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    • 6. 发明授权
    • Packaging architecture for 32 processor server
    • 32处理器服务器的包装架构
    • US06452789B1
    • 2002-09-17
    • US09562593
    • 2000-04-29
    • Lisa Heid PallottiEric C. PetersonChristian L BeladyTerrel L. MorrisMichael C. Day
    • Lisa Heid PallottiEric C. PetersonChristian L BeladyTerrel L. MorrisMichael C. Day
    • G06F1200
    • G06F15/16
    • The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.
    • 本发明的系统使用背板来互连多个模块化单元板。 每个单元板包括多个处理器,处理器控制器芯片,存储器子系统和电源子系统。 处理器控制器芯片管理单元板上的组件之间的通信。 机械子组件为电池板提供支撑,以及用于冷却的通风通道。 控制器芯片连接到背板的一侧,而单元板连接到另一侧。 控制器芯片管理单元板到单元板通信,以及背板和计算机系统之间的通信。 单元板布置成背靠背对,其中最外面的单元板具有其组件延伸超出背板的高度。 这允许相邻电池板的前面与前面之间的间隔增加。