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    • 2. 发明授权
    • Via transmission lines for multilayer printed circuit boards
    • 通过多层印刷电路板的传输线
    • US07868257B2
    • 2011-01-11
    • US10598134
    • 2005-03-09
    • Taras KushtaKaoru NaritaHirokazu TohyaTakanori SaekiTomoyuki Kaneko
    • Taras KushtaKaoru NaritaHirokazu TohyaTakanori SaekiTomoyuki Kaneko
    • H01R12/04H05K1/11
    • H05K1/0222H05K1/0269H05K3/429H05K2201/09536H05K2201/09618H05K2201/09718H05K2201/09809
    • A via transmission line for a multilayer printed circuit board (PCB) in which a wave guiding channel is formed by a signal via or a number of signal vias, an assembly of ground vias surrounding the signal via or corresponding number of coupled signal vias, a set of ground plates from conductor layers of the multilayer PCB, and a clearance hole. In this via transmission line, the signal via, or the number of signal vias forms an inner conductive boundary, ground vias and ground plates from conductor layers of the multilayer PCB form an outer conductive boundary, and the clearance hole provides both isolation of the inner conductive boundary from the outer conductive boundary and high-performance broadband operation of the via transmission line by means of the predetermined clearance hole cross-sectional shape and dimensions where the cross-sectional shape of the clearance hole is defined by the arrangement of ground vias in the outer conductive boundary and dimensions of the clearance hole are determined according to a method to minimize frequency-dependent return losses caused by specific corrugations of the outer conductive boundary formed by ground plates in the wave guiding channel of the via transmission line.
    • 一种用于多层印刷电路板(PCB)的通孔传输线,其中通过信号通道或多个信号通路形成波导通道,围绕信号通孔或相应数量的耦合信号通孔的接地通孔的组件, 多层PCB的导体层的接地板组以及间隙孔。 在这个通过传输线路中,信号通孔或信号通道的数量形成内部导电边界,从多层PCB的导体层形成的接地孔和接地板形成外部导电边界,并且间隙孔提供内部 通过外部导电边界的导电边界和通孔传输线的高性能宽带操作,借助于预定的间隙孔横截面形状和尺寸,其中间隙孔的横截面形状由接地通孔的布置 根据通过在通孔传输线的波导通道中由接地板形成的外导电边界的特定波纹引起的频率相关的返回损耗的方法来确定间隙孔的外导电边界和尺寸。
    • 5. 发明申请
    • RESONATOR, PRINTED BOARD, AND METHOD FOR MEASURING COMPLEX DIELECTRIC CONSTANT
    • 谐振器,打印板和测量复合电介质常数的方法
    • US20090015266A1
    • 2009-01-15
    • US11817280
    • 2006-03-22
    • Kaoru NaritaTaras Kushta
    • Kaoru NaritaTaras Kushta
    • G01R31/12H01P3/02
    • H05K1/0268G01R27/2617G01R31/2805H05K1/16H05K3/429H05K2201/09618H05K2201/10068
    • A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board.
    • 连接到导体层的多个通孔过孔被布置成在印刷电路板的布置在导体层中的开口部分周围的这些通孔之间留有间隙,其中这些导体层彼此平行设置,以将电介质层夹在 之间。 此外,用于激励的通孔过孔以与导体层非接触的方式设置在导体层的开口部分和与这些开口部分匹配的电介质层的区域。 当测量复介电常数时,对通孔通孔施加高频功率,通过S参数法测量通孔和导体层之间的功率损耗。 结果,可以在从几千兆赫到20GHz的频率范围内以高精度测量该复合介电常数的复介电常数和频率依赖性,即使该谐振器是 安装在板上。