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    • 8. 发明申请
    • Phase change memory devices employing cell diodes and methods of fabricating the same
    • 使用单元二极管的相变存储器件及其制造方法
    • US20060186483A1
    • 2006-08-24
    • US11324112
    • 2005-12-30
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L29/76
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 9. 发明授权
    • Nonvolatile semiconductor memory component
    • 非易失性半导体存储器组件
    • US5019881A
    • 1991-05-28
    • US391865
    • 1989-08-10
    • Yun-Seung ShinSung-Oh Chun
    • Yun-Seung ShinSung-Oh Chun
    • G11C17/00H01L21/8247H01L27/115H01L29/788H01L29/792
    • H01L29/7885
    • The invention provides a nonvolatile semiconductor memory component comprising: field region of thick oxide, the first and second active regions surrounded with the field region, the first and second gate insulating layers on the first and second active regions, the first gate of a low resistance formed on the first and second gate insulating layer, the third insulating layer on the first gate of a low resistance the second gate of a low resistance formed on the third insulating layer, the channel region below the first gate insulating layer formed by the first gate, and the highly doped drain and source separated by channel region opposite to the type of the substrate. In addition, the process for forming the transistor with one channel and the substrate diffusion can be achieved on the semiconductor substrate or opposite type well formed on the semiconductor substrate. Programming at a low voltage may be possible and the reliability characteristics of the cell may be improved according to present invention.
    • 本发明提供了一种非易失性半导体存储器组件,包括:厚氧化物的场区域,被场区域包围的第一和第二有源区域,第一和第二有源区域上的第一和第二栅极绝缘层,低电阻的第一栅极 形成在所述第一和第二栅极绝缘层上,所述第一栅极上的所述第三绝缘层具有低电阻,形成在所述第三绝缘层上的低电阻的第二栅极,所述第一栅极绝缘层下方的所述沟道区域由所述第一栅极 ,并且高掺杂的漏极和源极通过与衬底类型相反的沟道区分离。 此外,用于形成具有一个沟道的晶体管和衬底扩散的工艺可以在半导体衬底上或在半导体衬底上良好形成的相反类型上实现。 根据本发明,可以以低电压进行编程,并且可以提高电池的可靠性特性。