal wall of the communicating opening and receiving a current to generate heat. As conductive material is used, an organic substance adheres on the internal wall of communicating opening. To address this, conductive layer is caused to generate heat to decompose and thus remove the organic substance and thus prevent the communicating opening from clogging.
摘要翻译：导电性多孔材料包括具有氧化物烧结体的基体，在基体中形成的连通孔，具有小直径并且可透气并且不可渗透气体以外的物质，导电层设置在内壁上连通开口并接收电流以产生热量。作为导电材料，有机物粘附在连通孔的内壁上。为了解决这个问题，导电层产生热分解，从而除去有机物质，从而防止连通开口堵塞。

9. 发明申请

US20060093693A1 Low-adhesion material and mold for molding resin using the same 有权
标题翻译：低粘附性材料和模塑树脂使用它们
公开(公告)号：US20060093693A1
公开(公告)日：2006-05-04
申请号：US11262897
申请日：2005-11-01
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Seiichi Suda , Satoshi Kitaoka , Naoki Kawashima , Masato Yoshiya
IPC分类号： B29C70/44
CPC分类号： B29C33/60 , B29C33/56 , B29C45/02 , B29C45/37 , B29C70/72 , Y10T428/12549 , Y10T428/1259
摘要： A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.
摘要翻译：将含有稀土元素的低粘合材料作为层或膜形成在用于模制树脂的模具的模具表面上。低附着材料的主要成分是稀土类化合物，作为实例使用Y 2 O 3 O 3。低粘合性材料中的稀土类化合物的含量为40体积％以上。由此，能够得到脱模性优异的树脂成形用模具。

10. 发明授权

US07901797B2 Low-adhesion material, resin molding die, and soil resistant material 有权
标题翻译：低粘附性材料，树脂成型模具和防污材料
公开(公告)号：US07901797B2
公开(公告)日：2011-03-08
申请号：US11988802
申请日：2006-12-27
申请人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
发明人： Takaki Kuno , Yoshinori Noguchi , Keiji Maeda , Satoshi Kitaoka , Naoki Kawashima
IPC分类号： B32B9/00
CPC分类号： B29C33/38 , B29C33/56 , C04B37/001 , C04B2237/34 , C04B2237/348
摘要： An upper die has a cavity member constituting an inner bottom surface of a cavity, and a surrounding member. The cavity member is formed of a low adhesion material in accordance with the present invention, and includes a body portion and a surface layer formed on an undersurface of the body portion exposed to a fluid resin. The body portion is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer is formed of Y2O3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.
摘要翻译：上模具有构成腔的内底面的空腔构件和周围构件。空腔构件由根据本发明的低粘合材料形成，并且包括主体部分和形成在暴露于流体树脂的主体部分的下表面上的表面层。主体部分由3YSZ的第一材料和以预定比例混合的ZrN的第二材料形成。表面层由相对于固化树脂具有低粘合性的Y2O3形成，并且具有比主体部分的热膨胀系数小的热膨胀系数。通过在高温下接合主体部分和表面层，然后将其冷却，由于其热膨胀系数的差异，在表面层中引起压缩残余应力，并且表面层中存在压缩残余应力。

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