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    • 5. 发明授权
    • Semiconductor manufacturing device and semiconductor manufacturing method
    • 半导体制造装置及半导体制造方法
    • US09458535B2
    • 2016-10-04
    • US14482075
    • 2014-09-10
    • Kabushiki Kaisha Toshiba
    • Katsunori ShibuyaTakashi ImotoSoichi HommaTakeshi WatanabeYuusuke Takano
    • G01R31/20C23C14/50C23C14/54H01L23/552C23C14/56H01L21/677
    • C23C14/50C23C14/54C23C14/56H01L21/67778H01L23/552H01L2924/0002H01L2924/00
    • A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.
    • 半导体制造装置具有输送机,其被配置为输送安装在其上的非屏蔽半导体器件的托盘以通过电磁屏蔽;以及控制器,其被配置为控制输送机。 控制器执行控制以从托盘供应存储托盘取出托盘,托盘供应储存托盘安装在其上的非屏蔽半导体装置以穿过电磁屏蔽,将托盘放置在载体上,并将该载体传送到涂覆非屏蔽的溅射装置 具有用于电磁屏蔽的溅射材料的半导体器件,并且控制器执行控制以从溅射装置取出具有放置在其上的托盘的载体,其中电磁屏蔽的半导体器件安装在托盘上,输送托盘,拾取 所述托盘具有从所述托架安装在其上的所述电磁屏蔽半导体装置,并将所述托盘存储在所述托盘供应储存器中。