专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08780550B2 Dampening acoustic vibrations within an electronic system 有权
标题翻译：减轻电子系统内的声音振动
公开(公告)号：US08780550B2
公开(公告)日：2014-07-15
申请号：US11526993
申请日：2006-09-26
申请人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
发明人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
IPC分类号： H05K5/00
CPC分类号： H05K7/20172 , G06F1/20
摘要： An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
摘要翻译：电子系统包括在操作期间加热的部件和声学阻尼空气移动组件。声学阻尼空气移动组件包括空气移动叶片，马达，支撑结构和壳体。电动机连接到空气移动叶片上以旋转空气移动叶片。支撑结构支撑壳体内的电机和空气移动叶片。壳体和支撑结构至少部分地包括为其声学抑制特性选择的材料。声学阻尼空气移动组件将空气移动到部件以冷却部件。所选择的材料抑制电子系统内的声振动。

2. 发明申请

US20080074841A1 Dampening acoustic vibrations within an electronic system 有权
标题翻译：减轻电子系统内的声音振动
公开(公告)号：US20080074841A1
公开(公告)日：2008-03-27
申请号：US11526993
申请日：2006-09-26
申请人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
发明人： Robert Boyd Curtis , Robert W. Skoog , Christian L. Belady , Jeffrey N. Metcalf
IPC分类号： H05K7/20
CPC分类号： H05K7/20172 , G06F1/20
摘要： An electronic system includes a component that heats up during operation and an acoustic dampening air moving assembly. The acoustic dampening air moving assembly includes air moving blades, a motor, a support structure and a housing. The motor is attached to the air moving blades to rotate the air moving blades. The support structure supports the motor and the air moving blades within the housing. The housing and the support structure at least partially include a material selected for its acoustic dampening characteristics. The acoustic dampening air moving assembly moves air to the component to cool the component. The selected material dampens acoustic vibrations within the electronic system.
摘要翻译：电子系统包括在操作期间加热的部件和声学阻尼空气移动组件。声学阻尼空气移动组件包括空气移动叶片，马达，支撑结构和壳体。电动机连接到空气移动叶片上以旋转空气移动叶片。支撑结构支撑壳体内的电机和空气移动叶片。壳体和支撑结构至少部分地包括为其声学抑制特性选择的材料。声学阻尼空气移动组件将空气移动到部件以冷却部件。所选择的材料抑制电子系统内的声振动。

3. 发明授权

US5838550A Grounding clip for shielded modular connector 失效
标题翻译：屏蔽模块连接器接地夹
公开(公告)号：US5838550A
公开(公告)日：1998-11-17
申请号：US919461
申请日：1997-08-28
申请人： Terrel L. Morris , Eric C. Peterson , Jeffrey N. Metcalf
发明人： Terrel L. Morris , Eric C. Peterson , Jeffrey N. Metcalf
IPC分类号： H01R13/658 , H01R13/74 , H01R24/64 , H05K9/00
CPC分类号： H01R13/65802 , H01R13/74 , H01R24/64 , Y10S439/939
摘要： A shortened ground path for the shield of a shielded modular connector (e.g., RJ-45, etc.) mounted against a bracket that is to be seated against a slot in a chassis is provided by a metallic grounding clip that slips over the bracket. The clip has edges that have been folded to slidably engage the bracket, and an orifice shaped to match the opening of the modular jack, so that the modular plug may pass through that orifice as it mates with the jack. The clip also has two opposing curved metal contacts along the perimeter of the orifice that engage and bear against the exposed shield portion of the modular plug as it mates with the modular jack. A pair of metal tabs engage the opening of the modular jack to align, or register, the orifice in the clip with the opening of the jack, and prevent the clip from easily sliding along the bracket once registration has been achieved. Since the grounding clip is as wide as the bracket, when the circuit assembly (I/O board) having the bracket is installed in the chassis the clip contacts the chassis directly, just as the bracket does. But the clip is also in direct contact with the shield of the modular plug whenever it is connected to the jack. Thus the grounding clip provides a direct path from the shield on the modular plug to the chassis.
摘要翻译：屏蔽模块化连接器（例如，RJ-45等）的屏蔽层的一个缩短的接地路径是通过滑动在支架上的金属接地夹提供的。夹子具有已经被折叠以可滑动地接合支架的边缘，以及形状为匹配模块插座的开口的孔口，使得模块化插头可以在与插座配合时通过该孔口。夹子还具有沿着孔口周边的两个相对的弯曲金属触点，其与模块化插座配合时接合并抵靠模块化插头的暴露的屏蔽部分。一对金属突片接合模块插座的开口，以将夹子中的孔与插座的开口对准或对准，并且一旦实现了对准，就防止夹子沿着支架容易地滑动。由于接地夹与支架一样宽，当带有支架的电路组件（I / O板）安装在机箱中时，夹具就像支架一样直接接触机箱。但是当夹子连接到插孔时，夹子也与模块插头的屏蔽件直接接触。因此，接地夹提供从模块化插头上的屏蔽到机箱的直接路径。

4. 发明授权

US07475175B2 Multi-processor module 失效
标题翻译：多处理器模块
公开(公告)号：US07475175B2
公开(公告)日：2009-01-06
申请号：US10800837
申请日：2004-03-15
申请人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
发明人： David A. Klein , Christian L. Belady , Shaun L. Harris , Michael C. Day , Jeffrey P. Christenson , Brent A. Boudreaux , Stuart C. Haden , Eric Peterson , Jeffrey N. Metcalf , James S. Wells , Gary W. Williams , Paul A. Wirtzberger , Roy M. Zeighami , Greg Huff
IPC分类号： H01L23/34 , H01L23/12 , H05K7/20 , G06F13/00
CPC分类号： G06F15/0216 , G06F15/7864
摘要： An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.
摘要翻译：一种装置包括多个逻辑上独立的处理器，系统总线以及与多个处理器通信的高速缓存控制和总线桥接器件，使得高速缓存控制和总线桥接器件被逻辑地插入在处理器和系统总线之间，以及其中所述处理器和高速缓存控制和总线桥接器件以模块形式被布置，使得所述设备是用于标准单处理器模块的插入式替换。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式