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    • 4. 发明授权
    • Wafer transfer system
    • 晶圆转移系统
    • US07438514B2
    • 2008-10-21
    • US10963541
    • 2004-10-14
    • Soo-woong LeeHyung-seok ChoiJung-sung HwangSung-hwan Choi
    • Soo-woong LeeHyung-seok ChoiJung-sung HwangSung-hwan Choi
    • B65G49/07
    • H01L21/67017H01L21/67772
    • A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
    • 晶片传送系统和系统中的压力控制方法包括用于接收晶片容器的容纳端口,可操作地连接到负载端口的壳体,用于在晶片容器和壳体之间传送晶片的晶片传送机构,晶片容器 传感器,用于检测装载口上的晶片容器的存在,设置在壳体的第一部分中的变速风扇,设置在面向第一部分的壳体的第二部分中的可变排气单元,该可变排气单元能够 改变来自壳体的空气排出率,以及控制器,用于响应于来自晶片容器传感器的信号,可变地操作变速风扇和可变排气单元。
    • 8. 发明申请
    • Method of controlling pressure in a wafer transfer system
    • 控制晶片传送系统压力的方法
    • US20090053034A1
    • 2009-02-26
    • US12285982
    • 2008-10-17
    • Soo-woong LeeHyung-seok ChoiJung-sung HwangSung-hwan Choi
    • Soo-woong LeeHyung-seok ChoiJung-sung HwangSung-hwan Choi
    • H01L21/677
    • H01L21/67017H01L21/67772
    • A wafer transfer system, and method of controlling pressure in the system, includes a loadport for receiving a wafer container, a housing operably connected to the loadport, a wafer transfer mechanism for transferring a wafer between the wafer container and the housing, a wafer container sensor for detecting a presence of the wafer container on the loadport, a variable speed fan disposed in a first portion of the housing, a variable exhaust unit disposed in a second portion of the housing facing the first portion, the variable exhaust unit being capable of varying an exhaust rate of air from the housing, and a controller for variably operating the variable speed fan and the variable exhaust unit in response to a signal from the wafer container sensor.
    • 晶片传送系统和系统中的压力控制方法包括用于接收晶片容器的容纳端口,可操作地连接到负载端口的壳体,用于在晶片容器和壳体之间传送晶片的晶片传送机构,晶片容器 传感器,用于检测装载口上的晶片容器的存在,设置在壳体的第一部分中的变速风扇,设置在面向第一部分的壳体的第二部分中的可变排气单元,该可变排气单元能够 改变来自壳体的空气排出率,以及控制器,用于响应于来自晶片容器传感器的信号,可变地操作变速风扇和可变排气单元。