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1. 发明授权

US08952856B2 Transmission/reception element for switching radiation frequency 有权
标题翻译：用于切换辐射频率的发射/接收元件
公开(公告)号：US08952856B2
公开(公告)日：2015-02-10
申请号：US12929273
申请日：2011-01-12
申请人： Akira Akiba , Koichi Ikeda
发明人： Akira Akiba , Koichi Ikeda
IPC分类号： H01Q9/00
CPC分类号： H01Q9/00
摘要： A transmission/reception element includes: a plurality of metal layers each disposed with space from another; and a switch for controlling electrical coupling between the metal layers. The switch includes a contact-point group including a plurality of contact-point pairs each disposed in parallel between each two of the metal layers, and a drive section mechanically driving the contact-point group for state change of each of the contact-point pairs between in-contact and no-contact.
摘要翻译：发送/接收元件包括：多个金属层，每个金属层与另一个间隔设置; 以及用于控制金属层之间的电耦合的开关。该开关包括一个接触点组，该接点组包括平行于每两个金属层之间的多个接触点对，以及驱动部分，用于机械地驱动每个接触点对的状态变化的接触点组在联系和不接触之间。

2. 发明授权

US07566956B2 Semiconductor composite device and method of manufacturing the same 有权
标题翻译：半导体复合器件及其制造方法
公开(公告)号：US07566956B2
公开(公告)日：2009-07-28
申请号：US11425077
申请日：2006-06-19
申请人： Shun Mitarai , Koichi Ikeda , Masahiro Tada , Akira Akiba , Shinya Morita
发明人： Shun Mitarai , Koichi Ikeda , Masahiro Tada , Akira Akiba , Shinya Morita
IPC分类号： H01L23/02
CPC分类号： B81C1/00238
摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.
摘要翻译：本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层到半导体器件和微机电部分。

3. 发明申请

US20080284528A1 RESONATOR, OSCILLATOR, AND COMMUNICATION APPARATUS 有权
标题翻译：谐振器，振荡器和通信装置
公开(公告)号：US20080284528A1
公开(公告)日：2008-11-20
申请号：US12123913
申请日：2008-05-20
申请人： Shinya MORITA , Akira AKIBA
发明人： Shinya MORITA , Akira AKIBA
IPC分类号： H03B1/00
CPC分类号： H03H9/2431 , H03H9/2463 , H03H2009/02354 , H03H2009/02511
摘要： Disclosed is a resonator including a plurality of resonator elements each including at least oscillation parts and lower electrodes with an intervening space therebetween, in which the plurality of resonator elements are disposed in a closed system and the oscillation parts of the plurality of resonator elements are continuously formed in an integrated manner.
摘要翻译：公开了一种谐振器，其包括多个谐振元件，每个谐振器元件至少包括振荡部分和下部电极，其间具有中间空间，其中多个谐振器元件设置在闭合系统中，并且多个谐振器元件的振荡部分连续地形成一体的方式。

4. 发明授权

US07161273B2 Antistatic mechanism of an electrostatic actuator 失效
标题翻译：静电致动器的抗静电机构
公开(公告)号：US07161273B2
公开(公告)日：2007-01-09
申请号：US10287355
申请日：2002-11-04
申请人： Akira Akiba , Keisuke Uno , Masao Jojima , Tomonori Seki , Koji Sano
发明人： Akira Akiba , Keisuke Uno , Masao Jojima , Tomonori Seki , Koji Sano
IPC分类号： H02N1/00
CPC分类号： H01H59/0009 , H01H2001/0084 , H01H2059/0018 , H01H2059/0072
摘要： A fixed voltage and a movable electrode are placed face to face with each other, and an insulating film is formed on the surface of the fixed electrode. The insulating film is made of a nitride film (SiN) as a main material, with oxide films (SiO2) being formed on the front and rear surfaces of the nitride film. Moreover, a plurality of protrusions are formed on an area facing the movable electrode of the upper face of the insulating film. The charge quantity in the insulating film is mainly determined by a film thickness of the oxide film, and the nitride film is used for maintaining a sufficient film thickness required for the voltage proof characteristic. Thereby, it is possible to suppress variations in operational voltage characteristics such as on-voltage and off-voltage in an electrostatic actuator so as to prevent phenomena in which the electrostatic actuator fails to turn on even when a rated voltage is applied to the electrostatic actuator and in which the electrostatic actuator fails to turn off even when the driving voltage is turned off.
摘要翻译：固定电压和可动电极彼此面对地放置，并且在固定电极的表面上形成绝缘膜。绝缘膜由氮化物膜（SiN）作为主要材料制成，在氮化膜的正面和背面形成有氧化物膜（SiO 2/2）。此外，在与绝缘膜的上表面的可动电极相对的区域上形成多个突起。绝缘膜中的电荷量主要由氧化膜的膜厚确定，并且氮化膜用于保持耐电压特性所需的足够的膜厚度。由此，可以抑制静电致动器中的导通电压和截止电压等工作电压特性的变化，从而防止静电致动器即使向静电致动器施加额定电压也不能接通的现象并且即使当驱动电压关闭时静电致动器也不能关闭。

5. 发明申请

US20060289955A1 SEMICONDUCTOR COMPOSITE DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：半导体复合器件及其制造方法
公开(公告)号：US20060289955A1
公开(公告)日：2006-12-28
申请号：US11425077
申请日：2006-06-19
申请人： Shun Mitarai , Koichi Ikeda , Masahiro Tada , Akira Akiba , Shinya Morita
发明人： Shun Mitarai , Koichi Ikeda , Masahiro Tada , Akira Akiba , Shinya Morita
IPC分类号： H01L29/84 , H01L23/52
CPC分类号： B81C1/00238
摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.
摘要翻译：本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层到半导体器件和微机电部分。

6. 发明授权

US08142669B2 Electromechanical element, electric circuit device and production method of those 失效
标题翻译：机电元件，电路装置及其生产方法
公开(公告)号：US08142669B2
公开(公告)日：2012-03-27
申请号：US11676353
申请日：2007-02-19
申请人： Akira Akiba , Shun Mitarai
发明人： Akira Akiba , Shun Mitarai
IPC分类号： H01L21/302 , B81C1/00
CPC分类号： B81C1/00896 , B81B2207/015 , B81C2201/056
摘要： An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical element, the plurality of holes are arranged such that at least two holes are in a same line, at least one hole is in another line located adjacent to the one line with at least two holes, and a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line.
摘要翻译：机电元件包括通过形成在基板上的中空的机械可移动元件和形成在可移动元件中的多个孔。在机电元件中，多个孔布置成使得至少两个孔处于相同的线中，至少一个孔位于与具有至少两个孔的一条线相邻的另一条线中，并且其中一个之间的距离布置在同一条线上的孔和位于与布置在同一条线上的两个孔中的一个最靠近的位置处的另一个孔比相邻排列在同一直线上的孔之间的距离更长。

7. 发明申请

US20110187617A1 Transmission/Reception element 有权
标题翻译：传输/接收元件
公开(公告)号：US20110187617A1
公开(公告)日：2011-08-04
申请号：US12929273
申请日：2011-01-12
申请人： Akira Akiba , Koichi Ikeda
发明人： Akira Akiba , Koichi Ikeda
IPC分类号： H01Q9/00
CPC分类号： H01Q9/00
摘要： A transmission/reception element includes: a plurality of metal layers each disposed with space from another; and a switch for controlling electrical coupling between the metal layers. The switch includes a contact-point group including a plurality of contact-point pairs each disposed in parallel between each two of the metal layers, and a drive section mechanically driving the contact-point group for state change of each of the contact-point pairs between in-contact and no-contact.
摘要翻译：发送/接收元件包括：多个金属层，每个金属层与另一个间隔设置; 以及用于控制金属层之间的电耦合的开关。该开关包括一个接触点组，该接点组包括平行于每两个金属层之间的多个接触点对，以及驱动部分，用于机械地驱动每个接触点对的状态变化的接触点组在联系和不接触之间。

8. 发明申请

US20110186407A1 Contact switch 有权
标题翻译：接触开关
公开(公告)号：US20110186407A1
公开(公告)日：2011-08-04
申请号：US12929382
申请日：2011-01-20
申请人： Akira Akiba , Koichi Ikeda
发明人： Akira Akiba , Koichi Ikeda
IPC分类号： H01H57/00
CPC分类号： H01H57/00
摘要： There is provided a contact switch including: a plurality of first contact points arranged in parallel on a substrate; a movable member including a plurality of beams facing the plurality of first contact points, and formed to be slidable along an alignment direction of the first contact points within a face of the substrate; and a plurality of second contact points provided on faces of the beams, opposing the first contact points, respectively.
摘要翻译：提供了一种接触开关，包括：平行布置在基板上的多个第一接触点; 可动构件，其包括面对所述多个第一接触点的多个梁，并且形成为能够沿着所述基板的表面内的所述第一接触点的排列方向滑动; 以及分别设置在所述梁的与所述第一接触点相对的面上的多个第二接触点。

9. 发明申请

US20110032685A1 INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME 审中-公开
标题翻译：插件，模块和电子设备，包括它们
公开(公告)号：US20110032685A1
公开(公告)日：2011-02-10
申请号：US12847240
申请日：2010-07-30
申请人： Akira Akiba , Shun Mitarai , Koichi Ikeda , Shinya Morita
发明人： Akira Akiba , Shun Mitarai , Koichi Ikeda , Shinya Morita
IPC分类号： H05K7/02
CPC分类号： H01L23/66 , H01L23/13 , H01L23/147 , H01L23/645 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2223/6616 , H01L2223/6627 , H01L2223/6677 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/16225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/12034 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/1515 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/157 , H01L2924/1903 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01Q1/38 , H01Q19/24 , H01Q19/30 , H05K1/024 , H05K1/141 , H05K1/16 , H05K2201/0191 , H05K2201/09036 , H05K2201/10674 , H01L2924/00 , H01L2924/20752
摘要： An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.
摘要翻译：提供了能够简化制造步骤并且显示出优异的高频特性的插入器。插入器包括：具有正面和背面的基板; 形成在基板的正面侧并与半导体芯片电连接的布线; 连接到布线的电气设备; 以及从与所述电气装置对应的位置从所述基板的背面侧形成的凹部。

10. 发明申请

US20080174204A1 ELECTROMECHANICAL ELEMENT, ELECTRIC CIRCUIT DEVICE AND PRODUCTION METHOD OF THOSE 失效
标题翻译：电动元件，电路设备及其生产方法
公开(公告)号：US20080174204A1
公开(公告)日：2008-07-24
申请号：US11676353
申请日：2007-02-19
申请人： Akira Akiba , Shun Mitarai
发明人： Akira Akiba , Shun Mitarai
IPC分类号： B81B7/00 , B81C1/00 , C23F1/00
CPC分类号： B81C1/00896 , B81B2207/015 , B81C2201/056
摘要： An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical element, the plurality of holes are arranged such that at least two holes are in a same line, at least one hole is in another line located adjacent to the one line with at least two holes, and a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line.
摘要翻译：机电元件包括通过形成在基板上的中空的机械可移动元件和形成在可移动元件中的多个孔。在机电元件中，多个孔布置成使得至少两个孔处于相同的线中，至少一个孔位于与具有至少两个孔的一条线相邻的另一条线中，并且其中一个之间的距离布置在同一条线上的孔和位于与布置在同一条线上的两个孔中的一个最靠近的位置处的另一个孔比相邻排列在同一直线上的孔之间的距离更长。

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