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1. 发明授权

US5035010A Reciprocating shower device for human usage when showering 失效
标题翻译：淋浴间用于人体使用的往复式淋浴设备
公开(公告)号：US5035010A
公开(公告)日：1991-07-30
申请号：US398836
申请日：1989-08-14
申请人： Jun-ichi Sakamoto , Tetsuya Onkura , Kouichi Yoshida
发明人： Jun-ichi Sakamoto , Tetsuya Onkura , Kouichi Yoshida
IPC分类号： E03C1/06
CPC分类号： E03C1/063
摘要： A shower device includes a housing having a longitudinally elongated slit substantially in center part of the housing, substantially all constituents of the device being accommodated within the housing, so that a guide rail is disposed along the slit and a slider carrying a shower nozzle is displaced by a drive means for reciprocation along the guide rail with the shower nozzle disposed at the slit. The device is thus made excellent in the appearance and also in the safety with all water hoses disposed inside the housing.
摘要翻译：淋浴装置包括具有基本上位于壳体的中心部分的纵向细长狭缝的壳体，该装置的基本上所有构件被容纳在壳体内，使得沿着狭缝设置导轨，并且带有淋浴喷嘴的滑块被移位通过用于沿着导轨往复运动的驱动装置，淋浴喷嘴设置在狭缝处。因此，所述装置的外观以及设置在壳体内部的所有水软管的安全性均优异。

2. 发明授权

US06898878B2 Piping arrangement for swing type hydraulic excavators 失效
标题翻译：摆式液压挖掘机配管方案
公开(公告)号：US06898878B2
公开(公告)日：2005-05-31
申请号：US10798427
申请日：2004-03-12
申请人： Kouichi Yoshida , Kiyoshi Sugiyama
发明人： Kouichi Yoshida , Kiyoshi Sugiyama
IPC分类号： E02F3/36 , E02F3/38 , E02F9/00 , E02F9/22
CPC分类号： E02F9/2267 , E02F3/384 , E02F9/2271 , E02F9/2275
摘要： An improvement in a piping arrangement for swing type hydraulic excavators achieved. Piping is provided on a cylinder for an implement from a side of the swivel frame through the swing bracket, the swing bracket is formed on a side thereof with a piping hole, which extends outside from an interior thereof, and piping for that cylinder for an implement, which is disposed in the vicinity of the swing bracket, is performed from the interior of the swing bracket through the piping hole.
摘要翻译：实现了摆式液压挖掘机的管道布置的改进。通过摆动托架从旋转框架的一侧设置在工具用圆筒上，摆动托架的一侧形成有从内部向外侧延伸的配管孔，通过配管孔从摆动托架的内部进行设置在摆动托架附近的工具。

3. 发明申请

US20050098254A1 Method and apparatus for determining processing size of bonding material 失效
公开(公告)号：US20050098254A1
公开(公告)日：2005-05-12
申请号：US10985939
申请日：2004-11-12
申请人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
发明人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/60 , H05K1/02 , H05K3/32 , H05K3/36 , B32B31/00
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.

4. 发明授权

US06763581B2 Method for manufacturing spiral contactor 失效
标题翻译：制造螺旋接触器的方法
公开(公告)号：US06763581B2
公开(公告)日：2004-07-20
申请号：US10274270
申请日：2002-10-21
申请人： Yukihiro Hirai , Chihiro Ueda , Kouichi Yoshida
发明人： Yukihiro Hirai , Chihiro Ueda , Kouichi Yoshida
IPC分类号： H01K310
CPC分类号： H05K3/326 , H01L24/72 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165 , H01L2924/00
摘要： A spiral contactor for establishing an electric connection with a semiconductor device or an electronic part including a solder ball includes a spiral probe having a spiral shape, as viewed from the top. The spiral probe is embedded in an insulating substrate in a manner that permits resilient deformation thereof in accordance with a shape of the solder ball. An edge of the spiral probe is pressed to engage the solder ball, and slides along a periphery of the solder ball, thereby cutting an oxide membrane thereon. The spiral contactor may be manufactured by combination of the photolithography technique and the plating process, and used for a semiconductor inspecting apparatus and an electronic part.
摘要翻译：用于与半导体器件或包括焊球的电子部件建立电连接的螺旋接触器包括从顶部观察具有螺旋形状的螺旋探针。螺旋探针以允许其根据焊球形状的弹性变形的方式嵌入绝缘基板中。螺旋探头的边缘被按压以接合焊球，并且沿着焊球的周边滑动，从而在其上切割氧化膜。螺旋接触器可以通过光刻技术和电镀工艺的组合来制造，并且用于半导体检查装置和电子部件。

5. 发明授权

US5399067A Nozzle for use in a geothermal steam turbine and method for preventing adhesion of scale thereto 失效
标题翻译：用于地热汽轮机的喷嘴及其防止附着垢的方法
公开(公告)号：US5399067A
公开(公告)日：1995-03-21
申请号：US225000
申请日：1994-04-06
申请人： Kouichi Yoshida
发明人： Kouichi Yoshida
IPC分类号： F01D9/02 , F01D5/28 , F01D5/18
CPC分类号： F01D5/28
摘要： A nozzle for use in a geothermal steam turbine is adapted to prevent precipitation and adhesion of scale onto the surface of the nozzle. A coolant water passageway is provided in an initial stage nozzle of a geothermal steam turbine. An inlet side passageway of this coolant water passageway is communicated with coolant water inlet passageways provided in inner and outer turbine casings, respectively. Also, an outlet side passageway is communicated with coolant water outlet passageways. Due to this construction, coolant water is made to pass through the coolant water passageway within the nozzle from a coolant water feed source to lower the surface temperature of the nozzle, and thereby reevaporation and condensation of drain on the blade surface are prevented to prevent precipitation of scale.
摘要翻译：用于地热蒸汽轮机的喷嘴适于防止水垢沉淀并附着在喷嘴表面上。冷却水通道设置在地热蒸汽轮机的初级喷嘴中。该冷却剂水通道的入口侧通道分别与设置在内涡轮机壳体和外涡轮机壳体中的冷却水入口通道连通。此外，出口侧通道与冷却水出口通道连通。由于这种结构，使冷却水从冷却水供给源通过喷嘴内的冷却剂水通道，以降低喷嘴的表面温度，从而避免蒸发并且防止在叶片表面上的排水冷凝以防止沉淀的规模。

6. 发明申请

US20110039966A1 POLYURETHANE FOAM AND POLISHING PAD 有权
标题翻译：聚氨酯泡沫和抛光垫
公开(公告)号：US20110039966A1
公开(公告)日：2011-02-17
申请号：US12989241
申请日：2009-04-21
申请人： Michiro Goto , Kazuo Takemoto , Nobuyuki Ooshima , Shin-ichi Haba , Kouichi Yoshida , Norio Kawai
发明人： Michiro Goto , Kazuo Takemoto , Nobuyuki Ooshima , Shin-ichi Haba , Kouichi Yoshida , Norio Kawai
IPC分类号： C08G18/32
CPC分类号： B24B37/24 , B24D3/32 , C08G18/3206 , C08G18/4841 , C08G18/664 , C08G18/6674 , C08G18/797 , C08G2101/00 , C08G2101/0025 , C08G2101/0083 , C08G2120/00
摘要： The present invention provides a polyurethane foam, which, despite having a low specific gravity, has a hardness and an elasticity favorable for a polishing pad, and a polishing pad made using the polyurethane foam. The polyurethane foam is obtained by reacting a blend composition containing (A) polyisocyanate, (B) a polyol, (C) a chain extender with a molecular weight of equal to or smaller than 400, and (D) water, and in the blend composition, MDI is blended as a main component of the component (A) and a blending amount of the MDI is 45 to 70 parts by weight when a total weight of the respective components (A), (B), and (C) is taken as 100 parts by weight.
摘要翻译：本发明提供一种尽管具有低比重的聚氨酯泡沫，其具有有利于抛光垫的硬度和弹性，以及使用聚氨酯泡沫制成的抛光垫。聚氨酯泡沫体是通过使包含（A）多异氰酸酯，（B）多元醇，（C）分子量等于或小于400的扩链剂的（A）多异氰酸酯和（D）水的共混组合物和在共混物组合物，MDI作为组分（A）的主要组分，当各组分（A），（B）和（C）的总重量为作为100重量份。

7. 发明授权

US07646095B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US07646095B2
公开(公告)日：2010-01-12
申请号：US10946372
申请日：2004-09-21
申请人： Kazushi Higashi , Kouichi Yoshida , Shinji Ishitani , Daido Komyoji
发明人： Kazushi Higashi , Kouichi Yoshida , Shinji Ishitani , Daido Komyoji
IPC分类号： H01L23/48 , H01L23/52 , H01L23/40
CPC分类号： H01L23/4985 , H01L21/563 , H01L24/28 , H01L24/81 , H01L29/0657 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81136 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/16152 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/3512
摘要： In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 μm.
摘要翻译：在本发明的半导体器件中，为了能够可靠地防止在半导体元件安装时在膜基板上形成的半导体元件的边缘部分与半导体元件的边缘部分的接触，在具有电极的膜基板的至少一个表面上，在与电极相对的表面的期望位置处形成绝缘保护部，并且将半导体元件和膜基板之间的距离设定为不小于10um 。

8. 发明授权

US08557005B2 Polyurethane foam and polishing pad 有权
标题翻译：聚氨酯泡沫和抛光垫
公开(公告)号：US08557005B2
公开(公告)日：2013-10-15
申请号：US12989241
申请日：2009-04-21
申请人： Michiro Goto , Kazuo Takemoto , Nobuyuki Ooshima , Shin-ichi Haba , Kouichi Yoshida , Norio Kawai
发明人： Michiro Goto , Kazuo Takemoto , Nobuyuki Ooshima , Shin-ichi Haba , Kouichi Yoshida , Norio Kawai
IPC分类号： B24B1/00 , B24D11/02 , C08G18/00
CPC分类号： B24B37/24 , B24D3/32 , C08G18/3206 , C08G18/4841 , C08G18/664 , C08G18/6674 , C08G18/797 , C08G2101/00 , C08G2101/0025 , C08G2101/0083 , C08G2120/00
摘要： The present invention provides a polyurethane foam, which, despite having a low specific gravity, has a hardness and an elasticity favorable for a polishing pad, and a polishing pad made using the polyurethane foam. The polyurethane foam is obtained by reacting a blend composition containing (A) a polyisocyanate, (B) a polyol, (C) a chain extender with a molecular weight of equal to or smaller than 400, and (D) water, and in the blend composition, MDI is blended as a main component of the component (A) and a blending amount of the MDI is 45 to 70 parts by weight when a total weight of the respective components (A), (B), and (C) is taken as 100 parts by weight.
摘要翻译：本发明提供一种尽管具有低比重的聚氨酯泡沫，其具有有利于抛光垫的硬度和弹性，以及使用聚氨酯泡沫制成的抛光垫。聚氨酯泡沫体是通过使包含（A）多异氰酸酯，（B）多元醇，（C）分子量等于或小于400的扩链剂（C）和（D）水）的共混组合物与共混组合物，MDI作为组分（A）的主要组分，并且当各组分（A），（B）和（C）的总重量相对于MDI组分时，MDI的混合量为45至70重量份，作为100重量份。

9. 发明申请

US20050104173A1 Semiconductor device and manufacturing method thereof 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US20050104173A1
公开(公告)日：2005-05-19
申请号：US10946372
申请日：2004-09-21
申请人： Kazushi Higashi , Kouichi Yoshida , Shinji Ishitani , Daido Komyoji
发明人： Kazushi Higashi , Kouichi Yoshida , Shinji Ishitani , Daido Komyoji
IPC分类号： H01L21/56 , H01L21/60 , H01L23/498 , H01L29/06 , H01L21/44 , H01L21/48
CPC分类号： H01L23/4985 , H01L21/563 , H01L24/28 , H01L24/81 , H01L29/0657 , H01L2224/13144 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81136 , H01L2224/81203 , H01L2224/81208 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/16152 , H01L2924/181 , H01L2924/18161 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/3512
摘要： In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 μm.
摘要翻译：在本发明的半导体器件中，为了能够可靠地防止在半导体元件安装时在膜基板上形成的半导体元件的边缘部分与半导体元件的边缘部分的接触，在具有电极的膜基板的至少一个表面上，在与电极相对的表面的期望位置处形成绝缘保护部，并且将半导体元件和膜基板之间的距离设定为不小于10um 。

10. 发明授权

US06889738B2 Method and apparatus for determining processing size of bonding material 失效
标题翻译：用于确定接合材料的加工尺寸的方法和装置
公开(公告)号：US06889738B2
公开(公告)日：2005-05-10
申请号：US10614784
申请日：2003-07-09
申请人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
发明人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/60 , H05K1/02 , H05K3/32 , H05K3/36 , B32B31/20
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
摘要翻译：在与使用温度不同的环境温度下，确定用于接合由于温度变化而变化的尺寸的接合靶的接合膜的尺寸的装置和方法。该方法包括在第一温度下测量电路电极的接合部分的实际尺寸，将接合部分的实际尺寸与第一温度下的接合部分的设计尺寸进行比较，以及确定接合材料的切割尺寸基于比较结果并将粘合材料安装在粘合部分上。

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