专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5772820A Process for fabricating a microwave power device 失效
标题翻译：微波功率器件制造工艺
公开(公告)号：US5772820A
公开(公告)日：1998-06-30
申请号：US685885
申请日：1996-07-25
申请人： Karl F. Schoch, Jr. , Theodore R. Vasilow , Andrew J. Piloto , Deborah P. Partlow , Kenneth C. Radford
发明人： Karl F. Schoch, Jr. , Theodore R. Vasilow , Andrew J. Piloto , Deborah P. Partlow , Kenneth C. Radford
IPC分类号： C01G49/00 , H01P11/00 , B32B31/26 , H01P1/387
CPC分类号： C01G49/009 , H01P11/00 , C01P2002/32 , C01P2002/52 , C01P2004/61 , C01P2006/12 , C01P2006/42 , Y10T156/1075
摘要： Materials and methods for the fabrication of high density, low temperature fired microwave ferrites for use in microwave power devices, transmission line elements, isolators, circulators, and phase shifters. Very fine (sub-micron) ferrite powders made by sol-gel methods are mixed with solvents and binders then tape-cast. Ferrite tapes in the unfired state are cut into complex shapes and may be provided with via holes. These ferrite sheets are fired discretely, or are laminated, cofired with printed metal pastes, or other active and passive ceramic tapes.
摘要翻译：用于制造用于微波功率器件，传输线元件，隔离器，循环器和移相器的高密度，低温烧制微波铁氧体的材料和方法。通过溶胶 - 凝胶法制备的非常细（亚微米）的铁氧体粉末与溶剂和粘合剂混合，然后进行胶带混合。处于未烧结状态的铁氧体磁带被切割成复杂形状并且可以设置有通孔。这些铁氧体片被离散地烧制，或被层压，与印刷的金属膏或其它有源和无源陶瓷带共烧。

2. 发明授权

US5757611A Electronic package having buried passive components 失效
标题翻译：具有埋地无源元件的电子封装
公开(公告)号：US5757611A
公开(公告)日：1998-05-26
申请号：US631397
申请日：1996-04-12
申请人： Stephen R. Gurkovich , Theodore R. Vasilow , Andrew J. Piloto , Deborah P. Partlow , Kenneth C. Radford , Alex E. Bailey
发明人： Stephen R. Gurkovich , Theodore R. Vasilow , Andrew J. Piloto , Deborah P. Partlow , Kenneth C. Radford , Alex E. Bailey
IPC分类号： H01L23/498 , H05K1/03 , H05K1/16 , H05K3/46 , H01G4/06
CPC分类号： H01L23/49822 , H01L23/49894 , H05K1/162 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K3/4688
摘要： The invention provides for an electronic package having a buried passive component such as a capacitor therein, and a method for fabricating the same. The electronic package preferably includes a passive component portion which includes a plurality of layers of high K dielectric material, a signal processing portion which includes a plurality of layers of low K dielectric material, and at least one buffer layer interposed between the passive component portion and the signal processing portion. Metallization is preferably printed upon at least one of the layers of high K dielectric material and at least one of the layers of low K dielectric material. Preferably, the layers are co-fired at a temperature below approximately 1200.degree. C. to form the electronic package and each of the buffer layers contains approximately 25 to 100% barium compound. Via conductors may also be provided through the buffer layers to electrically couple the passive component portion and the signal processing portion and the metallization and the via conductors may be selected from highly conductive materials such as gold, silver, copper and alloys thereof.
摘要翻译：本发明提供一种具有埋入式无源元件（例如电容器）的电子封装及其制造方法。电子封装优选地包括无源元件部分，其包括多层高K电介质材料，信号处理部分，其包括多层低K电介质材料，以及至少一个缓冲层，介于无源元件部分和信号处理部分。金属化优选印刷在高K电介质材料的层中的至少一层和低K电介质材料层中的至少一层中。优选地，这些层在低于约1200℃的温度下共烧以形成电子封装，并且每个缓冲层含有约25至100％的钡化合物。还可以通过缓冲层提供通孔导体，以电耦合无源部件部分和信号处理部分，并且金属化和通孔导体可以选自高导电材料，例如金，银，铜及其合金。

3. 发明授权

US5457598A High capacitance thin film capacitor 失效
标题翻译：大容量薄膜电容器
公开(公告)号：US5457598A
公开(公告)日：1995-10-10
申请号：US225114
申请日：1994-04-08
申请人： Kenneth C. Radford , Stephen R. Gurkovich , Andrew J. Piloto , Deborah P. Partlow
发明人： Kenneth C. Radford , Stephen R. Gurkovich , Andrew J. Piloto , Deborah P. Partlow
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12
CPC分类号： H01G4/306
摘要： A multi-layer capacitor comprising a stack of sheet electrodes with an insulating dielectric layer sandwiched between these layers is disclosed. The dielectric layer formed on the electrode is prepared by the "sol-gel" process.
摘要翻译：公开了一种多层电容器，其包括具有夹在这些层之间的绝缘介电层的片状电极堆叠。通过“溶胶 - 凝胶”法制备在电极上形成的电介质层。

4. 发明授权

US5515054A Dual mode radar transparency and method of fabricating same 失效
标题翻译：双模式雷达透明度及其制造方法
公开(公告)号：US5515054A
公开(公告)日：1996-05-07
申请号：US230564
申请日：1994-04-20
申请人： Kenneth C. Radford , Deborah P. Partlow , Jay E. Lane , Andrew J. Piloto
发明人： Kenneth C. Radford , Deborah P. Partlow , Jay E. Lane , Andrew J. Piloto
IPC分类号： G01S7/02 , G01S7/48 , H01Q1/42 , G01S13/86
CPC分类号： H01Q1/42 , G01S7/02 , G01S7/48
摘要： A dual mode radar transparency allowing passage of both RF radiation and IR radiation comprises an aerogel base and ceramic skin overlaying the aerogel base. The aerogel base comprises a low density ceramic material. A method of fabricating a dual mode radar transparency allowing passage of both RF radiation and IR radiation comprises the steps of preparing a colloidal dispersion of a ceramic material in a medium, increasing a concentration of the colloidal dispersion by evaporation to create a suspension, and placing the suspension in a mold. The suspension is solidified to form an aerogel and the aerogel is joined to a ceramic skin.
摘要翻译：允许RF辐射和IR辐射通过的双模式雷达透明度包括覆盖气凝胶基底的气凝胶基体和陶瓷皮肤。气凝胶基体包括低密度陶瓷材料。制造允许RF辐射和IR辐射通过的双模雷达透明度的方法包括以下步骤：在介质中制备陶瓷材料的胶体分散体，通过蒸发增加胶体分散体的浓度以产生悬浮液，并将悬浮在模具中。将悬浮液固化以形成气凝胶，并将气凝胶连接至陶瓷表皮。

5. 发明授权

US5683528A Method for manufacturing a low loss, low temperature cofired ceramic 失效
标题翻译：低损耗，低温烧结陶瓷的制造方法
公开(公告)号：US5683528A
公开(公告)日：1997-11-04
申请号：US460953
申请日：1995-06-05
申请人： Deborah P. Partlow , Stephen R. Gurkovich , Kenneth C. Radford , Andrew J. Piloto
发明人： Deborah P. Partlow , Stephen R. Gurkovich , Kenneth C. Radford , Andrew J. Piloto
IPC分类号： B32B18/00 , C04B35/16 , C04B35/624 , C04B37/00
CPC分类号： C04B35/16 , B32B18/00 , C04B35/624 , C04B2237/12 , C04B2237/341 , C04B2237/62 , C04B2237/68
摘要： A method for forming a low temperature cofired ceramic package which is made using a multi-layered densified spherical powder formed via a sol-gel process. This densified powder is formed from layers of SiO.sub.2 reacted with trimethyl borate. The spherical powder has a preselected particle size and boron content sufficient to render the low temperature cofired ceramic package fully dense, even in the presence of a second phase filler ceramic, at a sintering temperature below 1000.degree. C. Binder material is added to the spherical powder and ceramic filler to form a plurality of tapes. A ceramic assembly is then formed by layering the plurality of tapes upon one another and firing the ceramic assembly at a temperature below 1025.degree. C. to form a fully dense cofired ceramic package. In order to form the multi-layered densified spherical powder, a silica core, which is formed using a sol-gel process, is reacted with trimethyl borate. An additional layer of silica is provided upon the reacted product which, in turn, is reacted with trimethyl borate. This process is continued until a spherical powder of desired size is formed.
摘要翻译：一种用于形成低温共烧陶瓷封装的方法，其使用通过溶胶 - 凝胶法形成的多层致密球形粉末制成。该致密化粉末由与硼酸三甲酯反应的SiO 2层形成。即使在第二相填料陶瓷的存在下，在低于1000℃的烧结温度下，球形粉末具有足以使低温共烧陶瓷封装完全致密的预选粒度和硼含量。将粘合剂材料加入到球形粉末和陶瓷填料以形成多个带。然后通过将多个带彼此层叠并在低于1025℃的温度下烧制陶瓷组件以形成完全致密的共烧陶瓷封装形成陶瓷组件。为了形成多层致密球形粉末，使用溶胶 - 凝胶法形成的二氧化硅芯与硼酸三甲酯反应。在反应产物上提供另外的二氧化硅层，其又与硼酸三甲酯反应。继续该过程，直到形成所需尺寸的球形粉末。

6. 发明授权

US5769987A Post-firing method for integrating passive devices into ceramic electronic packages 失效
标题翻译：将无源器件集成到陶瓷电子封装中的后焙烧方法
公开(公告)号：US5769987A
公开(公告)日：1998-06-23
申请号：US752110
申请日：1996-11-20
申请人： Stephen R. Gurkovich , Kenneth C. Radford , Alex E. Bailey , Deborah P. Partlow , Andrew J. Piloto
发明人： Stephen R. Gurkovich , Kenneth C. Radford , Alex E. Bailey , Deborah P. Partlow , Andrew J. Piloto
IPC分类号： H01L21/00 , H01L21/48 , H01L25/16 , H05K1/03 , H05K3/40 , H05K3/46 , B32B31/26
CPC分类号： H01L21/67126 , H01L21/4867 , H01L25/165 , H05K3/4614 , H05K3/4629 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/10378 , H05K3/4053 , Y10T156/108
摘要： We disclose a fabrication method for integrating passive devices such as capacitors, resistors and circulators into ceramic packages for electronic systems. The method utilizes a glass or glass/ceramic as a bonding agent which is incorporated as one of the layers in the multilayer package. The integration of such passive devices eliminates the tedious mounting of these devices on the package, permitting a smaller, more reliable, less expensive and lighter weight product. This method allows the integration of passive devices having firing temperatures far different from that of the ceramic package itself, permitting combinations of materials that cannot be densified, or cofired together.
摘要翻译：我们公开了一种用于将诸如电容器，电阻器和循环器的无源器件集成到用于电子系统的陶瓷封装中的制造方法。该方法使用玻璃或玻璃/陶瓷作为粘合剂，其作为多层包装中的一个层结合。这种无源设备的集成消除了这些设备在包装上繁琐的安装，允许更小，更可靠，更便宜和更轻重量的产品。该方法允许将具有与陶瓷封装本身的烧制温度非常不同的烧制温度的无源器件集成，允许不能被致密化或共烧在一起的材料的组合。

7. 发明授权

US5774025A Planar phase shifters using low coercive force and fast switching, multilayerable ferrite 失效
标题翻译：平面移相器采用低矫顽力和快速切换，多层铁素体
公开(公告)号：US5774025A
公开(公告)日：1998-06-30
申请号：US511927
申请日：1995-08-07
申请人： John D. Adam , Steven N. Stitzer , Carol J. Painter , Michael R. Daniel , Deborah P. Partlow , Andrew J. Piloto
发明人： John D. Adam , Steven N. Stitzer , Carol J. Painter , Michael R. Daniel , Deborah P. Partlow , Andrew J. Piloto
IPC分类号： C01G49/00 , H01P11/00 , H01P1/215
CPC分类号： H01P11/00 , C01G49/009 , C01P2002/32 , C01P2002/52 , C01P2004/61 , C01P2006/12 , C01P2006/42
摘要： A planar phase shifter formed of multiple layers of a ferrite. Selected layers of the ferrite are patterned with a conductor and the multiple layers of magnetic dielectric and conductor are cofired. The phase shifter is fabricated by first obtaining ferrite powder. Then, layers of the ferrite are made, preferably by tape casting. Next the ferrite layers are metallized by applying selected amounts of conductive metals in a selected pattern upon the tape. Selected numbers of vias are placed through selected layers of tape and conductive metal is placed in the vias to provide vertical connections through the layers. The tape layers are then stacked in a predetermined order and are laminated. The laminated stack of layers is then fired to a temperature of approximately 800.degree. C. to 1000.degree. C., sintering the laminated layers into one integrated structure.
摘要翻译：由多层铁素体形成的平面移相器。铁氧体的选定层用导体图案化，并且多层磁介电体和导体共烧。通过首先获得铁素体粉末来制造移相器。然后，优选通过带铸造制造铁氧体层。接下来，通过将选定量的导电金属以选定的图案施加在带上，将铁素体层金属化。选定数量的通孔通过选定的磁带层放置，并且导电金属放置在通孔中以提供通过层的垂直连接。然后将胶带层按预定顺序堆叠并层压。然后将层叠的层叠层烧制至约800℃至1000℃的温度，将层压层烧结成一个整体结构。

8. 发明授权

US5744232A Low loss, thick film metallizations for multilayer microwave packaging 失效
标题翻译：低损耗，厚膜金属化用于多层微波包装
公开(公告)号：US5744232A
公开(公告)日：1998-04-28
申请号：US680260
申请日：1996-07-11
申请人： Alex Bailey , Andrew J. Piloto , Deborah P. Partlow
发明人： Alex Bailey , Andrew J. Piloto , Deborah P. Partlow
IPC分类号： H01L23/66 , H05K1/09 , B23B5/16
CPC分类号： H01L23/66 , H01L2924/0002 , H01L2924/09701 , H05K1/092 , Y10T428/25 , Y10T428/256 , Y10T428/257
摘要： A thick film metallization compatible with low temperature cofired ceramics (LTCC) that displays very low microwave insertion losses commensurate with those of thin film gold. However, the disclosed metallization is applied similar to conventional metallizations by screen printing and has no limit to the number of layers achievable. The electrical performance of the metallization is attained by using a spherical metal particle shape and uniform particle size distribution in the thick film paste. The advantage of this invention is that superior microwave performance can be achieved in electronic packages without the cost and limitations imposed by thin film metallization techniques.
摘要翻译：与低温共烧陶瓷（LTCC）兼容的厚膜金属化，其显示与薄膜金相当的非常低的微波插入损耗。然而，所公开的金属化应用通过丝网印刷类似于常规金属化，并且对可实现的层数没有限制。通过在厚膜糊中使用球形金属颗粒形状和均匀的粒度分布来实现金属化的电性能。本发明的优点是在电子封装中可以实现优异的微波性能，而不需要由薄膜金属化技术施加的成本和限制。

9. 发明授权

US5747873A Technique for fabricating hybrid high-temperature superconductor-semiconductor circuits 失效
标题翻译：制造混合高温超导体半导体电路的技术
公开(公告)号：US5747873A
公开(公告)日：1998-05-05
申请号：US721927
申请日：1996-09-27
申请人： Salvador H. Talisa , Michael A. Janocko , Deborah P. Partlow , Andrew J. Piloto
发明人： Salvador H. Talisa , Michael A. Janocko , Deborah P. Partlow , Andrew J. Piloto
IPC分类号： H01L23/498 , H01L23/538 , H01L39/00
CPC分类号： H01L23/5383 , H01L23/49888 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/09701 , H01L2924/15153 , H01L2924/1517
摘要： A system for incorporating superconductor circuits and semiconductor circuits in multilayered structures. A carrier material is chosen that is a good thermal match with the preferred superconductor substrates. The preferred superconductor substrate materials are lanthanum aluminate, magnesium oxide and neodymium gallate. The substrate carrier material should provide adequate thermal match through the range of operating temperatures which are preferably from room temperature to 77K. The preferred carrier material is a low temperature cofired ceramic (LTCC) which allows for multilayered structures to be developed which incorporate the superconductor circuitry and the semiconductor elements. The LTCC is composed of crystalline quartz particles in a borosilicate glass matrix. The percentage of quartz may be adjusted to adjust the thermal expansion characteristics of the LTCC.
摘要翻译：一种用于在多层结构中结合超导体电路和半导体电路的系统。选择与优选的超导体基板良好热匹配的载体材料。优选的超导体衬底材料是铝酸镧，氧化镁和没食子酸钕。衬底载体材料应在优选从室温至77K的操作温度范围内提供足够的热匹配。优选的载体材料是低温共烧陶瓷（LTCC），其允许开发结合了超导体电路和半导体元件的多层结构。 LTCC由硼硅酸盐玻璃基体中的结晶石英颗粒组成。可以调节石英的百分比以调节LTCC的热膨胀特性。

10. 发明授权

US5359488A Packaging system for a standard electronic module 失效
标题翻译：标准电子模块的包装系统
公开(公告)号：US5359488A
公开(公告)日：1994-10-25
申请号：US79767
申请日：1993-06-21
申请人： Kevin A. Leahy , Andrew J. Piloto , John G. McKinley, IV , David B. Harris , Timothy M. Fertig , Keith W. Sparks
发明人： Kevin A. Leahy , Andrew J. Piloto , John G. McKinley, IV , David B. Harris , Timothy M. Fertig , Keith W. Sparks
IPC分类号： H01L23/367 , H01L23/40 , H01L23/58 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/32 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1461 , H01L23/3672 , H01L23/40 , H01L23/585 , H05K1/183 , H05K3/325 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0203 , H05K1/0243 , H05K1/0306
摘要： A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.
摘要翻译：使用多层，低温共烧陶瓷母板提供标准电子模块的封装系统。器件封装，例如RF器件封装，由低温，低电介质，共烧陶瓷材料形成。器件封装安装在主板一侧的复合散热器上。主板相对侧的压板固定在散热片上以压缩设备封装。压力接触互连用于在器件封装和多层母板中的特定导体层之间进行接触。母板中的射频导体层通过主板中提供的接地层与电源和控制层隔离。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式