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    • 1. 发明授权
    • Microstructure with reactive bonding
    • 具有反应性键合的微结构
    • US08299630B2
    • 2012-10-30
    • US13146759
    • 2010-01-26
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • H01L23/48H01L29/40H01L21/44H01L21/48
    • B81C3/001B81C2203/019B81C2203/032
    • A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.
    • 微结构具有至少一个键合衬底和反应性多层体系。 反应性多层体系具有至少一个表面层,该表面层具有彼此间隔开的垂直取向的纳米结构的接合基底。 纳米结构之间的区域填充有至少一种相对于纳米结构材料构成反应伴侣的材料。 一种用于制造至少一个接合基材和反应性多层体系的方法,包括用于形成反应性多层体系的方法,所述接合基材的至少一个表面层以图案化方式图案化或沉积,形成垂直取向的纳米结构, 并且纳米结构之间的区域填充有相对于纳米结构的材料构成反应伴侣的至少一种材料。 微系统由两个接合基板和位于接合基板之间的结构形成,该结构具有反应的反应层系统。 微系统是涂覆有生物材料的传感器和/或具有由聚合物材料和/或至少一个磁性和/或压电和/或压阻组件组成的元件。
    • 2. 发明申请
    • MICROSTRUCTURE, METHOD FOR PRODUCING THE SAME, DEVICE FOR BONDING A MICROSTRUCTURE AND MICROSYSTEM
    • US20110284975A1
    • 2011-11-24
    • US13146759
    • 2010-01-26
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • Joerg BraeuerThomas GessnerLutz HofmannJoerg FroemelMaik WiemerHolger LetschMario Baum
    • H01L29/06H01L29/82H01L21/28H01L29/84B82Y99/00
    • B81C3/001B81C2203/019B81C2203/032
    • A microstructure has at least one bonding substrate and a reactive multilayer system. The reactive multilayer system has at least one surface layer of the bonding substrate with vertically oriented nanostructures spaced apart from one another. Regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A method for producing at least one bonding substrate and a reactive multilayer system, includes, for forming the reactive multilayer system, at least one surface layer of the bonding substrate is patterned or deposited in patterned fashion with the formation of vertically oriented nanostructures spaced apart from one another, and regions between the nanostructures are filled with at least one material constituting a reaction partner with respect to the material of the nanostructures. A device for bonding a microstructure, which has at least one bonding substrate and a reactive multilayer system, to a further structure, which has a bonding substrate. The device has a bonding chamber, which can be opened and closed and evacuated and in which the microstructure and the further structure can be introduced and aligned with one another, and also an activation mechanism, which is coupled to the bonding chamber and by means of which the reactive multilayer system of the microstructure, said reactive multilayer system being formed from reactive nanostructures with—situated therebetween—a material constituting a reaction partner with respect to the material of the nanostructures, can be activated mechanically, electrically, electromagnetically, optically and/or thermally in such a way that a self-propagating, exothermic reaction takes place between the nanostructures and the material constituting a reaction partner with respect to the material of the nanostructures. A microsystem is formed from two bonding substrates and a construction lying between the bonding substrates, the construction having a reacted reactive layer system, wherein the reacted reactive layer system is a reacted structure sequence composed of at least one surface layer—provided on the bonding substrate—with vertically oriented nanostructures spaced apart from one another, and regions filled between the nanostructures with at least one material constituting a reaction partner with respect to the material of the nanostructures. The microsystem is a sensor coated with biomaterial and/or has elements composed of polymeric material and/or at least one magnetic and/or piezoelectric and/or piezoresistive component.
    • 3. 发明授权
    • Electrostatically actuated micro-mechanical switching device
    • 静电致动微机械开关装置
    • US08610520B2
    • 2013-12-17
    • US13155002
    • 2011-06-07
    • Joerg FroemelThomas GessnerChristian KaufmannStefan LeidichMarkus NowackSteffen KurthAndreas BertzKoichi IkedaAkira Akiba
    • Joerg FroemelThomas GessnerChristian KaufmannStefan LeidichMarkus NowackSteffen KurthAndreas BertzKoichi IkedaAkira Akiba
    • H01H51/22H01P1/10
    • H01H59/0009H01H1/20H01H2001/0078H01P1/127
    • An electrostatically actuated micro-mechanical switching device with movable elements formed in the bulk of a substrate for closing and releasing at least one Ohmic contact by a horizontal movement of the movable elements in a plane of the substrate. The switching device has a drive with comb-shaped electrodes including fixed driving electrodes and movable electrodes. A movable push rod is mechanically connected with the movable electrodes, extends through the electrodes, has a movable contact element at one side, and at least one restoring spring. A signal line has two parts interrupted by a gap. The micro-mechanical switching device is in shunt-configuration with low loss, high isolation in a wide frequency range, low switching time at low actuation voltage and sufficient reliability. The line impedance of the signal line and its variation is as small as possible. The switching device is in shunt-configuration for closing and releasing the Ohmic contact between a ground line and the signal line. The contact element has a movable contact beam extending at least partially opposite to the signal line and being electrically and mechanically connected to both parts of the signal line, respectively. The ground line is formed with a contact bar that leads through the gap of the signal line for forming the Ohmic contact between the contact beam and the ground line. A contact metallization is provided at least on top and on the side walls of the contact beam, of the signal line and of the ground line.
    • 一种静电致动的微机械开关装置,其具有形成在基板的主体中的可移动元件,用于通过可移动元件在基板的平面中的水平移动来闭合和释放至少一个欧姆接触。 开关装置具有带有固定驱动电极和可动电极的梳状电极的驱动器。 可移动推杆与可动电极机械连接,延伸穿过电极,在一侧具有可动接触元件,以及至少一个复位弹簧。 信号线有两个部分被间隙中断。 微机械开关器件处于分流配置,具有低损耗,在宽频率范围内的高隔离度,低致动电压下的低开关时间和足够的可靠性。 信号线的线路阻抗及其变化尽可能小。 开关器件处于分流配置,用于闭合和释放接地线与信号线之间的欧姆接触。 接触元件具有至少部分地与信号线相对延伸并且分别电信号和机械地连接到信号线的两个部分的可动接触梁。 接地线形成有接触杆,其通过信号线的间隙,以形成接触梁和接地线之间的欧姆接触。 接触金属化至少在信号线和接地线的接触梁的顶部和侧壁上提供。
    • 5. 发明授权
    • Micromechanical accelerometer and method of manufacture thereof
    • 微机械加速度计及其制造方法
    • US5504032A
    • 1996-04-02
    • US224750
    • 1994-04-07
    • Thomas GessnerMartin HafenEberhard HandrichPeter LeinfelderBruno RyrkoEgbert VetterMaik Wiemer
    • Thomas GessnerMartin HafenEberhard HandrichPeter LeinfelderBruno RyrkoEgbert VetterMaik Wiemer
    • G01P15/08G01P15/125H01L21/306H01L29/84H01L21/76
    • G01P15/0802G01P15/125G01P2015/0828Y10S148/012Y10S73/01
    • A high precision micromechanical accelerometer comprises a layered structure of five (5) semiconductor wafers insulated from one another by thin semiconductor material oxide layers. The accelerometer is formed by first connecting a coverplate and a baseplate to associated insulating plates. Counter-electrodes, produced by anisotropic etching from the respective insulating plates, are fixed to the coverplate and the baseplate respectively. The counter-electrodes are contactable through the cover or baseplate via contact windows. A central wafer contains a unilaterally linked mass (pendulum) that is also produced by anisotropic etching and which serves as a movable central electrode of a differential capacitor. The layered structure is hermetically sealed by semiconductor fusion bonding. A stepped gradation from the top is formed at a wafer edge region for attaching contact pads to individual wafers to permit electrical contacting of individual wafers. The invention permits fabrication of a .mu.B device characterized by extremely small leakage capacitances and high temperature stability.
    • 一种高精度微机械加速度计包括由薄半导体材料氧化物层彼此绝缘的五(5)个半导体晶片的分层结构。 通过首先将盖板和底板连接到相关联的绝缘板来形成加速度计。 通过各自绝缘板的各向异性蚀刻制成的对电极分别固定在盖板和基板上。 相对电极可以通过接触窗口通过盖板或底板接触。 中央晶片包含单向连接的质量(摆),其也通过各向异性蚀刻产生,并且用作差分电容器的可移动中心电极。 层状结构通过半导体熔融粘合而密封。 在晶片边缘区域形成从顶部的阶梯状梯度,用于将接触焊盘附接到单个晶片以允许单个晶片的电接触。 本发明允许制造以极小的泄漏电容和高温稳定性为特征的μB器件。