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    • 1. 发明授权
    • Design techniques for analyzing integrated circuit device characteristics
    • 分析集成电路器件特性的设计技术
    • US06951002B2
    • 2005-09-27
    • US10455164
    • 2003-06-05
    • Joachim Gerhard ClabesAnand HaridassMichael F. Wang
    • Joachim Gerhard ClabesAnand HaridassMichael F. Wang
    • G06F17/50
    • G06F17/5036G06F17/5068
    • An improved method and system for integrated circuit device physical design and layout. The physical layout of the integrated circuit device is optimally stored in a database to provide improved analysis capabilities of the integrated circuit device's characteristics. The method and system evaluates local interactions between functional blocks and decoupling cells on a given floor plan of a chip using this optimized database in order to reduce memory and processor utilization. Local noise is projected by using dI/dt and capacitance estimates. Areas of highest noise concern are identified, and floor plan mitigation actions are taken by tuning the placement of neighboring decoupling cells and their properties. Upon several iterative cycles, a near optimal solution for a given floor plan of the total chip is achieved.
    • 一种改进的集成电路设备物理设计和布局的方法和系统。 将集成电路器件的物理布局最佳地存储在数据库中,以提供集成电路器件特性的改进的分析能力。 该方法和系统使用此优化数据库评估芯片给定平面图上的功能块和去耦单元之间的本地交互,以减少内存和处理器利用率。 通过使用dI / dt和电容估计来预测局部噪声。 识别出最高噪声的区域,并通过调整相邻去耦单元的布局及其属性来采取平面图缓解措施。 在几个迭代循环中,实现了总芯片给定平面图的近似最优解。
    • 4. 发明申请
    • CHARACTERIZATION AND VALIDATION OF PROCESSOR LINKS
    • 处理器链接的特征和验证
    • US20130103927A1
    • 2013-04-25
    • US13281081
    • 2011-10-25
    • Robert W. Berry, JR.Anand HaridassPrasanna Jayaraman
    • Robert W. Berry, JR.Anand HaridassPrasanna Jayaraman
    • G06F15/00G06F9/30
    • G06F11/3089G01R31/31926G06F9/30G06F9/30007G06F11/22G06F11/221G06F11/3409G06F11/3414G06F11/349G06F15/00
    • A processor link that couples a first processor and a second processor is selected for validation and a plurality of communication parameter settings associated with the first and the second processors is identified. The first and the second processors are successively configured with each of the communication parameter settings. One or more test data pattern(s) are provided from the first processor to the second processor in accordance with the communication parameter setting. Performance measurements associated with the selected processor link and with the communication parameter setting are determined based, at least in part, on the test data pattern as received at the second processor. One of the communication parameter settings that is associated with the highest performance measurements is selected. The selected communication parameter setting is applied to the first and the second processors for subsequent communication between the first and the second processors via the processor link.
    • 选择耦合第一处理器和第二处理器的处理器链接用于验证,并且识别与第一处理器和第二处理器相关联的多个通信参数设置。 第一和第二处理器依次配置有每个通信参数设置。 根据通信参数设置,从第一处理器向第二处理器提供一个或多个测试数据模式。 至少部分地基于在第二处理器处接收到的测试数据模式来确定与所选择的处理器链路和通信参数设置相关联的性能测量。 选择与最高性能测量值相关联的通信参数设置之一。 所选择的通信参数设置被应用于第一和第二处理器,用于经由处理器链路在第一和第二处理器之间进行后续通信。
    • 6. 发明授权
    • Design method and system for minimizing blind via current loops
    • 通过电流回路最小化设计方法和系统
    • US07765504B2
    • 2010-07-27
    • US11829179
    • 2007-07-27
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • G06F17/50
    • G06F17/5081H05K1/0216H05K1/115H05K3/0005H05K2201/09636
    • A design method and system for minimizing blind via current loops provides for improvement of electrical interconnect structure design without requiring extensive electromagnetic analysis. Other vias in the vicinity of a blind via carrying a critical signal are checked for suitability to conduct return current corresponding to the critical signal that is disrupted by the transition from a layer between two metal planes to another layer. The distance to the return current via(s) is checked and the design is adjusted to reduce the distance if the distance is greater than a specified threshold. If the blind via transition is to an external layer, suitable vias connect the reference plane at the internal end of the blind via to an external terminal. If the transition is between internal layers, suitable vias are vias that connect the two reference planes surrounding the reference plane traversed by the blind via.
    • 用于最小化盲通过电流回路的设计方法和系统提供了电互连结构设计的改进,而不需要广泛的电磁分析。 检查通过携带关键信号的盲目附近的其他通孔是否​​适合于进行对应于由两个金属平面之间的层到另一层之间的过渡而被破坏的关键信号的返回电流。 检查通过(s)的返回电流的距离,并且如果距离大于指定的阈值,则设计被调整以减小距离。 如果盲目通过转换到外部层,合适的通孔将盲通孔内部的参考平面连接到外部端子。 如果过渡在内层之间,合适的通孔是连接围绕由盲孔通过的参考平面的两个参考平面的通孔。
    • 9. 发明授权
    • Differential transmitter circuit
    • 差分发射电路
    • US07512183B2
    • 2009-03-31
    • US11086718
    • 2005-03-22
    • Anand HaridassBao G. TruongJoel D. Ziegelbein
    • Anand HaridassBao G. TruongJoel D. Ziegelbein
    • H04B3/00
    • H04L25/0274H03F3/45197H03F2200/543H03F2203/45488
    • A driver circuit is configured as a frequency compensated differential amplifier having one input coupled to a first data signal and a second input coupled to a second data signal. Each stage of the differential amplifier is biased with a current source. The driver circuit generates a first output signal coupled to the input of a first transmission line and a second output signal coupled to the input of a second transmission line. The first and second output signals are generated as the difference between the first and second data signals amplified by a compensated gain. A compensation network that attenuates the low frequency components of the input signals relative to the high frequency components is coupled between current sources biasing the differential amplifier. The outputs of the first and second transmission lines are coupled to the inputs of a differential receiver that may or may not be frequency compensated.
    • 驱动器电路被配置为具有耦合到第一数据信号的一个输入和耦合到第二数据信号的第二输入的频率补偿差分放大器。 差分放大器的每个级都用电流源偏置。 驱动器电路产生耦合到第一传输线的输入的第一输出信号和耦合到第二传输线的输入的第二输出信号。 第一和第二输出信号被产生为由补偿增益放大的第一和第二数据信号之间的差。 相对于高频分量衰减输入信号的低频分量的补偿网络耦合在偏置差分放大器的电流源之间。 第一和第二传输线的输出耦合到差分接收机的输入端,该差分接收机可以被频率补偿也可以不被频率补偿。