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    • 3. 发明授权
    • Topical patch preparation containing a delayed-type hypersensitivity inducer and methods for using the same
    • 包含延迟型超敏反应诱导剂的局部贴剂制剂及其使用方法
    • US06761900B2
    • 2004-07-13
    • US10080526
    • 2002-02-21
    • Jutaro ShudoIchiro Mori
    • Jutaro ShudoIchiro Mori
    • A61F1302
    • A61K9/7061A61F2013/0296A61K31/04Y02A50/409
    • Topical patch preparations that contain a delayed-type hypersensitivity inducer, e.g., 1-dichloro-2,4-dinitrobenzene (DNCB), and methods for using the same are provided. The subject topical patch preparations are made up of an adhesive gel composition that is present on a support, where the adhesive gel composition includes the delayed-type hypersensitivity inducer, a water-soluble polymer gel, water and a water holding agent. In using the subject topical patch preparations, the topical patch preparations are applied to a skin surface of a subject and maintained at the site of application for a period of time sufficient for an effective amount of the delayed-type hypersensitivity inducer to be administered to the subject, where this maintenance period typically does not exceed about 60 minutes. The subject invention finds use in a variety of applications where the administration of a delayed-type hypersensitivity inducer is desired, and is particularly suited for use in the treatment of HIV associated disease conditions, e.g., AIDS.
    • 提供含有延迟型超敏反应诱导剂例如1-氯-2,4-二硝基苯(DNCB)的局部贴剂制剂及其使用方法。 本发明的局部贴剂制剂由存在于载体上的粘合凝胶组合物组成,其中粘合性凝胶组合物包括延迟型超敏感诱导剂,水溶性聚合物凝胶,水和保水剂。 在使用本发明的局部贴剂制剂时,将局部贴剂制剂施用于受试者的皮肤表面并保持在施用部位足以使有效量的延迟型超敏反应诱导剂施用于 该维护期通常不超过约60分钟。 本发明可用于期望延迟型超敏反应诱导剂的施用的多种应用,并且特别适合用于治疗HIV相关疾病病症,例如艾滋病。
    • 6. 发明授权
    • Electron beam pattern transfer device and method for aligning mask and
semiconductor wafer
    • 用于对准掩模和半导体晶片的电子束图案转移装置和方法
    • US4469949A
    • 1984-09-04
    • US374724
    • 1982-05-04
    • Ichiro MoriKazuyoshi SugiharaToshiaki ShinozakiToru Tojo
    • Ichiro MoriKazuyoshi SugiharaToshiaki ShinozakiToru Tojo
    • H01L21/027H01J37/304H01L21/30H01J37/00
    • H01L21/30H01J37/3045
    • According to the invention an electron beam pattern transfer device with an improved alignment means is provided.A first and a second mark M.sub.1, M.sub.2 for alignment purposes are formed on the surface of the wafer and the wafer holder, respectively. The first mark M.sub.1 is formed on the wafer by conventional lithographic technique and the second mark M.sub.2 consists of a hole or a heavy metal, such as Ta or Ta.sub.2 O.sub.5. A third alignment mark M.sub.3 is provided on the photocathode mask having a position corresponding to M.sub.2 on the wafer holder and spaced a known distance L.sub.2 from an imaginary reference position M.sub.4 on the mask. The first step of the alignment process requires the detection of a relative distance L.sub.1 between the first and second marks M.sub.1, M.sub.2 by conventional detecting means, such as an optical measuring means. In the next step, the relative position of the photocathode mask and the wafer holder is adjusted so that the distance between the marks M.sub.2 and M.sub.3 is made substantially equal to the difference between the distance L.sub.1 and the known distance L.sub. 2.
    • 根据本发明,提供了具有改进的对准装置的电子束图案转印装置。 分别在晶片和晶片保持器的表面上形成用于对准目的的第一和第二标记M1,M2。 第一标记M1通过常规平版印刷技术在晶片上形成,第二标记M2由孔或重金属如Ta或Ta2O5组成。 第三对准标记M3设置在光电阴极掩模上,其具有对应于晶片保持器上的M2的位置,并且与掩模上的假想参考位置M4隔开已知距离L2。 对准处理的第一步骤需要通过诸如光学测量装置的常规检测装置检测第一和第二标记M1,M2之间的相对距离L1。 在下一步骤中,调整光电阴极掩模和晶片保持器的相对位置,使得标记M2和M3之间的距离基本上等于距离L1和已知距离L 2之间的差。
    • 7. 发明授权
    • Electron beam type pattern transfer apparatus
    • 电子束式图案转印装置
    • US4366383A
    • 1982-12-28
    • US165618
    • 1980-07-03
    • Shunichi SanoToshiaki ShinozakiIchiro Mori
    • Shunichi SanoToshiaki ShinozakiIchiro Mori
    • H01L21/027H01J37/317H01L21/30A61K27/02G01N21/64
    • H01J37/3175B82Y10/00B82Y40/00H01L21/30H01J2237/04735H01J2237/04922H01J2237/142H01J2237/31779Y10S505/879
    • An electron beam type pattern transfer apparatus has a photoelectric mask and a sample in a vacuum container made of non-magnetic material. The photoelectric mask is adapted to receive an ultraviolet ray from a light source and emit photoelectrons corresponding to a predetermined transfer pattern and the sample is disposed in parallel with the photoelectric mask with a predetermined distance left therebetween and illuminated with the photoelectrons to form a resist image thereon which corresponds to the transfer pattern. A power source for applying a voltage for accelerating the photoelectrons emitted is connected between the photoelectric mask and the sample. A pair of focusing magnets are disposed around the axis of the vacuum container such that they are located one at one outer side and one in an opposite outer side of the vacuum container to permit a vertical magnetic field to be created between the photoelectric mask and the sample. The focusing magnets have superconductive coils and are driven in a persistent mode.
    • 电子束型图案转印装置在由非磁性材料制成的真空容器中具有光电掩模和样品。 光电掩模适于从光源接收紫外线并发射对应于预定转印图案的光电子,并且将样品与光电掩模平行放置并保持在预定距离处并用光电子照射以形成抗蚀剂图像 对应于转印图案。 用于施加用于加速发射的光电子的电压的电源连接在光电掩模和样品之间。 一对聚焦磁铁设置在真空容器的轴线周围,使得它们位于真空容器的一个外侧和一个在相对的外侧中,从而允许在光电面罩和 样品。 聚焦磁体具有超导线圈并以持续模式驱动。
    • 8. 发明授权
    • Design system of alignment marks for semiconductor manufacture
    • 半导体制造对准标记设计系统
    • US07100146B2
    • 2006-08-29
    • US10636577
    • 2003-08-08
    • Takashi SatoTakuya KounoTakashi SakamotoYoshiyuki ShioyamaTatsuhiko HigashikiIchiro MoriNoboru Yokoya
    • Takashi SatoTakuya KounoTakashi SakamotoYoshiyuki ShioyamaTatsuhiko HigashikiIchiro MoriNoboru Yokoya
    • G06F17/50
    • G03F9/7092
    • A design system of an alignment mark for manufacturing a semiconductor device includes a memory which stores at least mark data including pattern information regarding plural kinds of marks and process data including condition information of manufacturing processes, and a first process simulator which simulates a substrate structure before patterning based on the process data, the substrate structure being formed in an identified manufacturing process. Moreover, the design system includes a second process simulator which simulates a processed shape of an identified mark after the patterning based on the simulated substrate structure and the process data, the mark formed in the manufacturing process, a signal waveform simulator which simulates a detection signal waveform of the mark, the waveform being obtained from the simulated processed shape of the mark, and a signal evaluation device which evaluates a suitability of the mark for the identified manufacturing process based on the simulated detection signal waveform.
    • 用于制造半导体器件的对准标记的设计系统包括:存储器,其至少存储包括关于多种标记的图案信息的标记数据和包括制造过程的条件信息的处理数据;以及第一处理模拟器,其模拟前面的衬底结构 基于工艺数据构图,基板结构在识别的制造工艺中形成。 此外,设计系统包括第二处理模拟器,其基于模拟的基板结构和处理数据,在制造​​过程中形成的标记,模拟检测信号的信号波形模拟器,模拟图案化之后的识别标记的处理形状 标记的波形,从标记的模拟处理形状获得的波形,以及基于模拟的检测信号波形来评估用于所识别的制造处理的标记的适合性的信号评估装置。
    • 9. 发明授权
    • Control method for exposure apparatus and control method for semiconductor manufacturing apparatus
    • 半导体制造装置的曝光装置的控制方法和控制方法
    • US06376139B1
    • 2002-04-23
    • US09671502
    • 2000-09-27
    • Tadahito FujisawaSoichi InoueKenji KawanoShinichi ItoIchiro Mori
    • Tadahito FujisawaSoichi InoueKenji KawanoShinichi ItoIchiro Mori
    • G03F900
    • G03F7/70625G03F7/70633G03F7/70641
    • A control method for an exposure apparatus, in which an exposure amount and a focus value are set in transferring a circuit pattern on a mask onto a resist formed on a wafer by the exposure apparatus, includes the steps of arranging, on the mask, an exposure amount monitor mark and a focus monitor mark used to separately monitor the effective exposure amount and the focus value on the wafer, transferring the exposure amount monitor mark and the focus monitor mark onto the resist to form an exposure amount monitor pattern and a focus monitor pattern, measuring the states of the exposure amount monitor pattern and the focus monitor pattern at least at one of timings after exposure, after post exposure baking, during a cooling process after baking, during a process after cooling, during development, and after development, on the basis of the measurement results, calculating the difference between an optimum exposure amount value and an exposure amount set value set in the exposure apparatus and the difference between an optimum focus value and a focus set value set in the exposure apparatus in transferring the exposure amount monitor mark and the focus monitor mark onto the resist, and changing the focus set value and the exposure amount set value of the exposure apparatus in accordance with the calculated differences.
    • 一种曝光装置的控制方法,其中设置曝光量和聚焦值以将掩模上的电路图案转印到通过曝光装置在晶片上形成的抗蚀剂上的步骤包括以下步骤:在掩模上布置 曝光量监视标记和用于分别监视晶片上的有效曝光量和聚焦值的聚焦监视器标记,将曝光量监视标记和聚焦监视标记转印到抗蚀剂上以形成曝光量监视器图案和聚焦监视器 至少在曝光后的定时,曝光后烘烤,烧成后的冷却过程中,冷却后,显影处理和显影后的处理中,至少测定曝光量监视器图案和聚焦监视器图案的状态, 基于测量结果,计算最佳曝光量值与曝光设定中设定的曝光量设定值之间的差 以及将曝光量监视标记和聚焦监视标记转印到抗蚀剂上的曝光装置中设置的最佳聚焦值和聚焦设定值之间的差异,并且改变曝光的聚焦设定值和曝光量设定值 仪器按照计算出的差异。