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    • 1. 发明授权
    • Apparatus for aligning mask and wafer used in semiconductor circuit
element fabrication
    • 用于对准半导体电路元件制造中使用的掩模和晶片的装置
    • US4636626A
    • 1987-01-13
    • US570189
    • 1984-01-12
    • Junji HazamaKinya KatoAkikazu TanimotoHisao Izawa
    • Junji HazamaKinya KatoAkikazu TanimotoHisao Izawa
    • G03F9/00G01J1/20
    • G03F9/7023
    • An alignment apparatus for aligning a semiconductor wafer with an optical mask containing a circuit pattern to be exposed onto the wafer in the fabrication of semiconductor devices by a proximity exposure apparatus. The alignment apparatus includes light beam radiating means for radiating a first and second light beams which are imaged at positions separated by a given gap in a direction substantially perpendicular to two flat sheets, first and second detecting means for respectively detecting the imaging condition of the first and second light beams at the flat sheets, means for relatively moving the light beam radiating means and the flat sheets, and means for discriminating the order of generation of signals from the first and second detecting means, whereby the value of each gap between the selected areas of the two flat sheets at a plurality of places is detected with a high degree of accuracy without changing the gap between the flat sheets thereby making it possible to correct the parallelism, inclination, etc., of the flat sheets.
    • 一种对准装置,用于通过接近曝光装置将半导体晶片与包含要在半导体器件制造中暴露于晶片上的电路图案的光学掩模对准。 对准装置包括光束照射装置,用于辐射第一和第二光束,该第一和第二光束在基本上垂直于两个平板的方向上以给定间隙分开的位置成像;第一和第二检测装置,用于分别检测第一和第二光束的成像条件 并且平板处的第二光束,用于使光束辐射装置和平板相对移动的装置,以及用于鉴别来自第一和第二检测装置的信号的产生顺序的装置,由此所选择的每个间隙之间的值 在不改变平板之间的间隙的情况下以高精度检测多个位置处的两个平板的区域,从而可以校正平板的平行度,倾斜度等。
    • 10. 发明授权
    • Alignment method and exposure apparatus for use in such alignment method
    • 对准方法和用于这种对准方法的曝光装置
    • US5906901A
    • 1999-05-25
    • US580886
    • 1995-12-29
    • Akikazu Tanimoto
    • Akikazu Tanimoto
    • G01B11/00G03F7/20G03F9/00H01L21/027
    • G03F7/70425G03F7/70358G03F9/70
    • In a lithographic process for fabrication of integrated circuit chips, a projection exposure machine is used to print a mask pattern onto each of a plurality of shot areas defined on a substrate, where an alignment method for establishing alignment between each shot area on the substrate and the mask pattern is performed. The alignment method comprises the step of forming on the substrate a regular pattern which comprises a plurality of pattern elements regularly distributed over the plurality of shot areas, and the step of performing an alignment operation based on the position of the regular pattern so as to establish alignment between each of the plurality of shot areas and the mask pattern. An exposure apparatus may be used to form the regular pattern on the substrate. The exposure apparatus comprises a light source for emitting a primary light beam, a beam-splitting optical system for splitting the primary light beam into a plurality of secondary light beams which are coherent with each other, and an objective optical system for modifying each secondary light beam into a substantially plane wave light beam, and for illuminating a region of a photoresist-coated substrate with the secondary light beams at different incident angles, the region of the substrate extending over a plurality of shot areas defined on the substrate, wherein the region is exposed to a regular pattern of light of interference fringes produced on the substrate from the plurality of secondary light beams.
    • 在用于制造集成电路芯片的光刻工艺中,使用投影曝光机将掩模图案印刷到限定在基板上的多个照射区域中的每一个上,其中用于在基板上的每个照射区域之间建立对准的对准方法和 执行掩模图案。 对准方法包括在基板上形成规则图案的步骤,该规则图案包括规则分布在多个拍摄区域上的多个图案元素,以及基于规则图案的位置执行对准操作的步骤,以便建立 多个拍摄区域中的每一个与掩模图案之间的对准。 可以使用曝光装置在基板上形成规则图案。 曝光装置包括用于发射主光束的光源,用于将主光束分离成彼此相干的多个次级光束的分束光学系统,以及用于修改每个二次光的物镜光学系统 射入基本上平面的波长光束中,并且用不同入射角的二次光束照射光致抗蚀剂涂覆的基底的区域,衬底的区域延伸在限定在衬底上的多个注射区域上,其中区域 暴露于从多个次级光束在基板上产生的干涉条纹的规则图案。