会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Semiconductor integrated circuit device
    • 半导体集成电路器件
    • US08427798B2
    • 2013-04-23
    • US13034012
    • 2011-02-24
    • Hiroshi ShimomuraMasaru Numano
    • Hiroshi ShimomuraMasaru Numano
    • H02H9/00
    • H02H9/046
    • In one embodiment, a semiconductor integrated circuit includes a power source circuit connected to a terminal of a first high potential side power source and outputs a voltage of a second high potential side power source, and an output transistor outputting an output signal to an output terminal. A cathode of a first diode is connected to the terminal of the first high potential side power source and an anode thereof is connected to the output terminal. A current source and a capacitor are connected between a terminal of the second high potential side power source and the terminal of a low potential side power source. A signal from a connection node of the current source and the capacitor and a control signal are inputted to a logic circuit, and the logic circuit outputs a signal obtained by a logic operation to the control terminal of the output transistor.
    • 在一个实施例中,半导体集成电路包括连接到第一高电位侧电源的端子的电源电路,并输出第二高电位侧电源的电压,以及将输出信号输出到输出端子的输出晶体管 。 第一二极管的阴极连接到第一高电位侧电源的端子,其阳​​极连接到输出端子。 电流源和电容器连接在第二高电位侧电源的端子和低电位侧电源的端子之间。 来自电流源和电容器的连接节点的信号和控制信号被输入到逻辑电路,并且逻辑电路将通过逻辑运算获得的信号输出到输出晶体管的控制端子。
    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08058694B2
    • 2011-11-15
    • US11812291
    • 2007-06-18
    • Hiroshi Shimomura
    • Hiroshi Shimomura
    • H01L27/088
    • H01L29/4238H01L29/78
    • In a semiconductor device, such as a MOSFET or the like, which is a high-frequency LSI achieving a low noise figure and a high maximum oscillation frequency and which has unit cells with a ring-shaped gate electrode arranged in an array, gate drawing wires connecting together the gate electrode and gate contact pad portions are arranged on a region excluding a drain region and a source region, that is, on an isolation region. Bending portions of the ring-shaped gate electrode are all formed on the isolation region. This therefore permits an improvement in high frequency characteristics such as noise, the maximum oscillation frequency, and the like while eliminating unnecessary gate capacity addition, and also permits small characteristic variation even if a machining shape of the bending portions of the gate electrode is unstable.
    • 在作为实现低噪声系数和高最大振荡频率的高频LSI的MOSFET等半导体装置中,具有排列成阵列的环状栅电极的单位电池,栅极图 将栅电极和栅极接触焊盘部分连接在一起的导线布置在排除区域和源极区域之外的区域上,即在隔离区域上。 环形栅电极的弯曲部分都形成在隔离区域上。 因此,能够在消除不必要的栅极容量添加的同时,能够提高高频特性,例如噪声,最大振荡频率等,并且即使栅电极的弯曲部分的加工形状不稳定也允许小的特性变化。
    • 4. 发明授权
    • Throwaway tip and throwaway-type cutting tool
    • 抛出尖端和一次性切割工具
    • US07572087B2
    • 2009-08-11
    • US11830253
    • 2007-07-30
    • Hidehiko NagayaHiroshi Shimomura
    • Hidehiko NagayaHiroshi Shimomura
    • B23B27/02B23B27/14
    • B23C5/109B23C5/207B23C5/2221B23C2200/0416B23C2200/0472B23C2200/201Y10T407/1924Y10T407/1948Y10T407/2202Y10T407/23Y10T407/24
    • A cutting tool including an end-milling tool body having a distal end, and a tip mounted to the distal end. The tip is a substantially planar plate including a first edge corner having an angle of less than 90°, a second edge corner having an angle of greater than 90°, and a third edge corner and a fourth edge corner each having a corner angle of 90°. Alternatively, a plurality of tips are mounted to the distal end, where each tip has first, second, and third straight cutting edges. The second edge being at less than 90° with the first edge and the third edge being at less than 90° with the second edge, and at least one of a first corner between the first and second edges and a second corner between the second and third edges is arranged to project along an outer periphery of the distal end.
    • 一种切削工具,包括具有远端的端铣刀体,以及安装在远端的刀头。 尖端是包括具有小于90°的角度的第一边缘角,具有大于90°的角度的第二边缘角以及第三边角和第四边角, 90°。 或者,多个尖端安装到远端,其中每个尖端具有第一,第二和第三直线切削刃。 所述第二边缘处于小于90°,​​所述第一边缘和所述第三边缘与所述第二边缘处于小于90°,​​并且所述第一边缘和所述第二边缘之间的第一拐角和所述第二边缘和所述第二边缘之间的第二拐角中的至少一个 第三边缘布置成沿着远端的外周突出。
    • 5. 发明申请
    • Semiconductor device
    • 半导体器件
    • US20080122014A1
    • 2008-05-29
    • US11812291
    • 2007-06-18
    • Hiroshi Shimomura
    • Hiroshi Shimomura
    • H01L29/78
    • H01L29/4238H01L29/78
    • In a semiconductor device, such as a MOSFET or the like, which is a high-frequency LSI achieving a low noise figure and a high maximum oscillation frequency and which has unit cells with a ring-shaped gate electrode arranged in an array, gate drawing wires connecting together the gate electrode and gate contact pad portions are arranged on a region excluding a drain region and a source region, that is, on an isolation region. Bending portions of the ring-shaped gate electrode are all formed on the isolation region. This therefore permits an improvement in high frequency characteristics such as noise, the maximum oscillation frequency, and the like while eliminating unnecessary gate capacity addition, and also permits small characteristic variation even if a machining shape of the bending portions of the gate electrode is unstable.
    • 在作为实现低噪声系数和高最大振荡频率的高频LSI的MOSFET等半导体装置中,具有排列成阵列的环状栅电极的单电池,栅极图 将栅电极和栅极接触焊盘部分连接在一起的导线布置在排除区域和源极区域之外的区域上,即在隔离区域上。 环形栅电极的弯曲部分都形成在隔离区域上。 因此,能够在消除不必要的栅极容量添加的同时,能够提高高频特性,例如噪声,最大振荡频率等,并且即使栅电极的弯曲部分的加工形状不稳定也允许小的特性变化。
    • 6. 发明授权
    • Cutting tool and shrink fitting method for the same
    • 切割工具和收缩配合方法相同
    • US06339868B1
    • 2002-01-22
    • US09456548
    • 1999-12-08
    • Hidehiko NagayaHiroshi Shimomura
    • Hidehiko NagayaHiroshi Shimomura
    • B23P1102
    • B23P11/027B23B31/1179Y10T29/49865Y10T279/17957Y10T279/35Y10T403/48Y10T409/303752Y10T409/30952
    • A cutting tool including a tool holding portion and a tool. The tool is configured to be inserted into a hole of the tool holding portion. The tool includes a tool main body, a guide portion, and a shoulder portion. The tool maim body has a tool outer diameter larger than the hole inner diameter of the hole when the tool holding portion is not heated. The guide portion is coaxially connected to the tool main body and configured to position the tool substantially coaxially with respect to the tool holding portion. The guide portion has a guide outer diameter smaller than the hole inner diameter of the hole so that the guide portion is inserted into the hole. The shoulder portion is formed between the tool main body and the guide portion so as to sit on a surface around the hole to support the tool when the guide portion is inserted into the hole.
    • 一种包括工具保持部和工具的切削工具。 该工具被构造成插入到工具保持部的孔中。 该工具包括工具主体,引导部和肩部。 当刀具保持部未被加热时,刀具损伤体具有比孔的孔内径大的刀具外径。 引导部分同轴地连接到工具主体并构造成使工具相对于工具保持部分基本同轴地定位。 引导部具有小于孔的孔内径的引导外径,使得引导部插入孔中。 肩部形成在工具主体和引导部之间,以便在导向部插入孔时坐在孔周围的表面上,以支撑工具。