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1. 发明授权

US09347620B2 Semiconductor device, and method of manufacturing semiconductor device 有权
标题翻译：半导体装置及半导体装置的制造方法
公开(公告)号：US09347620B2
公开(公告)日：2016-05-24
申请号：US14151192
申请日：2014-01-09
申请人： Kabushiki Kaisha Toshiba
发明人： Hideyuki Kogure , Yuuta Yamada , Takeshi Ikuta , Toshiyuki Hayakawa , Junichi Asada
IPC分类号： F21K99/00 , H05K1/18 , H01L21/78 , H01L23/00 , H01L25/16 , F21Y101/02 , H01L23/31 , H01L21/56
CPC分类号： F21K9/30 , F21K9/20 , F21Y2115/10 , H01L21/561 , H01L21/78 , H01L23/3121 , H01L23/3135 , H01L24/73 , H01L24/97 , H01L25/167 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/15151 , H01L2924/15313 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/186 , H05K2201/10106 , H05K2201/10159 , H01L2924/00012 , H01L2224/83 , H01L2224/85
摘要： According to one embodiment, a semiconductor device includes a board, a controller chip, a semiconductor chip, a sealing portion, and a component. The board includes a first surface and a second surface opposite to the first surface, the first surface comprising a terminal. The controller chip is on the second surface of the board. The semiconductor chip is on the second surface of the board. The sealing portion integrally covers the controller chip and the semiconductor chip and does not cover a region of the second surface of the board. The component is on the region of the second surface of the board to perform an operation with respect to the outside of the semiconductor device.
摘要翻译：根据一个实施例，半导体器件包括板，控制器芯片，半导体芯片，密封部分和部件。板包括与第一表面相对的第一表面和第二表面，第一表面包括端子。控制器芯片位于电路板的第二个表面上。半导体芯片位于板的第二表面上。密封部一体地覆盖控制器芯片和半导体芯片，并且不覆盖板的第二表面的区域。该部件位于板的第二表面的区域上，以对半导体器件的外部进行操作。

2. 发明授权

US09236329B2 Semiconductor memory card 有权
标题翻译：半导体存储卡
公开(公告)号：US09236329B2
公开(公告)日：2016-01-12
申请号：US13786035
申请日：2013-03-05
申请人： Kabushiki Kaisha Toshiba
发明人： Kazuhide Doi , Soichi Homma , Katsuyoshi Watanabe , Taku Nishiyama , Takeshi Ikuta , Naohisa Okumura
IPC分类号： H01L23/495 , H01L23/00 , H01L21/02 , H01L23/31 , G06K19/077
CPC分类号： H01L23/495 , G06K19/07732 , H01L21/0201 , H01L23/3107 , H01L23/49551 , H01L23/49558 , H01L23/49575 , H01L23/49589 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/80 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/451 , H01L2224/48091 , H01L2224/4813 , H01L2224/48137 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/00014 , H01L2924/01029 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor memory card includes a lead frame having external connection terminals, a controller chip mounted on the lead frame and a memory chip mounted on the lead frame. The lead frame, the controller chip, and the memory chip are sealed with a sealing resin layer that has a surface at which the external connection terminals are exposed and a recess surrounding the external connection terminals.
摘要翻译：半导体存储卡包括具有外部连接端子的引线框架，安装在引线框架上的控制器芯片和安装在引线框架上的存储器芯片。引线框架，控制器芯片和存储器芯片由具有外部连接端子露出的表面的密封树脂层和围绕外部连接端子的凹部密封。

3. 发明授权

US09065229B2 USB plural protocol connector system 有权
标题翻译： USB多协议连接器系统
公开(公告)号：US09065229B2
公开(公告)日：2015-06-23
申请号：US13967499
申请日：2013-08-15
申请人： Kabushiki Kaisha Toshiba
发明人： Ryohei Yamaguchi , Takeshi Ikuta
IPC分类号： H01R24/00 , H01R29/00
CPC分类号： H01R29/00
摘要： A USB device has a substrate on which a plurality of USB 2.0 pads and a plurality of USB 3.0 pads are arranged on a fore side of the substrate, a male connector's fore-end part configured to surround the USB 2.0 pads and the USB 3.0 pads, a housing configured to be joined to a base end of the male connector's fore-end part in order to cover at least a rear side of the substrate, and a plurality of lead wires each configured to have one end fixed to an inner surface of the housing and the other end contacted to the USB 3.0 pad corresponding to the lead wire.
摘要翻译： USB设备具有基板，多个USB 2.0焊盘和多个USB 3.0焊盘布置在基板的前侧，阳连接器的前端部分被配置为围绕USB 2.0焊盘和USB 3.0焊盘，壳体，其被构造成接合到所述阳连接器的前端部的基端部以覆盖所述基板的至少后侧;以及多个引线，每个引线被构造成一端固定到所述基板的内表面壳体和另一端与对应于引线的USB 3.0焊盘接触。

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