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    • 5. 发明申请
    • Method for Growing Si-Ge Semiconductor Materials and Devices on Substrates
    • 在基板上生长Si-Ge半导体材料和器件的方法
    • US20080113186A1
    • 2008-05-15
    • US11662669
    • 2005-04-08
    • John KouvetakisIgnatius S.T. TsongChangwu HuJohn Tolle
    • John KouvetakisIgnatius S.T. TsongChangwu HuJohn Tolle
    • H01L21/20C30B25/02B32B33/00C01B33/06
    • B32B15/02B82Y10/00C30B23/002C30B23/02C30B25/02C30B29/52H01L21/02381H01L21/02532H01L21/02573H01L21/0262H01L21/02636Y10T428/265Y10T428/31663
    • A method is provided for growing Si—Ge materials on Si(100) with Ge-rich contents (Ge>50 at. %) and precise stoichiometries SiGe, SiGe2, SiGe3 and SiGe4. New hydrides with direct Si—Ge bonds derived from the family of compounds (H3Ge)xSiH4-x (x=1-4) are used to grow uniform, relayed and highly planar films with low defect densities at unprecedented low temperatures between about 300-450° C., circumventing entirely the need of thick compositionally graded buffer layer and lift off technologies. At about 500-700° C., SiGex quantum dots are grown with narrow size distribution, defect-free microstructures and highly homogeneous elemental content at the atomic level. The method provides precise control of morphology, composition, structure and strain via the incorporation of the entire Si/Ge framework of the gaseous precursor into the film. The grown materials possess the required morphological and microstructural characteristics for applications in high frequency electronic and optical systems, as well as templates and buffer layers for development of commercial devices based on high mobility Si and Ge channels.
    • 提供了一种用于在具有富锗含量(Ge> 50at。%)和精确化学计量的Si(100)上生长Si-Ge材料的方法,SiGe,SiGe 2 Si,SiGe 3, SUB>和SiGe 4。 具有源自化合物族(H 3 3 Ge)的直接Si-Ge键的新型氢化物x Si x 4 x x(x = 1- 4)用于在约300-450℃之间的前所未有的低温下生长具有低缺陷密度的均匀的,中继的和高度平坦的膜,完全避免了厚的成分梯度缓冲层和剥离技术的需要。 在约500-700℃下,以较小的分布,无缺陷的微结构和原子水平的高均匀元素含量生长SiGe x X量子点。 该方法通过将气态前体的整个Si / Ge骨架结合到膜中来提供形态,组成,结构和应变的精确控制。 生长的材料具有在高频电子和光学系统中的应用所需的形态和微结构特征,以及用于基于高迁移率Si和Ge通道开发商业设备的模板和缓冲层。