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    • 2. 发明申请
    • Methods and Compositions for Preparing Ge/Si Semiconductor Substrates
    • Ge / Si半导体衬底的制备方法和组成
    • US20110062496A1
    • 2011-03-17
    • US12946485
    • 2010-11-15
    • John KouvetakisYan-Yan Fang
    • John KouvetakisYan-Yan Fang
    • H01L29/78
    • H01L21/02532H01L21/02381H01L21/0262Y10S438/933
    • The present disclosure describes methods for preparing semiconductor structures, comprising forming a Ge layer on a semiconductor substrate using an admixture of (a) (GeH3)2CH2 and Ge2H6; (b) GeH3CH3 and Ge2H6; or (c) (GeH3)2CH2, GeH3CH3 and Ge2H6, wherein in all cases, Ge2H6 is in excess. The disclosure further provides semiconductor structures formed according to the methods of the invention as well as compositions comprising an admixture of (GeH3)2CH2 and/or GeH3CH3 and Ge2H6 in a ratio of between about 1:5 and 1:30. The methods herein provide, and the semiconductor structures provide, Ge layers formed on semiconductor substrates having threading dislocation density below 105/cm2 which can be useful in semiconductor devices.
    • 本公开描述了制备半导体结构的方法,包括使用(a)(GeH 3)2 CH 2和Ge 2 H 6的混合物在半导体衬底上形成Ge层; (b)GeH 3 CH 3和Ge 2 H 6; 或(c)(GeH 3)2 CH 2,GeH 3 CH 3和Ge 2 H 6,其中在所有情况下,Ge 2 H 6过量。 本发明还提供了根据本发明方法形成的半导体结构以及包含(GeH 3)2 CH 2和/或GeH 3 CH 3和Ge 2 H 6的混合物的比例为约1:5至1:30的组合物。 本文提供的方法,并且半导体结构提供了在半导体衬底上形成的穿透位错密度低于105 / cm 2的Ge层,其可用于半导体器件。
    • 3. 发明授权
    • Epitaxial growth of group III nitrides on silicon substrates via a reflective lattice-matched zirconium diboride buffer layer
    • 通过反射晶格匹配的二硼化硼缓冲层在硅衬底上外延生长III族氮化物
    • US07781356B2
    • 2010-08-24
    • US10545484
    • 2004-02-12
    • John KouvetakisIgnatius S. T. TsongJohn TolleRadek Roucka
    • John KouvetakisIgnatius S. T. TsongJohn TolleRadek Roucka
    • C04B35/58C30B25/00
    • C30B25/02C30B29/10H01L21/0237H01L21/02439H01L21/02491H01L21/0254H01L21/0262H01L21/02631H01L33/007
    • A semiconductor structure and fabrication method is provided for integrating wide bandgap nitrides with silicon. The structure includes a substrate, a single crystal buffer layer formed by epitaxy over the substrate and a group III nitride film formed by epitaxy over the buffer layer. The buffer layer is reflective and conductive. The buffer layer may comprise B an element selected from the group consisting of Zr, Hf, Al. For example, the buffer layer may comprise ZrB2, AlB2 or HfB2. The buffer layer provides a lattice match with the group III nitride layer. The substrate can comprise silicon, silicon carbide (SiC), gallium arsenide (GaAs), sapphire or Al2O3. The group III nitride material includes GaN, AlN, InN, AlGaN, InGaN or AlInGaN and can form an active region. In a presently preferred embodiment, the buffer layer is ZrB2 and the substrate is Si(111) or Si(100) and the group III nitride layer comprises GaN. The ZrB2 buffer layer provides a reflective and conductive buffer layer that has a small lattice mismatch with GaN. The semiconductor structure can be used to fabricate active microelectronic devices, such as transistors including field effect transistors and bipolar transistors. The semiconductor structure also can be used to fabricate optoelectronic devices, such as laser diodes and light emitting diodes.
    • 提供了一种用于将宽带隙氮化物与硅结合的半导体结构和制造方法。 该结构包括衬底,通过衬底上的外延形成的单晶缓冲层和通过缓冲层上的外延形成的III族氮化物膜。 缓冲层是反射和导电的。 缓冲层可以包含选自由Zr,Hf,Al组成的组的元素。 例如,缓冲层可以包括ZrB2,AlB2或HfB2。 缓冲层提供与III族氮化物层的晶格匹配。 衬底可以包括硅,碳化硅(SiC),砷化镓(GaAs),蓝宝石或Al2O3。 III族氮化物材料包括GaN,AlN,InN,AlGaN,InGaN或AlInGaN,并且可以形成有源区。 在目前优选的实施方案中,缓冲层是ZrB 2,衬底是Si(111)或Si(100),III族氮化物层包括GaN。 ZrB2缓冲层提供与GaN具有小的晶格失配的反射和导电缓冲层。 半导体结构可用于制造有源微电子器件,例如包括场效应晶体管和双极晶体管的晶体管。 该半导体结构也可用于制造诸如激光二极管和发光二极管之类的光电器件。
    • 8. 发明申请
    • Hydride Compounds with Silicon and Germanium Core Atoms and method of Synthesizing Same
    • 具有硅和锗核原子的氢化物化合物及其合成方法
    • US20120020864A1
    • 2012-01-26
    • US13180961
    • 2011-07-12
    • John KouvetakisCole J. Ritter, IIIJohn Tolle
    • John KouvetakisCole J. Ritter, IIIJohn Tolle
    • C01B33/04
    • C01B33/04C01B6/06Y10S148/058
    • A method is provided for synthesizing silicon-germanium hydride compounds of the formula (H3Ge)4-xSiHx, wherein x=0, 1, 2 or 3. The method includes combining a silane triflate with a compound having a GeH3 ligand under conditions whereby the silicon-germanium hydride is formed. The compound having the GeH3 ligand is selected from the group consisting of KGeH3, NaGeH3 and MR3GeH3, wherein M is a Group IV element and R is an organic ligand. The silane triflate can be HxSi(OSO2CF3)4-x or HxSi(OSO2C4F9)4-x. The method can be used to synthesize trisilane, (H3Si)2SiH2, and the iso-tetrasilane analog, (H3Si)3SiH, by combining a silane triflate with a compound comprising a SiH3 ligand under conditions whereby the silicon hydride is formed. The silane triflate can include HxSi(OSO2CF3)4-x or HxSi(OSO2C4F9)4-x wherein x=1 or 2. A method for synthesizing (H3Ge)2SiH2 includes combining H3GeSiH2(OSO2CF3) with KGeH3 under conditions whereby (H3Ge)2SiH2 is formed.
    • 提供了一种用于合成式(H3Ge)4-xSiHx的硅 - 锗化合物的方法,其中x = 0,1,2或3.该方法包括将硅烷三氟甲磺酸酯与具有GeH 3配位体的化合物组合, 形成硅 - 锗氢化物。 具有GeH 3配体的化合物选自KGeH 3,NaGeH 3和MR 3 GeH 3,其中M是IV族元素,R是有机配体。 三氟甲磺酸硅烷可以是H x Si(OSO 2 CF 3)4-x或H x Si(OSO 2 C 4 F 9)4-x。 该方法可以通过在形成硅氢化氢的条件下将硅烷三氟甲磺酸酯与包含SiH 3配体的化合物组合来合成丙硅烷(H3Si)2 SiH 2和异四硅烷类似物(H3Si)3 SiH。 三氟甲磺酸硅烷可以包括H x Si(OSO 2 CF 3)4-x或H x Si(OSO 2 C 4 F 9)4-x,其中x = 1或2.合成(H3Ge)2 SiH 2的方法包括将H3GeSiH 2(OSO 2 CF 3)与KGeH 3组合, 形成了。