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1. 发明授权

US08616539B2 Track spin wafer chuck 有权
标题翻译：跟踪旋转晶片卡盘
公开(公告)号：US08616539B2
公开(公告)日：2013-12-31
申请号：US13328254
申请日：2011-12-16
申请人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
发明人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
IPC分类号： B25B11/00
CPC分类号： H01L21/6838
摘要： The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.
摘要翻译：本公开涉及一种配置成在工件上提供均匀光致抗蚀剂层的晶片卡盘。在一些实施例中，晶片卡盘包括多个真空孔。多个真空孔（即多于一个）与沿着真空孔之间的顶表面连续延伸的空腔流体连通。连接到每个真空孔的真空源构造成从位于工件下方的空腔去除气体分子，留下低压真空。使用多个真空孔增加真空的均匀性，从而防止在任何特定的真空孔附近形成高真空区域。高真空区域的减少减少了与高真空区域相关联的晶片弯曲。

2. 发明申请

US20130156947A1 Track Spin Wafer Chuck 有权
标题翻译：轨道旋转晶片卡盘
公开(公告)号：US20130156947A1
公开(公告)日：2013-06-20
申请号：US13328254
申请日：2011-12-16
申请人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
发明人： Wei-Hsiang Tseng , Jui-Chun Peng , Kai-Fa Ho , Ho-Ping Chen , Chia-Yun Lee
IPC分类号： H01L21/683 , B05D3/12
CPC分类号： H01L21/6838
摘要： The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.
摘要翻译：本公开涉及一种配置成在工件上提供均匀光致抗蚀剂层的晶片卡盘。在一些实施例中，晶片卡盘包括多个真空孔。多个真空孔（即多于一个）与沿着真空孔之间的顶表面连续延伸的空腔流体连通。连接到每个真空孔的真空源构造成从位于工件下方的空腔去除气体分子，留下低压真空。使用多个真空孔增加真空的均匀性，从而防止在任何特定的真空孔附近形成高真空区域。高真空区域的减少减少了与高真空区域相关联的晶片弯曲。

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