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    • 3. 发明授权
    • Mapped fan zone cooling system
    • 映射扇区冷却系统
    • US09360904B2
    • 2016-06-07
    • US13344454
    • 2012-01-05
    • Dominick Adam LovicottPaul T. Artman
    • Dominick Adam LovicottPaul T. Artman
    • G06F1/20
    • G06F1/206G05B15/02G06F1/20Y02D10/16
    • A cooling system includes a chassis. A thermal sensor is located in the chassis. A plurality of fan zones are located in the chassis. Each of the plurality of fan zones includes at least one fan. A first mapping is provided between the thermal sensor and a first fan zone of the plurality of fans zone, and a second mapping is provided between the first fan zone and a second fan zone in the plurality of fan zones. A controller is coupled to the thermal sensor and the at least one fan in each of the plurality of fan zones. In response to receiving a signal from the thermal sensor, the controller is operable to activate the at least one fan in the first fan zone according to the first mapping and activate the at least one fan in the second fan zone according to the second mapping.
    • 冷却系统包括底盘。 热敏传感器位于机箱中。 多个风扇区域位于机箱中。 多个风扇区域中的每一个包括至少一个风扇。 在热传感器与多个风扇区域的第一风扇区域之间设置第一映射,并且在第一风扇区域和多个风扇区域中的第二风扇区域之间设置第二映射。 控制器耦合到热传感器和多个风扇区域中的每一个中的至少一个风扇。 响应于从热传感器接收到信号,控制器可操作以根据第一映射激活第一风扇区中的至少一个风扇,并且根据第二映射激活第二风扇区中的至少一个风扇。
    • 4. 发明授权
    • System and method for adapting a power usage of a server during a data center cooling failure
    • 在数据中心冷却故障期间适应服务器的电力使用的系统和方法
    • US08195970B2
    • 2012-06-05
    • US13154059
    • 2011-06-06
    • Paul T. ArtmanDavid Moss
    • Paul T. ArtmanDavid Moss
    • G06F1/32
    • H05K7/20836
    • A device comprising a temperature measurement module, a performance state module, and a fan speed module. The temperature measurement module is configured to determine a temperature in a server, and to output a first control signal when temperature in the server is above a threshold. The performance state module is configured to change a performance state of the device to a lowest system performance state in response to the first control signal, and further configured to reduce a processor power consumption and a subsystem power consumption to a minimum power level in response to reducing the performance state to the lowest system performance state. The fan speed module is configured to reduce a fan speed to a minimum fan speed level based on the first control signal.
    • 一种包括温度测量模块,性能状态模块和风扇速度模块的装置。 温度测量模块被配置为确定服务器中的温度,并且当服务器中的温度高于阈值时输出第一控制信号。 所述性能状态模块被配置为响应于所述第一控制信号将所述设备的性能状态改变到最低系统性能状态,并且还被配置为响应于所述第一控制信号将处理器功耗和子系统功率消耗降低到最小功率电平 将性能状态降低到最低的系统性能状态。 风扇速度模块被配置为基于第一控制信号将风扇速度降低到最小风扇速度水平。
    • 5. 发明授权
    • System and method for providing cooling fan characteristic feedback
    • 提供冷却风扇特性反馈的系统和方法
    • US07990087B2
    • 2011-08-02
    • US12255251
    • 2008-10-21
    • Paul T. ArtmanSandor Farkas
    • Paul T. ArtmanSandor Farkas
    • H02P6/16
    • H02P6/08
    • A device comprising a fan controller, an encoder, a driver, a resistor/capacitor filter, and a baseboard management controller. The fan controller is configured to output a cooling fan status signal, and to output a cooling fan information data signal. The encoder is configured to encode the cooling fan status signal and the cooling fan information data signal together into a combined signal. The driver is configured to invert the combined signal and to output an inverted signal. The resistor/capacitor filter is configured to filter out the cooling fan information data signal from the inverted signal, and to output a filtered signal. The baseboard management controller is configured to determine a status of a cooling fan in response to the filtered signal, and to output a control signal to the fan controller module for the cooling fan based on the cooling fan information data signal within the inverted signal.
    • 一种包括风扇控制器,编码器,驱动器,电阻器/电容器滤波器和基板管理控制器的装置。 风扇控制器配置为输出冷却风扇状态信号,并输出冷却风扇信息数据信号。 编码器被配置为将冷却风扇状态信号和冷却风扇信息数据信号一起编码为组合信号。 驱动器配置为反转组合信号并输出​​反相信号。 电阻/电容滤波器被配置为从反相信号滤除冷却风扇信息数据信号,并输出滤波信号。 基板管理控制器被配置为响应于滤波信号来确定冷却风扇的状态,并且基于反转信号内的冷却风扇信息数据信号将控制信号输出到用于冷却风扇的风扇控制器模块。
    • 7. 发明授权
    • Heat dissipation apparatus utilizing empty component slot
    • 利用空组件槽的散热装置
    • US07480147B2
    • 2009-01-20
    • US11549453
    • 2006-10-13
    • Shawn P. HossPaul T. Artman
    • Shawn P. HossPaul T. Artman
    • H05K7/20H01R13/00
    • G06F1/20H01L2924/0002H01L2924/00
    • A heat dissipation apparatus includes a first commponent connector defining a first component slot immediately adjacent the first component connector, wherein the first component connector is located adjacent to and spaced apart from a second component connector that defines a second component slot. A heat dissipating member is thermally coupled to a heat producing component such that the heat dissipating member is located in the second component slot that is defined by the second component connector when the heat producing component is coupled to the first component connector and located in the first component slot. The heat dissipation apparatus may be coupled to a heat producing component and used to dissipate heat from the heat producing component when there are empty component connector slots located adjacent the component connector that the heat producing component is coupled to.
    • 散热装置包括限定紧邻第一部件连接器的第一部件槽的第一部件连接器,其中第一部件连接器位于与限定第二部件槽的第二部件连接器相邻并间隔开的位置。 散热构件热耦合到发热部件,使得当发热部件联接到第一部件连接器并位于第一部件连接器中时,散热部件位于由第二部件连接器限定的第二部件槽中 组件插槽 散热装置可以耦合到发热部件,并且当存在位于发热部件耦合到的部件连接器附近的空的部件连接器插槽时,用于散发来自发热部件的热量。