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    • 3. 发明申请
    • Phase change memory devices employing cell diodes and methods of fabricating the same
    • 使用单元二极管的相变存储器件及其制造方法
    • US20060186483A1
    • 2006-08-24
    • US11324112
    • 2005-12-30
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L29/76
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 7. 发明申请
    • PHASE CHANGE MEMORY DEVICES EMPLOYING CELL DIODES AND METHODS OF FABRICATING THE SAME
    • 使用单元的相变存储器件及其制造方法
    • US20080303016A1
    • 2008-12-11
    • US12196137
    • 2008-08-21
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L45/00
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 8. 发明授权
    • Phase change memory devices employing cell diodes and methods of fabricating the same
    • 使用单元二极管的相变存储器件及其制造方法
    • US07427531B2
    • 2008-09-23
    • US11324112
    • 2005-12-30
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • Woo-Yeong ChoDu-Eung KimYun-Seung ShinHyun-Geun ByunSang-Beom KangBeak-Hyung ChoChoong-Keun Kwak
    • H01L21/06
    • G11C13/0004G11C2213/72H01L27/2409H01L27/2463H01L45/06H01L45/1233H01L45/1675
    • Phase change memory devices having cell diodes and related methods are provided, where the phase change memory devices include a semiconductor substrate of a first conductivity type and a plurality of parallel word lines disposed on the semiconductor substrate, the word lines have a second conductivity type different from the first conductivity type and have substantially flat top surfaces, a plurality of first semiconductor patterns are one-dimensionally arrayed on each word line along a length direction of the word line, the first semiconductor patterns have the first conductivity type or the second conductivity type, second semiconductor patterns having the first conductivity type are stacked on the first semiconductor patterns, an insulating layer is provided on the substrate having the second semiconductor patterns, the insulating layer fills gap regions between the word lines, gap regions between the first semiconductor patterns and gap regions between the second semiconductor patterns, a plurality of phase change material patterns are two-dimensionally arrayed on the insulating layer, and the phase change material patterns are electrically connected to the second semiconductor patterns, respectively.
    • 提供具有单元二极管和相关方法的相变存储器件,其中相变存储器件包括第一导电类型的半导体衬底和设置在半导体衬底上的多个平行字线,字线具有不同的第二导电类型 从第一导电类型并且具有基本上平坦的顶表面,沿着字线的长度方向在每个字线上一维地排列多个第一半导体图案,第一半导体图案具有第一导电类型或第二导电类型 具有第一导电类型的第二半导体图案堆叠在第一半导体图案上,在具有第二半导体图案的基板上设置绝缘层,绝缘层填充字线之间的间隙区域,第一半导体图案之间的间隙区域和 第二半导体之间的间隙区域 多个相变材料图案被二维排列在绝缘层上,并且相变材料图案分别电连接到第二半导体图案。
    • 9. 发明授权
    • Phase change memory device using multiprogramming method
    • 相变存储器件采用多重编程方式
    • US07463511B2
    • 2008-12-09
    • US11723361
    • 2007-03-19
    • Byung-Gil ChoiChoong-Keun KwakDu-Eung KimWoo-Yeong Cho
    • Byung-Gil ChoiChoong-Keun KwakDu-Eung KimWoo-Yeong Cho
    • G11C11/00
    • G11C8/10G11C13/0004G11C13/0069G11C2013/0078G11C2213/72
    • A phase change memory device includes a memory cell array and a write driver circuit, and a column selection circuit. The memory cell array includes a plurality of block units each connected between a corresponding pair of word line drivers. The write driver circuit includes a plurality of write driver units each comprising a plurality of write drivers adapted to provide respective programming currents to a corresponding block unit among the plurality of block units. The column selection circuit is connected between the memory cell array and the write driver circuit and is adapted to select at least one of the plurality of memory blocks in response to a column selection signal to provide corresponding programming currents to the at least one of the plurality of memory blocks.
    • 相变存储器件包括存储单元阵列和写入驱动器电路以及列选择电路。 存储单元阵列包括多个块单元,每个块单元连接在相应的一对字线驱动器之间。 写驱动器电路包括多个写驱动器单元,每个写驱动器单元包括多个写驱动器,其适于向多个块单元中的相应块单元提供相应的编程电流。 列选择电路连接在存储单元阵列和写驱动器电路之间,并且适于响应于列选择信号选择多个存储器块中的至少一个,以向多个存储单元阵列中的至少一个提供对应的编程电流 的内存块。