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1. 发明申请

US20150004902A1 DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS 审中-公开
标题翻译： DIE-TO-DIE电感通信设备和方法
公开(公告)号：US20150004902A1
公开(公告)日：2015-01-01
申请号：US13930250
申请日：2013-06-28
申请人： John M. Pigott , Fred T. Brauchler , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
发明人： John M. Pigott , Fred T. Brauchler , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
IPC分类号： H04B5/00 , H01L49/02
CPC分类号： H04B5/0031 , H01F19/08 , H01L23/3107 , H01L23/48 , H01L23/49575 , H01L23/5227 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L28/10 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/0557 , H01L2224/131 , H01L2224/16245 , H01L2224/27334 , H01L2224/29034 , H01L2224/2919 , H01L2224/32013 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48247 , H01L2224/4826 , H01L2224/48464 , H01L2224/73203 , H01L2224/73215 , H01L2224/73265 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/19104 , H04B5/0093 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.
摘要翻译：感应通信设备的实施例包括第一和第二电隔离IC芯片。第一IC管芯具有靠近第一IC管芯的第一表面的第一线圈，并且第二IC管芯具有靠近第二IC管芯的第一表面的第二线圈。第一IC芯片和第二IC芯片被布置成使得第一和第二IC芯片的第一表面彼此面对，并且第一线圈和第二线圈跨越第一和第二IC芯片之间的间隙排列。一个或多个电介质部件直接位于第一和第二线圈之间的间隙内。在操作期间，向第一线圈提供第一信号，并且第一线圈将该信号转换成时变磁场。磁场与第二线圈耦合，产生相应的第二信号。

2. 发明授权

US09466413B2 Die-to-die inductive communication devices and methods 有权
标题翻译：模 - 模感应通信设备和方法
公开(公告)号：US09466413B2
公开(公告)日：2016-10-11
申请号：US13930236
申请日：2013-06-28
申请人： Fred T. Brauchler , John M. Pigott , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
发明人： Fred T. Brauchler , John M. Pigott , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
IPC分类号： H01L25/00 , H01L25/065 , H02J5/00 , H01F19/08 , H01L23/522 , H01L23/64 , H01L23/495
CPC分类号： H01F19/08 , H01F2019/085 , H01L23/49575 , H01L23/5227 , H01L23/645 , H01L2224/0401 , H01L2224/04042 , H01L2224/131 , H01L2224/16245 , H01L2224/32145 , H01L2224/48247 , H01L2224/48464 , H01L2224/73215 , H01L2924/13055 , H01L2924/14 , H01L2924/00 , H01L2924/014
摘要： Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.
摘要翻译：感应通信设备的实施例包括第一和第二电隔离IC芯片和电介质结构。每个IC管芯具有靠近IC管芯的第一表面的线圈。 IC芯片被布置成使得IC管芯的第一表面彼此面对，并且第一线圈和第二线圈跨越第一和第二IC管芯之间的间隙排列。电介质结构直接位于第一和第二线圈之间的间隙内，并且多个导电结构位于电介质结构中或电介质结构上并与第二IC芯片电耦合。导电结构包括被配置为用作接合焊盘的部分，并且接合焊盘可以使用引线键耦合到封装引线。在操作期间，通过线圈之间的感应耦合在IC芯片之间传送信号。

3. 发明授权

US07763976B2 Integrated circuit module with integrated passive device 有权
标题翻译：集成电路模块，集成无源器件
公开(公告)号：US07763976B2
公开(公告)日：2010-07-27
申请号：US12242550
申请日：2008-09-30
申请人： Jinbang Tang , Darrel R. Frear , Robert J. Wenzel
发明人： Jinbang Tang , Darrel R. Frear , Robert J. Wenzel
IPC分类号： H01L23/34
CPC分类号： H01L23/5389 , H01L21/568 , H01L23/50 , H01L24/19 , H01L2223/6627 , H01L2224/04105 , H01L2224/20 , H01L2224/96 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/1815 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043
摘要： A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP.
摘要翻译：所公开的集成电路（IC）模块包括覆盖在IC面板的上表面上的IC面板和称为IPD结构的多电平电路结构。 IC面板包括导电嵌入式接地平面（EGP），集成电路（IC）裸片和封装材料。 EGP是包括或限定多个空腔的基本上平面的结构。 EGP可以包括或限定IC腔和IPD腔。 IC芯片可以定位在IC腔内，使得IC腔的周边围绕IC管芯。 IPD结构可以定义或包括无源器件，例如电感器。被动设备可以位于或位于EGP中的空隙上方。

4. 发明授权

US5300307A Microstructure control of Al-Cu films for improved electromigration resistance 失效
标题翻译： Al-Cu膜的微结构控制，提高了电迁移率
公开(公告)号：US5300307A
公开(公告)日：1994-04-05
申请号：US944865
申请日：1992-09-14
申请人： Darrel R. Frear , Joseph R. Michael , Alton D. Romig, Jr.
发明人： Darrel R. Frear , Joseph R. Michael , Alton D. Romig, Jr.
IPC分类号： C22F1/057 , C23C14/18 , C23C14/58 , H01L21/768 , H01L23/532 , B05D5/12
CPC分类号： C23C14/5806 , C22F1/057 , C23C14/185 , C23C14/58 , C23C14/584 , H01L21/76838 , H01L23/53214 , H01L2924/0002 , Y10S438/927
摘要： A process for the forming of Al-Cu conductive thin films with reduced electromigration failures is useful, for example, in the metallization of integrated circuits. An improved formation process includes the heat treatment or annealing of the thin film conductor at a temperature within the range of from 200.degree. C. to 300.degree. C. for a time period between 10 minutes and 24 hours under a reducing atmosphere such as 15% H.sub.2 in N.sub.2 by volume. Al-Cu thin films annealed in the single phase region of a phase diagram, to temperatures between 200.degree. C. and 300.degree. C. have .theta.-phase Al.sub.2 Cu precipitates at the grain boundaries continuously become enriched in copper, due, it is theorized, to the formation of a thin coating of .theta.-phase precipitate at the grain boundary. Electromigration behavior of the aluminum is, thus, improved because the .theta.-phase precipitates with copper hinder aluminum diffusion along the grain boundaries. Electromigration, then, occurs mainly within the aluminum grains, a much slower process.
摘要翻译：用于形成具有降低的电迁移故障的Al-Cu导电薄膜的方法在例如集成电路的金属化中是有用的。改进的形成方法包括在200℃至300℃的温度范围内的薄膜导体的热处理或退火在10分钟至24小时之间的时间内在还原气氛下进行，例如15％ H2在N2中的体积。在相图的单相区域退火的Al-Cu薄膜在200摄氏度到300摄氏度之间的温度下，在晶界处具有（θ）相Al2Cu沉淀物连续地富集铜，因为它是理论上，在晶界处形成（θ）相沉淀物的薄涂层。因此，铝的电迁移行为被改善，因为（θ）相在铜上沉淀阻碍了沿着晶界的铝扩散。那么电迁移主要发生在铝粒内，这是一个很慢的过程。

5. 发明授权

US09638597B2 Differential pressure sensor assembly 有权
公开(公告)号：US09638597B2
公开(公告)日：2017-05-02
申请号：US14495095
申请日：2014-09-24
申请人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
发明人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
IPC分类号： G01L9/00 , G01L13/02 , G01L19/04 , G01L19/06
CPC分类号： G01L9/0052 , G01L13/025 , G01L19/04 , G01L19/069 , H01L2224/48145 , H01L2924/1815 , H01L2924/00012
摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.

6. 发明授权

US06630725B1 Electronic component and method of manufacture 有权
标题翻译：电子元件及制造方法
公开(公告)号：US06630725B1
公开(公告)日：2003-10-07
申请号：US09684576
申请日：2000-10-06
申请人： Shun-Meen Kuo , Darrel R. Frear
发明人： Shun-Meen Kuo , Darrel R. Frear
IPC分类号： H01L23552
CPC分类号： B81C1/00269 , H01L23/10 , H01L24/81 , H01L24/97 , H01L2224/81801 , H01L2224/97 , H01L2924/01033 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/30107 , H01L2924/3025 , H01L2224/81
摘要： An electronic component includes a substrate (210, 1510), a device (221, 222) supported by the substrate and including a first bond pad (223, 224, 225, 226), and a cap (231, 232, 631, 731, 732, 1531, 1532) overlying the substrate. The cap includes a second bond pad (241, 242, 243, 244) at an outside surface of the cap, a third bond pad (245, 246, 247, 248) at an inside surface of the cap and electrically coupled to the first bond pad, and an electrically conductive via (251, 252, 254, 751, 752, 753, 754) extending through the cap and electrically coupling together the second and third bond pads.
摘要翻译：电子部件包括基板（210,1510），由基板支撑并包括第一接合焊盘（223,224,225,226）的盖子（231,232,631,731），732,1531,1532）。所述盖包括在所述盖的外表面处的第二接合焊盘（241,242,243,244），在所述盖的内表面处的第三接合焊盘（245,246,247,248），并且电耦合到所述第一接合焊盘接合焊盘和延伸穿过盖并电连接在一起的第二和第三接合焊盘的导电通孔（251,252,254,751,752,753,754）。

7. 发明授权

US5855323A Method and apparatus for jetting, manufacturing and attaching uniform solder balls 失效
标题翻译：用于喷射，制造和附着均匀焊球的方法和装置
公开(公告)号：US5855323A
公开(公告)日：1999-01-05
申请号：US746602
申请日：1996-11-13
申请人： Frederick G. Yost , Darrel R. Frear , David T. Schmale
发明人： Frederick G. Yost , Darrel R. Frear , David T. Schmale
IPC分类号： B05B17/06 , B23K3/06 , H05K3/34 , B05B1/24 , B05B1/08
CPC分类号： H05K3/3457 , B05B17/0638 , B23K3/0623 , H05K2203/013 , H05K2203/0134
摘要： An apparatus and process for jetting molten solder in the form of balls directly onto all the metallized interconnects lands for a ball grid array package in one step with no solder paste required. Molten solder is jetted out of a grid of holes using a piston attached to a piezoelectric crystal. When voltage is applied to the crystal it expands forcing the piston to extrude a desired volume of solder through holes in the aperture plate. When the voltage is decreased the piston reverses motion creating an instability in the molten solder at the aperture plate surface and thereby forming spherical solder balls that fall onto a metallized substrate. The molten solder balls land on the substrate and form a metallurgical bond with the metallized lands. The size of the solder balls is determined by a combination of the size of the holes in the aperture plate, the duration of the piston pulse, and the displacement of the piston. The layout of the balls is dictated by the location of the hooks in the grid. Changes in ball size and layout can be easily accomplished by changing the grid plate. This invention also allows simple preparation of uniform balls for subsequent supply to BGA users.
摘要翻译：一种将滚珠形式的熔融焊料直接喷射到所有金属化互连区域上的设备和方法，用于一个步骤中的球栅阵列封装，不需要焊膏。使用连接到压电晶体的活塞将熔融的焊料从孔网喷射出来。当电压施加到晶体时，其膨胀迫使活塞通过孔板中的孔挤出所需体积的焊料。当电压降低时，活塞反转运动，在孔板表面处产生熔融焊料中的不稳定性，从而形成落入金属化基板上的球形焊球。熔融焊球落在基板上并与金属化焊盘形成冶金结合。焊球的尺寸由孔板中的孔的尺寸，活塞脉冲的持续时间和活塞的位移的组合决定。球的布局由网格中的钩子的位置决定。通过更换网格板可以轻松实现球体尺寸和布局的变化。本发明还允许简单地制备用于随后供给BGA用户的均匀球。

8. 发明授权

US09510495B2 Electronic devices with cavity-type, permeable material filled packages, and methods of their manufacture 有权
标题翻译：具有腔型，可渗透材料填充包装的电子设备及其制造方法
公开(公告)号：US09510495B2
公开(公告)日：2016-11-29
申请号：US13686102
申请日：2012-11-27
申请人： Stephen R. Hooper , Darrel R. Frear , William C. Stermer, Jr.
发明人： Stephen R. Hooper , Darrel R. Frear , William C. Stermer, Jr.
IPC分类号： H05K1/03 , H05K13/04 , G01L19/06 , B81B7/00 , H01L23/053 , H01L23/24 , H01L23/498
CPC分类号： H05K13/0469 , B81B7/0038 , G01L19/0654 , H01L23/053 , H01L23/24 , H01L23/49861 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/1461 , Y10T156/10 , H01L2924/00014 , H01L2924/00
摘要： Embodiments include devices and methods of their manufacture. A device embodiment includes a package housing, at least one electronic circuit (e.g., a sensor circuit), a first material, and a second material. The package housing includes a cavity that is partially defined by a cavity bottom surface, and the cavity bottom surface includes a mounting area and a non-mounting area. The at least one electronic circuit is attached to the cavity bottom surface over the mounting area. The first material has a relatively high, first modulus of elasticity, and covers the non-mounting area. The second material has a relatively low, second modulus of elasticity, and is disposed over the first material within the cavity.
摘要翻译：实施例包括其制造的装置和方法。器件实施例包括封装壳体，至少一个电子电路（例如，传感器电路），第一材料和第二材料。包装壳体包括由腔底表面局部限定的空腔，腔体底面包括安装区域和非安装区域。所述至少一个电子电路在所述安装区域上附接到所述空腔底表面。第一种材料具有相对高的第一弹性模量，并且覆盖非安装区域。第二材料具有相对低的第二弹性模量，并且设置在腔内的第一材料之上。

9. 发明申请

US20160084722A1 Differential Pressure Sensor Assembly 有权
标题翻译：差压传感器组件
公开(公告)号：US20160084722A1
公开(公告)日：2016-03-24
申请号：US14495095
申请日：2014-09-24
申请人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
发明人： Stephen R. Hooper , Darrel R. Frear , Thomas C. Speight
IPC分类号： G01L9/00
CPC分类号： G01L9/0052 , G01L13/025 , G01L19/04 , G01L19/069 , H01L2224/48145 , H01L2924/1815 , H01L2924/00012
摘要： A differential pressure sensor assembly includes a transducer having a first sensing surface and a second sensing surface. The second sensing surface is contained in a cavity. An Integrated Circuit (IC) is hermetically coupled to the transducer. The IC has a first aperture aligned to the cavity. A lead frame is coupled to the IC. The lead frame has a second aperture aligned to the first aperture of the IC. A package encapsulates the transducer, the IC and the lead frame. The package has a third aperture exposed to the first sensing surface. The package includes a molding compound providing a hermetic seal between the third aperture of the package and the first aperture of the IC. The molding compound is separated from the transducer by an encroachment distance.
摘要翻译：差压传感器组件包括具有第一感测表面和第二感测表面的换能器。第二感测表面包含在腔中。集成电路（IC）与传感器气密耦合。 IC具有与空腔对准的第一孔。引线框架耦合到IC。引线框具有与IC的第一孔对准的第二孔。封装封装了传感器，IC和引线框架。该封装具有暴露于第一感测表面的第三孔。该包装包括在封装的第三孔和IC的第一孔之间提供密封的模塑料。模塑料通过侵入距离与换能器分离。

10. 发明申请

US20090072357A1 Integrated shielding process for precision high density module packaging 审中-公开
标题翻译：集成屏蔽过程，用于精密高密度模块封装
公开(公告)号：US20090072357A1
公开(公告)日：2009-03-19
申请号：US11854776
申请日：2007-09-13
申请人： Jinbang Tang , Darrel R. Frear , Jong-Kai Lin
发明人： Jinbang Tang , Darrel R. Frear , Jong-Kai Lin
IPC分类号： H01L23/552 , H01L21/56
CPC分类号： H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3121 , H01L23/552 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0655 , H01L2224/04105 , H01L2224/82039 , H01L2224/97 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2224/82 , H01L2924/00
摘要： An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules (30-33) to a process carrier (10) using a double side adhesive tape (12) before encapsulating the modules with a molding compound (16), and then forming shielding via ring structures (51-54) in the molding compound (16) to surround and shield each module. After removing the adhesive tape (12) to expose a surface of the encapsulated modules, a multi-layer circuit substrate (101) is formed over the exposed surface, where the circuit substrate includes shielding via structures (121-124) that are aligned with and electrically connected to the shielding via ring structures (51-54), thereby encircling and shielding the circuit module(s).
摘要翻译：在多个封装的模块之间通过使用双面胶带（12）将多个模块（30-33）附接到处理载体（10）上而形成电磁干扰（EMI）和/或电磁辐射屏蔽，具有模制化合物（16）的模块，然后通过模制化合物（16）中的环形结构（51-54）形成屏蔽以围绕和屏蔽每个模块。在去除粘合带（12）以暴露封装模块的表面之后，在暴露表面上形成多层电路基板（101），其中电路基板包括屏蔽通孔结构（121-124），其与并且电连接到屏蔽通孔环结构（51-54），从而环绕和屏蔽电路模块。

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