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1. 发明授权

US06609446B1 Separating apparatus, separating method, and method of manufacturing semiconductor substrate 失效
标题翻译：分离装置，分离方法和制造半导体衬底的方法
公开(公告)号：US06609446B1
公开(公告)日：2003-08-26
申请号：US09495847
申请日：2000-02-01
申请人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita , Hirokazu Kurisu
发明人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita , Hirokazu Kurisu
IPC分类号： B23B2710
CPC分类号： H01L21/67092 , H01L21/76259 , Y10T82/16 , Y10T82/16016 , Y10T82/16065
摘要： When a bonded substrate stack prepared by bonding a first substrate in which a single-crystal Si layer is formed on a porous layer, and an insulating layer is formed on the single-crystal Si layer to a second substrate is to be separated at the porous layer, serrate defects at the peripheral portion of the separated substrates are prevented. A fluid is ejected from an ejection nozzle (112) and injected into the porous layer of a bonded substrate stack (30) while rotating the bonded substrate stack (30) about an axis (C) in a direction (R), thereby separating the bonded substrate stack (30) into two substrates at the porous layer. When the peripheral portion of the bonded substrate stack (30) is to be separated, the ejection nozzle (112) is located within a range (B).
摘要翻译：当在多晶层上形成单晶Si层的第一衬底与第二衬底之间形成绝缘层而制备的键合衬底叠层在多孔可以防止分离的基板的周边部分的层，锯齿状缺陷。从喷嘴（112）喷射流体并将其注入到键合衬底叠层（30）的多孔层中，同时使键合衬底叠层（30）绕轴线（C）沿方向（R）旋转，从而将键合衬底叠层（30）在多孔层上形成两个衬底。当键合衬底叠层（30）的周边部分被分离时，喷嘴（112）位于范围（B）内。

2. 发明授权

US06900114B2 Separating apparatus, separating method, and method of manufacturing semiconductor substrate 失效
标题翻译：分离装置，分离方法和制造半导体衬底的方法
公开(公告)号：US06900114B2
公开(公告)日：2005-05-31
申请号：US10602922
申请日：2003-06-25
申请人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita , Hirokazu Kurisu
发明人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita , Hirokazu Kurisu
IPC分类号： H01L27/12 , H01L21/00 , H01L21/02 , H01L21/762 , H01L21/763 , H01L21/30 , H01L21/46
CPC分类号： H01L21/67092 , H01L21/76259 , Y10T82/16 , Y10T82/16016 , Y10T82/16065
摘要： When a bonded substrate stack prepared by bonding a first substrate in which a single-crystal Si layer is formed on a porous layer, and an insulating layer is formed on the single-crystal Si layer to a second substrate is to be separated at the porous layer, serrate defects at the peripheral portion of the separated substrates are prevented. A fluid is ejected from an ejection nozzle (112) and injected into the porous layer of a bonded substrate stack (30) while rotating the bonded substrate stack (30) about an axis (C) in a direction (R), thereby separating the bonded substrate stack (30) into two substrates at the porous layer. When the peripheral portion of the bonded substrate stack (30) is to be separated, the ejection nozzle (112) is located within a range (B).
摘要翻译：当在多晶层上形成单晶Si层的第一衬底与第二衬底之间形成绝缘层而制备的键合衬底叠层在多孔可以防止分离的基板的周边部分的层，锯齿状缺陷。从喷嘴（112）喷射流体并将其注入到键合衬底叠层（30）的多孔层中，同时使键合衬底叠层（30）绕轴线（C）沿方向（R）旋转，从而将键合衬底叠层（30）在多孔层上形成两个衬底。当键合衬底叠层（30）的周边部分被分离时，喷嘴（112）位于范围（B）内。

3. 发明授权

US06746559B2 Method and apparatus for separating composite member using fluid 有权
公开(公告)号：US06746559B2
公开(公告)日：2004-06-08
申请号：US10202022
申请日：2002-07-25
申请人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
发明人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , H01L21/6838 , Y10T29/49821 , Y10T83/364 , Y10T156/1137 , Y10T156/1374 , Y10T156/1922 , Y10T156/1933 , Y10T156/1939
摘要： To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.

4. 发明授权

US06391743B1 Method and apparatus for producing photoelectric conversion device 失效
标题翻译：光电转换装置的制造方法及装置
公开(公告)号：US06391743B1
公开(公告)日：2002-05-21
申请号：US09401775
申请日：1999-09-22
申请人： Masaaki Iwane , Takao Yonehara , Kazuaki Ohmi , Shoji Nishida , Kiyofumi Sakaguchi , Kazutaka Yanagita
发明人： Masaaki Iwane , Takao Yonehara , Kazuaki Ohmi , Shoji Nishida , Kiyofumi Sakaguchi , Kazutaka Yanagita
IPC分类号： H01L2130
CPC分类号： H01L31/072 , H01L21/67092 , H01L21/76254 , H01L2221/68363 , Y02E10/50
摘要： There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.
摘要翻译：公开了一种制造光电转换装置的方法，包括以下步骤：形成包括第一和第二半导体层的半导体衬底，其间具有分离层; 将支撑基板接合到与分离层侧表面相对的第二半导体层的表面，以形成键合衬底; 通过分离层分离第一和第二半导体层; 以及在所述第二半导体层中制造光电转换器件，其中当将所述半导体衬底和所述支撑衬底彼此接合时，至少一部分形成在所述键合衬底中，其中所述半导体衬底和所述支撑衬底的至少一部分端部和支撑基板不与另一个基板接合，并且流体相对于键合衬底的侧表面喷射，从而分离第一和第二半导体层。该方法可以以高产率分离粘合的基片，从而以低的生产成本提供高质量的光电转换装置。

5. 发明授权

US06605518B1 Method of separating composite member and process for producing thin film 失效
标题翻译：分离复合材料的方法和制备薄膜的方法
公开(公告)号：US06605518B1
公开(公告)日：2003-08-12
申请号：US09558657
申请日：2000-04-26
申请人： Kazuaki Ohmi , Katsumi Nakagawa , Nobuhiko Sato , Kiyofumi Sakaguchi , Kazutaka Yanagita , Takao Yonehara
发明人： Kazuaki Ohmi , Katsumi Nakagawa , Nobuhiko Sato , Kiyofumi Sakaguchi , Kazutaka Yanagita , Takao Yonehara
IPC分类号： H01L2146
CPC分类号： H01L21/76259 , Y10S438/96
摘要： To cause a crack at a fixed position in a separation layer, a method of separating a composite member includes the steps of forming a separation layer inside a composite member, forming inside the separation layer a stress riser layer in which an in-plane stress has concentratedly been produced to an extent that does not cause separation by the in-plane stress, and enlarging the in-plane stress to cause a crack in the stress riser layer, thereby separating the composite member.
摘要翻译：为了在分离层中的固定位置产生裂纹，分离复合构件的方法包括在复合构件内部形成分离层的步骤，在分离层的内部形成面内应力的应力提升层集中制造到不会由于面内应力而产生分离，扩大面内应力，引起应力提升层的裂纹，从而分离复合部件。

6. 发明授权

US06475323B1 Method and apparatus for separating composite member using fluid 有权
公开(公告)号：US06475323B1
公开(公告)日：2002-11-05
申请号：US09721816
申请日：2000-11-24
申请人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
发明人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , H01L21/6838 , Y10T29/49821 , Y10T83/364 , Y10T156/1137 , Y10T156/1374 , Y10T156/1922 , Y10T156/1933 , Y10T156/1939
摘要： To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.

7. 发明授权

US06382292B1 Method and apparatus for separating composite member using fluid 失效
标题翻译：使用流体分离复合构件的方法和装置
公开(公告)号：US06382292B1
公开(公告)日：2002-05-07
申请号：US09047327
申请日：1998-03-25
申请人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
发明人： Kazuaki Ohmi , Takao Yonehara , Kiyofumi Sakaguchi , Kazutaka Yanagita
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , H01L21/6838 , Y10T29/49821 , Y10T83/364 , Y10T156/1137 , Y10T156/1374 , Y10T156/1922 , Y10T156/1933 , Y10T156/1939
摘要： To separate a composite member consisting of a plurality of bonded members without destructing or damaging it, a fluid is jetted against the composite member from a nozzle to separate it into a plurality of members at a position different from a bonding position.
摘要翻译：为了分离由多个结合构件组成的复合构件而不破坏或损坏复合构件，从喷嘴将流体喷射到复合构件上，以在与结合位置不同的位置处将其分离成多个构件。

8. 发明授权

US06860963B2 Sample separating apparatus and method, and substrate manufacturing method 失效
标题翻译：样品分离装置和方法，以及基板制造方法
公开(公告)号：US06860963B2
公开(公告)日：2005-03-01
申请号：US10318231
申请日：2002-12-12
申请人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
发明人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
IPC分类号： B26D3/28 , B26D7/04 , B26F3/00 , H01L21/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/76 , B32B35/00
CPC分类号： H01L21/6835 , B26F3/004 , H01L21/67092 , H01L2221/68363 , H01L2924/30105 , Y10S156/941 , Y10T29/49821 , Y10T83/364 , Y10T156/11 , Y10T156/1126 , Y10T156/1137 , Y10T156/19 , Y10T156/1928 , Y10T156/1933 , Y10T156/1939
摘要： This invention is to provide an apparatus for separating a substrate having a porous layer at the porous layer. A bonded substrate stack (101) having a porous layer (101b) is supported by substrate holding portions (120, 150) while being rotated. High-speed, high-pressure water (jet) is ejected from a nozzle (102), so the jet is injected into the bonded substrate stack (101). The substrate holding portions (120, 150) hold the bonded substrate stack (101) such that the bonded substrate stack (101) can expand at its central portion due to the pressure of the injected water. This efficiently applies a force (separation force) that acts outward from the inside of the bonded substrate stack (101).
摘要翻译：本发明提供一种用于在多孔层处分离具有多孔层的基板的装置。具有多孔层（101b）的键合衬底叠层（101）在旋转的同时由衬底保持部（120,150）支撑。从喷嘴（102）喷出高速，高压的水（射流），将射流喷射到键合衬底叠层（101）中。衬底保持部分（120,150）保持键合衬底叠层（101），使得键合衬底叠层（101）可以由于注入的水的压力而在其中心部分膨胀。这有效地施加从键合衬底叠层（101）的内部向外作用的力（分离力）。

9. 发明授权

US06773534B2 Sample processing apparatus and method 失效
标题翻译：样品处理设备和方法
公开(公告)号：US06773534B2
公开(公告)日：2004-08-10
申请号：US10175201
申请日：2002-06-20
申请人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
发明人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , Y10S156/942 , Y10T29/49821 , Y10T83/364 , Y10T156/1121 , Y10T156/1126 , Y10T156/1374 , Y10T156/1922 , Y10T156/1939 , Y10T156/1978
摘要： This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively. More specifically, the first region is separated by a jet ejected from a nozzle (102) while rotating the bonded substrate stack (101). On the other hand, the second region is separated by an ultrasonic wave generated by an ultrasonic vibrator (1203).
摘要翻译：本发明可以防止当具有分离层的键合衬底叠层分离时产生的缺陷。具有多孔层（101b）的键合衬底叠层（101）在第一和第二工艺的两个步骤中分离。在第一种方法中，一边旋转键合衬底叠层（101），一边将多孔层（101b）的中央部分离开而分离出键合衬底叠层（101），一边喷射到多孔层（101b）地区。在第二过程中，当停止键合衬底叠层（101）的旋转时，射流被喷射到多孔层（101b）。从预定方向向未分离区域施加力，以完全分离键合衬底叠层（101）。此外，分别使用喷射和超声波分离具有多孔层（101b）的键合衬底叠层（101）的第一区域（周边部分）和第二区域（中心部分）。更具体地，在旋转键合衬底叠层（101）的同时，通过从喷嘴（102）喷出的射流来分离第一区域。另一方面，第二区域由超声波振子（1203）产生的超声波分离。

10. 发明授权

US06609553B2 Sample processing apparatus and method 失效
公开(公告)号：US06609553B2
公开(公告)日：2003-08-26
申请号：US10175004
申请日：2002-06-20
申请人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
发明人： Kazutaka Yanagita , Takao Yonehara , Kazuaki Omi , Kiyofumi Sakaguchi
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , Y10S156/942 , Y10T29/49821 , Y10T83/364 , Y10T156/1121 , Y10T156/1126 , Y10T156/1374 , Y10T156/1922 , Y10T156/1939 , Y10T156/1978
摘要： This invention prevents defects generated when a bonded substrate stack having a separation layer is separated. A bonded substrate stack (101) having a porous layer (101b) is separated in two steps of the first and second processes. In the first process, a jet is ejected to the porous layer (101b) while rotating the bonded substrate stack (101) to partially separate the bonded substrate stack (101) while leaving the central portion of the porous layer (101b) as an unseparated region. In the second process, the jet is ejected to the porous layer (101b) while rotation of the bonded substrate stack (101) is stopped. A force is applied to the unseparated region from a predetermined direction to completely separate the bonded substrate stack (101). Also, the first region (peripheral portion) and second region (central portion) of the bonded substrate stack (101) having the porous layer (101b) are separated using a jet and ultrasonic wave, respectively. More specifically, the first region is separated by a jet ejected from a nozzle (102) while rotating the bonded substrate stack (101). On the other hand, the second region is separated by an ultrasonic wave generated by an ultrasonic vibrator (1203).

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