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1. 发明授权

US07195682B2 Method and apparatus for determining processing size of bonding material 失效
标题翻译：用于确定接合材料的加工尺寸的方法和装置
公开(公告)号：US07195682B2
公开(公告)日：2007-03-27
申请号：US10985939
申请日：2004-11-12
申请人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
发明人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
IPC分类号： B32B41/00
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
摘要翻译：在与使用温度不同的环境温度下，确定用于接合由于温度变化而变化的尺寸的接合靶的接合膜的尺寸的装置和方法。该方法包括在第一温度下测量电路电极的接合部分的实际尺寸，将接合部分的实际尺寸与第一温度下的接合部分的设计尺寸进行比较，以及确定接合材料的切割尺寸基于比较结果并将粘合材料安装在粘合部分上。

2. 发明授权

US06889738B2 Method and apparatus for determining processing size of bonding material 失效
标题翻译：用于确定接合材料的加工尺寸的方法和装置
公开(公告)号：US06889738B2
公开(公告)日：2005-05-10
申请号：US10614784
申请日：2003-07-09
申请人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
发明人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/60 , H05K1/02 , H05K3/32 , H05K3/36 , B32B31/20
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.
摘要翻译：在与使用温度不同的环境温度下，确定用于接合由于温度变化而变化的尺寸的接合靶的接合膜的尺寸的装置和方法。该方法包括在第一温度下测量电路电极的接合部分的实际尺寸，将接合部分的实际尺寸与第一温度下的接合部分的设计尺寸进行比较，以及确定接合材料的切割尺寸基于比较结果并将粘合材料安装在粘合部分上。

3. 发明申请

US20050098254A1 Method and apparatus for determining processing size of bonding material 失效
公开(公告)号：US20050098254A1
公开(公告)日：2005-05-12
申请号：US10985939
申请日：2004-11-12
申请人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
发明人： Akihiro Yamamoto , Sakae Kobayashi , Shinzou Eguchi , Kazuhiro Murata , Kouichi Yoshida
IPC分类号： G02F1/13 , G02F1/1345 , H01L21/60 , H05K1/02 , H05K3/32 , H05K3/36 , B32B31/00
CPC分类号： H05K3/361 , H01L2224/16225 , H05K1/0269 , H05K3/323 , H05K2203/162 , H05K2203/163
摘要： An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.

4. 发明授权

US08688950B2 Mainframe storage apparatus that utilizes thin provisioning 有权
标题翻译：利用精简配置的主机存储设备
公开(公告)号：US08688950B2
公开(公告)日：2014-04-01
申请号：US12742581
申请日：2010-04-27
申请人： Kazuhiro Murata , Hisaharu Takeuchi , Junichi Muto , Akihiro Mori , Kazue Jindo
发明人： Kazuhiro Murata , Hisaharu Takeuchi , Junichi Muto , Akihiro Mori , Kazue Jindo
IPC分类号： G06F12/00
CPC分类号： G06F3/0665 , G06F3/0608 , G06F3/0619 , G06F3/0631 , G06F3/0688 , G06F3/0689
摘要： Each actual page inside a pool is configured from a plurality of actual tracks, and each virtual page inside a virtual volume is configured from a plurality of virtual tracks. A storage control apparatus of a mainframe system has management information that includes information denoting a track in which there exists a user record, which is a record including user data (the data used by a host apparatus of a mainframe system). Based on the management information, a controller identifies an actual page that is configured only from tracks that do not comprise the user record, and cancels the allocation of the identified actual page to the virtual page.
摘要翻译：池中的每个实际页面由多个实际轨道配置，并且虚拟卷内的每个虚拟页面由多个虚拟轨道配置。主机系统的存储控制装置具有管理信息，该管理信息包括表示存在用户记录的轨道的信息，该用户记录是包括用户数据（由主机系统的主机装置使用的数据）的记录。基于管理信息，控制器识别仅由不包括用户记录的轨道配置的实际页面，并且将所识别的实际页面的分配取消到虚拟页面。

5. 发明授权

US08021593B2 Method of producing a three-dimensional structure and fine three-dimensional structure 有权
标题翻译：制造三维结构和精细三维结构的方法
公开(公告)号：US08021593B2
公开(公告)日：2011-09-20
申请号：US10566476
申请日：2004-07-29
申请人： Kazuhiro Murata , Hiroshi Yokoyama
发明人： Kazuhiro Murata , Hiroshi Yokoyama
IPC分类号： B05D3/00 , B29C35/00 , B05D5/00
CPC分类号： B81C1/00111 , B81C99/0095 , B81C2201/0184
摘要： A method of producing a three-dimensional structure contains the steps of: arranging a substrate close to a tip of a needle-shaped fluid-ejection body having a fine diameter supplied with a solution, ejecting a fluid droplet having an ultra-fine diameter toward a surface of the substrate by applying a voltage having a prescribed waveform to the needle-shaped fluid-ejection body, making the droplet fly and land on the substrate, and solidifying the droplet after the fluid droplet is landed on the substrate; further a three-dimensional structure has a fine diameter comprises droplets having an ultra-fine particle diameter, wherein the structure is grown by solidifying the droplets and stacking the solidified droplets.
摘要翻译：一种制造三维结构的方法包括以下步骤：将具有细小直径的针状流体喷射体的尖端附近的基板配置在与溶液一体的状态下，将具有超细直径的液滴喷射向通过向针状流体喷射体施加具有规定波形的电压的基板的表面，使得液滴飞溅并落在基板上，并且在液滴落在基板上之后使液滴固化; 此外，具有细小直径的三维结构包括具有超细粒径的液滴，其中通过使液滴凝固并堆积固化的液滴来生长该结构。

6. 发明授权

US07782638B2 Switching power supply device, semiconductor device, and control method 有权
标题翻译：开关电源装置，半导体装置和控制方法
公开(公告)号：US07782638B2
公开(公告)日：2010-08-24
申请号：US11525716
申请日：2006-09-22
申请人： Kazuhiro Murata , Tetsuji Yamashita , Yoshihiro Mori
发明人： Kazuhiro Murata , Tetsuji Yamashita , Yoshihiro Mori
IPC分类号： H02H7/12
CPC分类号： H02M3/33507 , H02M1/32
摘要： A plurality of arrangements for detecting an overload of energy supplied to an output part enables selecting latch-off or auto-recovery overload protection by the operation of a switching device. When the drain current peak of the switching device exceeds a predetermined level denoting an overload, the FB pin voltage also rises to latch off, and when the drain current peak then reaches a maximum level, the CC pin voltage drops to a predetermined level and limits the oscillation period of the switching device because output power cannot be increased even if the load increases further. Latch-off overload protection can be applied when the drain current peak exceeding a predetermined level is detected, and auto-recovery overload protection can be applied when the CC pin voltage is detected to drop to a predetermined level.
摘要翻译：用于检测提供给输出部件的能量过载的多个布置使得能够通过开关装置的操作来选择闭锁或自动恢复过载保护。当开关器件的漏极电流峰值超过表示过载的预定电平时，FB引脚电压也上升到锁存状态，当漏极电流峰值达到最大值时，CC引脚电压下降到预定值即使负载进一步增加，开关器件的振荡周期也不能增加。当检测到超过预定电平的漏极电流峰值时，可以应用锁存过载保护，并且当检测到CC引脚电压下降到预定电平时，可以应用自动恢复过载保护。

7. 发明授权

US07712874B2 Electrostatic suction type fluid discharge device, electrostatic suction type fluid discharge method, and plot pattern formation method using the same 有权
标题翻译：静电抽吸式流体排出装置，静电吸引式流体排出方法和使用该排液装置的图形形成方法
公开(公告)号：US07712874B2
公开(公告)日：2010-05-11
申请号：US10567710
申请日：2004-08-05
申请人： Shigeru Nishio , Hironobu Iwashita , Kazunori Yamamoto , Kazuhiro Murata
发明人： Shigeru Nishio , Hironobu Iwashita , Kazunori Yamamoto , Kazuhiro Murata
IPC分类号： B41J2/06
CPC分类号： H05K3/125 , B05B5/0255 , B41J2/06 , H05K2203/013 , H05K2203/105
摘要： An electrostatic suction type fluid discharge device supplies a drive voltage from a power source between a nozzle and an insulating substrate, so as to supply an electric charge to a discharge material supplied into the nozzle. As a result, the discharge material is discharged from the nozzle hole onto the insulating substrate. The diameter of the hole of the nozzle falls within the range between φ0.01 μm and φ25 μm, the power source outputs, as the drive voltage, a bipolar pulse voltage that alternates between positive and negative and has a frequency of not less than 1 Hz.
摘要翻译：静电吸引型流体排出装置从喷嘴和绝缘基板之间的动力源提供驱动电压，以向供给喷嘴的喷射材料供给电荷。结果，排出材料从喷嘴孔排出到绝缘基板上。喷嘴孔的直径在0.01μm和25μm之间的范围内，电源作为驱动电压输出在正负极之间交替的双极性脉冲电压，频率不小于超过1 Hz。

8. 发明授权

US07604326B2 Electrostatic suction type fluid discharge device 有权
标题翻译：静电抽吸式排液装置
公开(公告)号：US07604326B2
公开(公告)日：2009-10-20
申请号：US10567874
申请日：2004-08-04
申请人： Shigeru Nishio , Hironobu Iwashita , Kazunori Yamamoto , Kazuhiro Murata
发明人： Shigeru Nishio , Hironobu Iwashita , Kazunori Yamamoto , Kazuhiro Murata
IPC分类号： B41J2/06 , B41J2/04 , B05B5/00 , B05B5/025
CPC分类号： B41J2/06
摘要： With a micro nozzle in which the fluid discharge head has a nozzle with a micro hole having a diameter of 0.01 μm to 25 μm, the drive voltage during discharging operation is reduced. Further, by disposing an electrode section for applying a drive voltage to a discharge fluid on an external wall of a nozzle section, a distance between the electrode section and the nozzle hole is shortened. With this structure, the subject invention achieves both miniaturization of nozzle and reduction in drive voltage in an electrostatic suction type fluid discharge device. The subject invention also achieves an increase in discharge limit frequency while allowing use of materials with higher resistance for the fluid to be discharged.
摘要翻译：利用其中流体排出头具有直径为0.01μm至25μm的微孔的喷嘴的微喷嘴，放电操作期间的驱动电压降低。此外，通过在喷嘴部的外壁上设置用于向排出流体施加驱动电压的电极部，缩短电极部与喷嘴孔的距离。利用该结构，本发明实现了静电吸引型流体排出装置中喷嘴的小型化和驱动电压的降低。本发明还实现了放电极限频率的增加，同时允许使用具有较高电阻的材料来排出流体。

9. 发明授权

US07520592B2 Electrostatic attraction fluid jet device 有权
标题翻译：静电吸引流体喷射装置
公开(公告)号：US07520592B2
公开(公告)日：2009-04-21
申请号：US10529244
申请日：2003-09-22
申请人： Kaoru Higuchi , Yasuo Nishi , Kazuhiro Murata , Hiroshi Yokoyama
发明人： Kaoru Higuchi , Yasuo Nishi , Kazuhiro Murata , Hiroshi Yokoyama
IPC分类号： B41J2/06
CPC分类号： B41J2/14 , B41J2/06 , B41J2002/14475
摘要： An electrostatic attraction fluid jet device of the present invention is so arranged that a nozzle (4) is formed so as to correspond to a meniscus equivalent to a tip portion in the form of a taylor cone formed in a process of an electrostatic attraction of ink (2) as a conventional fluid. A diameter of an ink-ejecting hole (4b) of the nozzle (4) is set to be substantially the same as a diameter of the tip portion, which is about to be ejected, of the meniscus (14) of ink. Moreover, the diameter of the ink-ejecting hole (4b) of the nozzle (4) is set to be equal to or less than a droplet diameter of the ink (2) which has just been ejected. Therefore, it is possible to provide an electrostatic attraction fluid jet device which can realize a recording device which has high resolution, is safe and is highly versatile.
摘要翻译：本发明的静电吸引流体喷射装置被布置成使得喷嘴（4）形成为对应于在喷墨静电吸引过程中形成的泰勒锥形形式的尖端部分的弯液面（2）作为常规流体。喷嘴（4）的喷墨孔（4b）的直径被设定为与墨水的液面（14）将要被喷射的尖端部分的直径基本相同。此外，喷嘴（4）的喷墨孔（4b）的直径被设定为等于或小于刚刚喷射的墨水（2）的液滴直径。因此，可以提供一种静电吸引流体喷射装置，其可以实现具有高分辨率，安全性和高度通用性的记录装置。

10. 发明授权

US07434912B2 Ultrafine fluid jet apparatus 有权
标题翻译：超细流体喷射装置
公开(公告)号：US07434912B2
公开(公告)日：2008-10-14
申请号：US10504536
申请日：2003-02-20
申请人： Kazuhiro Murata
发明人： Kazuhiro Murata
IPC分类号： B41J2/135
CPC分类号： B05B5/0533 , B05B5/0255 , B41J2/01 , B41J2/04 , B41J2/14 , B41J2002/14395
摘要： An ultrafine fluid jet apparatus including a substrate arranged near a distal end of an ultrafine-diameter nozzle to which a solution is supplied, and an optional-waveform voltage is applied to the solution in the nozzle to eject an ultrafine-diameter fluid droplet onto a surface of the substrate; wherein an electric field intensity near the distal end of the nozzle according to a diameter reduction of the nozzle is sufficiently larger than an electric field acting between the nozzle and the substrate; and wherein Maxwell stress and an electro-wetting effect being utilized, a conductance is decreased by a reduction in the nozzle diameter or the like, and controllability of an ejection rate by a voltage is improved; and wherein landing accuracy is exponentially improved by moderation of evaporation by a charged droplet and acceleration of the droplet by an electric field.
摘要翻译：一种超细流体喷射装置，其包括布置在超细直径喷嘴的远端附近提供溶液的基板和可选波形电压施加到喷嘴中的溶液以将超细直径流体液滴喷射到基材表面; 其中根据所述喷嘴的直径减小而在所述喷嘴的远端附近的电场强度充分大于在所述喷嘴和所述基板之间作用的电场; 并且其中使用麦克斯韦应力和电润湿效应，通过降低喷嘴直径等降低电导，并且提高通过电压的喷射速度的可控性; 并且其中通过充电液滴的蒸发调节和通过电场加速液滴来使着陆精度指数地增加。

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