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    • 4. 发明授权
    • Method and apparatus for adjusting a photo-exposure time
    • 调整曝光时间的方法和装置
    • US07012670B2
    • 2006-03-14
    • US10968291
    • 2004-10-20
    • Chan-Hoon Park
    • Chan-Hoon Park
    • G03B27/52G03D5/00
    • G03F7/70558
    • A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.
    • 提供一种用于调整用于半导体器件的制造装置的曝光时间的系统。 用于调整照相曝光时间的系统包括其曝光时间根据一个或多个调节信号可调的照相曝光单元,预曝光步骤影响预测单元,其获得预曝光步骤处理信息并提取参数, 可以在照相曝光期间影响所得到的图案,并且将该信息提供为前馈数据,检查单元在照相曝光之后的特定时段期间检查处理的步骤并提供检查值作为反馈数据,以及中央处理单元 其接收前馈和反馈数据,并且通过预定的计算方法产生用于调整曝光时间的一个或多个调整信号。
    • 5. 发明申请
    • System for adjusting a photo-exposure time
    • 调整曝光时间的系统
    • US20050078285A1
    • 2005-04-14
    • US10968291
    • 2004-10-20
    • Chan-Hoon Park
    • Chan-Hoon Park
    • G03F7/20H01L21/027G03B27/32
    • G03F7/70558
    • A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.
    • 提供一种用于调整用于半导体器件的制造装置的曝光时间的系统。 用于调整照相曝光时间的系统包括其曝光时间根据一个或多个调节信号可调的照相曝光单元,预曝光步骤影响预测单元,其获得预曝光步骤处理信息并提取参数, 可以在照相曝光期间影响所得到的图案,并且将该信息提供为前馈数据,检查单元在照相曝光之后的特定时段期间检查处理的步骤并提供检查值作为反馈数据,以及中央处理单元 其接收前馈和反馈数据,并且通过预定的计算方法产生用于调整曝光时间的一个或多个调整信号。
    • 7. 发明授权
    • Method for automatically correcting overlay alignment of a semiconductor wafer
    • 用于自动校正半导体晶片的覆盖排列的方法
    • US06826743B2
    • 2004-11-30
    • US10233556
    • 2002-09-04
    • Chan-Hoon ParkBong-Su ChoHyun-Tae Kang
    • Chan-Hoon ParkBong-Su ChoHyun-Tae Kang
    • G06F1750
    • G03F7/70633
    • A semiconductor wafer overlay correction method for an exposure process in a semiconductor fabricating stepper incorporates variations in equipment characteristics with time. The wafer overlay correction method includes measuring an overlay error correction value of a semiconductor wafer that is exposed by the stepper, calculating an overlay error correction value by summing the measured overlay error correction value, a variation in the stepper characteristics that is obtained through an empirical characterization of input changes, and a weighting value obtained from a predetermined plurality of wafer lots, and providing the calculated overlay error correction value to the semiconductor fabricating stepper to control an exposure process of a subsequent wafer lot.
    • 用于半导体制造步进机中的曝光处理的半导体晶片覆盖校正方法包括设备特性随时间的变化。 晶片覆盖校正方法包括测量由步进器曝光的半导体晶片的覆盖误差校正值,通过将测量的叠加误差校正值相加来计算叠加误差校正值,通过经验值获得的步进器特性的变化 输入变化的表征以及从预定的多个晶片批次获得的加权值,并将计算出的重叠误差校正值提供给半导体制造步进器,以控制随后的晶片批次的曝光处理。
    • 8. 发明授权
    • System for adjusting a photo-exposure time
    • 调整曝光时间的系统
    • US06825912B2
    • 2004-11-30
    • US09826838
    • 2001-04-06
    • Chan-Hoon Park
    • Chan-Hoon Park
    • G03B2732
    • G03F7/70558
    • A system is provided for adjusting a photo-exposure time of a manufacturing apparatus for semiconductor devices. The system for adjusting the photo-exposure time includes a photo-exposure unit whose photo-exposure time is adjustable according to one or more adjustment signals, a pre-exposure step influence prediction unit that obtains pre-exposure step processing information and extracts parameters that may influence a resulting pattern during photo-exposure, and provides this information as feed forward data, an inspection unit that checks processed steps during a certain period after photo-exposure and provides an inspection value as a feed back data, and a central processing unit that receives the feed forward and feedback data and, by means of a predetermined calculation method, generates the one or more adjustment signals, which are used to adjust the photo-exposure time.
    • 提供一种用于调整用于半导体器件的制造装置的曝光时间的系统。 用于调整照相曝光时间的系统包括其曝光时间根据一个或多个调节信号可调的照相曝光单元,预曝光步骤影响预测单元,其获得预曝光步骤处理信息并提取参数, 可以在照相曝光期间影响所得到的图案,并且将该信息提供为前馈数据,检查单元在照相曝光之后的特定时段期间检查处理的步骤并提供检查值作为反馈数据,以及中央处理单元 其接收前馈和反馈数据,并且通过预定的计算方法产生用于调整曝光时间的一个或多个调整信号。
    • 9. 发明授权
    • Measurement system for correcting overlay measurement error
    • 用于校正覆盖测量误差的测量系统
    • US08117001B2
    • 2012-02-14
    • US13021463
    • 2011-02-04
    • Moon-Sang LeeBong-Jin YumHong-Seok KimKwan-Woo KimSeung-Hyun KimChan-Hoon Park
    • Moon-Sang LeeBong-Jin YumHong-Seok KimKwan-Woo KimSeung-Hyun KimChan-Hoon Park
    • G06F11/00
    • G03F7/70633G03F7/705G03F7/70508
    • A measurement system and a measurement method, which can obtain a measurement value close to a true value considering an overlay measurement error according to a higher order regression analysis model. The measurement system and the measurement method provide a technique for determining optimal positions of shots to be measured using an optimal experimental design. When the regression analysis model and the number of shots to be measured are determined in advance, a method is used for determining an optimal number of shots to be measured according to the regression analysis model and process dispersion using a confidence interval estimating method. A dynamic sampling method is used for dynamically changing the number and positions of shots to be measured according to a change in process features by combining the above two methods. And, when erroneous data is detected, or when measured data is missing, a robust regression analysis method and a technique for filtering the erroneous data and the missing data are used.
    • 考虑到根据高阶回归分析模型的覆盖测量误差,测量系统和测量方法可以获得接近真实值的测量值。 测量系统和测量方法提供了一种用于使用最佳实验设计确定要测量的拍摄的最佳位置的技术。 当回归分析模型和要测量的拍摄数量预先确定时,使用一种方法根据回归分析模型和使用置信区间估计方法的处理色散来确定要测量的最佳拍摄张数。 动态采样方法用于通过组合上述两种方法,根据过程特征的变化动态地改变要测量的拍摄张数和位置。 并且,当检测到错误数据时,或者当测量数据丢失时,使用鲁棒的回归分析方法和用于过滤错误数据和丢失数据的技术。
    • 10. 发明申请
    • MEASUREMENT SYSTEM FOR CORRECTING OVERLAY MEASUREMENT ERROR
    • 用于校正重叠测量误差的测量系统
    • US20110125440A1
    • 2011-05-26
    • US13021463
    • 2011-02-04
    • Moon-Sang LeeBong-Jin YumHong-Seok KimKwan-Woo KimSeung-Hyun KimChan-Hoon Park
    • Moon-Sang LeeBong-Jin YumHong-Seok KimKwan-Woo KimSeung-Hyun KimChan-Hoon Park
    • G06F17/18G06F11/00
    • G03F7/70633G03F7/705G03F7/70508
    • A measurement system and a measurement method, which can obtain a measurement value close to a true value considering an overlay measurement error according to a higher order regression analysis model. The measurement system and the measurement method provide a technique for determining optimal positions of shots to be measured using an optimal experimental design. When the regression analysis model and the number of shots to be measured are determined in advance, a method is used for determining an optimal number of shots to be measured according to the regression analysis model and process dispersion using a confidence interval estimating method. A dynamic sampling method is used for dynamically changing the number and positions of shots to be measured according to a change in process features by combining the above two methods. And, when erroneous data is detected, or when measured data is missing, a robust regression analysis method and a technique for filtering the erroneous data and the missing data are used.
    • 考虑到根据高阶回归分析模型的覆盖测量误差,测量系统和测量方法可以获得接近真实值的测量值。 测量系统和测量方法提供了一种用于使用最佳实验设计确定要测量的拍摄的最佳位置的技术。 当回归分析模型和要测量的拍摄数量预先确定时,使用一种方法根据回归分析模型和使用置信区间估计方法的处理色散来确定要测量的最佳拍摄张数。 动态采样方法用于通过组合上述两种方法,根据过程特征的变化动态地改变要测量的拍摄张数和位置。 并且,当检测到错误数据时,或者当测量数据丢失时,使用鲁棒的回归分析方法和用于过滤错误数据和丢失数据的技术。