专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20070279323A1 METHOD OF COMPENSATING FOR CHANNEL INTERFERENCE OF DISPLAY APPARATUS AND DEVICE FOR CONTROLLING DRIVING OF DATA SIGNAL 审中-公开
标题翻译：用于显示设备的通道干扰的补偿方法和用于控制数据信号驱动的设备
公开(公告)号：US20070279323A1
公开(公告)日：2007-12-06
申请号：US11697160
申请日：2007-04-05
申请人： Jin Park , Joon-Seok Lee , Dae Young Jung
发明人： Jin Park , Joon-Seok Lee , Dae Young Jung
IPC分类号： G09G3/20
CPC分类号： G09G3/3283 , G09G3/3216 , G09G2310/0248 , G09G2310/0251 , G09G2310/08 , G09G2320/0223 , G09G2360/16
摘要： A method of compensating for channel interference of a display apparatus and a device for controlling driving of a data signal are provided. The method of compensating for the channel interference of the display apparatus includes: receiving pixel data of a scan line selected from an external screen memory; summing up the received pixel data and detecting a compensation time for compensating for channel interference which occurs in the selected scan line by using the sum of the pixel data; and adjusting at least one of a discharge time and a peak boost time of a driving current that is output to each data line according to the detected compensation time. Accordingly, it is possible to solve problems such as an increase of the circuit size caused by the existing compensation for the channel interference by controlling the discharge period or peak boost period with respect to each scan line and compensating for the channel interference phenomenon.
摘要翻译：提供了补偿显示装置和控制数据信号驱动装置的信道干扰的方法。补偿显示装置的信道干扰的方法包括：接收从外部屏幕存储器中选择的扫描线的像素数据; 对所接收的像素数据求和，并通过使用像素数据的和来检测在所选择的扫描行中发生的信道干扰的补偿时间; 以及根据检测到的补偿时间来调整输出到每个数据线的驱动电流的放电时间和峰值升高时间中的至少一个。因此，可以通过控制相对于每个扫描线的放电周期或峰值升高周期并补偿信道干扰现象来解决由现有的信道干扰补偿引起的电路尺寸增加的问题。

2. 发明授权

US08826341B2 Digital broadcast receiver controlled by screen remote controller and space remote controller and controlling method thereof 有权
标题翻译：由遥控器和遥控器控制的数字广播接收机及其控制方法
公开(公告)号：US08826341B2
公开(公告)日：2014-09-02
申请号：US12871742
申请日：2010-08-30
申请人： Dae Young Jung
发明人： Dae Young Jung
IPC分类号： H04N5/445 , G06F3/00 , G06F13/00
CPC分类号： G06F3/0346 , G06F3/017 , H04N5/4403 , H04N5/44513 , H04N5/44543 , H04N21/42207 , H04N21/42208 , H04N21/4221 , H04N21/42221 , H04N21/42222 , H04N21/42224 , H04N21/4312 , H04N21/4316 , H04N21/482 , H04N21/4828 , H04N21/485 , H04N21/4852 , H04N2005/4408 , H04N2005/441 , H04N2005/4412 , H04N2005/4426 , H04N2005/4428 , H04N2005/443 , H04N2005/44556
摘要： A digital broadcast receiver controlled by a screen remote controller and a space remote controller and controlling method, the method including according to an embodiment displaying a screen remote controller, partitioning a portion of a whole screen of the broadcast receiver into at least two control regions, displaying a pointer to enable a first pointing signal outputted from the space remote controller to indicate one control region of the screen remote controller, receiving a second pointing signal from the space remote controller, and executing a function corresponding to the one control region indicated by the pointer.
摘要翻译：一种由屏幕遥控器和空间遥控器控制的数字广播接收机和控制方法，该方法包括根据实施例的显示屏幕遥控器，将广播接收机的整个屏幕的一部分划分成至少两个控制区域，显示指示器以使得从空间遥控器输出的第一指示信号指示屏幕遥控器的一个控制区域，从空间遥控器接收第二指示信号，并且执行与由该遥控器指示的一个控制区域相对应的功能指针。

3. 发明授权

US07867887B2 Structure and method for enhancing resistance to fracture of bonding pads 有权
$Structure and method for enhancing resistance to fracture of bonding pads$
标题翻译：提高接合焊盘断裂性的结构和方法
公开(公告)号：US07867887B2
公开(公告)日：2011-01-11
申请号：US12174074
申请日：2008-07-16
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L21/768
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
摘要翻译：本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

4. 发明授权

US06650010B2 Unique feature design enabling structural integrity for advanced low K semiconductor chips 有权
标题翻译：独特的功能设计使得先进的低K半导体芯片具有结构完整性
公开(公告)号：US06650010B2
公开(公告)日：2003-11-18
申请号：US10078174
申请日：2002-02-15
申请人： Charles R. Davis , David L. Hawken , Dae Young Jung , William F. Landers , David L. Questad
发明人： Charles R. Davis , David L. Hawken , Dae Young Jung , William F. Landers , David L. Questad
IPC分类号： H01L2312
CPC分类号： H01L22/32 , H01L23/5226 , H01L23/5329 , H01L24/05 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05554 , H01L2224/06131 , H01L2224/06155 , H01L2924/12044
摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.
摘要翻译：在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。

5. 发明授权

US07573115B2 Structure and method for enhancing resistance to fracture of bonding pads 有权
$Structure and method for enhancing resistance to fracture of bonding pads$
标题翻译：提高接合焊盘断裂性的结构和方法
公开(公告)号：US07573115B2
公开(公告)日：2009-08-11
申请号：US11559130
申请日：2006-11-13
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L23/52
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
摘要翻译：本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

6. 发明授权

US06815346B2 Unique feature design enabling structural integrity for advanced low k semiconductor chips 有权
标题翻译：独特的功能设计使先进的低k半导体芯片具有结构完整性
公开(公告)号：US06815346B2
公开(公告)日：2004-11-09
申请号：US10437208
申请日：2003-05-13
申请人： Charles R. Davis , David L. Hawken , Dae Young Jung , William F. Landers , David L. Questad
发明人： Charles R. Davis , David L. Hawken , Dae Young Jung , William F. Landers , David L. Questad
IPC分类号： H01L2144
CPC分类号： H01L22/32 , H01L23/5226 , H01L23/5329 , H01L24/05 , H01L2224/0401 , H01L2224/04042 , H01L2224/05096 , H01L2224/05554 , H01L2224/06131 , H01L2224/06155 , H01L2924/12044
摘要： A mesh-like reinforcing structure to inhibit delamination and cracking is fabricated in a multilayer semiconductor device using low-k dielectric materials and copper-based metallurgy. The mesh-like interconnection structure comprises conductive pads interconnected by conductive lines at each wiring level with each pad conductively connected to its adjacent pad at the next wiring level by a plurality of conductive vias. The conductive pads, lines and vias are fabricated during the normal BEOL wiring level integration process. The reinforcing structure provides both vertical and horizontal reinforcement and may be fabricated on the periphery of the active device region or within open regions of the device that are susceptible to delamination and cracking.
摘要翻译：在使用低k介电材料和铜基冶金的多层半导体器件中制造用于抑制分层和破裂的网状增强结构。网状互连结构包括在每个布线层处由导线互连的导电焊盘，每个焊盘通过多个导电通孔在下一个布线电平下与其相邻的焊盘导电连接。导电焊盘，线路和通孔在正常的BEOL布线级整合过程中制造。加强结构提供垂直和水平加强件，并且可以在活动装置区域的周边或在易于分层和破裂的装置的开放区域内制造。

7. 发明授权

US09237296B2 Image display apparatus and operating method thereof 有权
标题翻译：图像显示装置及其操作方法
公开(公告)号：US09237296B2
公开(公告)日：2016-01-12
申请号：US12630471
申请日：2009-12-03
申请人： Dae Young Jung , Hae Jin Bae , Jae Kyung Lee , Kun Sik Lee , Gyu Seung Kim
发明人： Dae Young Jung , Hae Jin Bae , Jae Kyung Lee , Kun Sik Lee , Gyu Seung Kim
IPC分类号： H04N7/173 , H04N5/445 , H04N1/00 , H04N21/462 , H04N21/482 , H04N21/426 , H04N21/431 , H04N21/4402 , H04N21/475 , H04N21/84 , H04N7/16
CPC分类号： H04N21/4316 , G06F3/0482 , H04N1/00448 , H04N1/00453 , H04N1/00461 , H04N5/44543 , H04N5/44582 , H04N5/44591 , H04N5/50 , H04N21/4263 , H04N21/4314 , H04N21/440263 , H04N21/4622 , H04N21/4755 , H04N21/482 , H04N21/84 , H04N2005/44556
摘要： A method for operating an image display apparatus includes providing input signals to the image display apparatus, displaying at least one image on a display based on the input signals, generating a plurality thumbnail images based on the input signals, and displaying a thumbnail-image list which includes a plurality of generated thumbnail images.
摘要翻译：一种用于操作图像显示装置的方法包括向图像显示装置提供输入信号，基于输入信号在显示器上显示至少一个图像，基于输入信号生成多个缩略图图像，并且显示缩略图列表其包括多个生成的缩略图图像。

8. 发明授权

US08494158B2 Method of downloading software in digital broadcast receiver 有权
标题翻译：在数字广播接收机中下载软件的方法
公开(公告)号：US08494158B2
公开(公告)日：2013-07-23
申请号：US11455096
申请日：2006-06-19
申请人： Dae Young Jung
发明人： Dae Young Jung
IPC分类号： H04N7/167
CPC分类号： H04N21/4586 , H04N21/4345 , H04N21/818
摘要： Provided is a method of downloading, by a digital broadcast receiver, a software for upgrade through broadcast signals. According to the method, existence of a receiver software to be downloaded is checked, and a reservation time for downloading of the software is set. After that, a download and upgrade of the software are performed at the set reservation time.
摘要翻译：提供了一种通过数字广播接收机下载用于通过广播信号进行升级的软件的方法。根据该方法，检查要下载的接收机软件的存在，并且设置软件的下载预约时间。之后，在设定的预约时间执行软件的下载和升级。

9. 发明申请

US20080029898A1 VIA STACK STRUCTURES 审中-公开
标题翻译：通过堆叠结构
公开(公告)号：US20080029898A1
公开(公告)日：2008-02-07
申请号：US11461511
申请日：2006-08-01
申请人： Mukta G. Farooq , Robert Hannon , Dae Young Jung , Ian D. Melville , Donna S. Zupanski-Nielsen
发明人： Mukta G. Farooq , Robert Hannon , Dae Young Jung , Ian D. Melville , Donna S. Zupanski-Nielsen
IPC分类号： H01L23/48
CPC分类号： H01L23/5226 , H01L2924/0002 , H01L2924/00
摘要： Via stack structures are disclosed. In one embodiment, a structure includes a via stack including: a first substantially cross-shaped line in a first dielectric layer; a second substantially cross-shaped line set in a second dielectric layer, and a via stud coupling the first substantially cross-shaped line to the second substantially cross-shaped line. In another embodiment, a structure includes a first via stack, and a second via stack, wherein the first via stack and the second via stack extend in a divergent manner from one another. Each via stack structure is useful for support, for example, in under wire bond applications. The via stack structures can be mixed with other via stack structures and selectively placed within a layout to replace conventional metal plate and via stud array configurations.
摘要翻译：公开了通过堆叠结构。在一个实施例中，结构包括通孔堆叠，其包括：第一介电层中的第一基本十字形的线; 设置在第二电介质层中的第二基本上十字形的线，以及将第一基本上十字形的线耦合到第二基本十字形线的通孔柱。在另一个实施例中，结构包括第一通孔堆叠和第二通孔堆叠，其中第一通孔堆叠和第二通孔堆叠以彼此发散的方式延伸。每个通孔堆叠结构可用于支持，例如在引线键合应用中。通孔堆叠结构可以与其它通孔堆叠结构混合并且选择性地放置在布局内以代替传统的金属板和经由螺柱阵列配置。

10. 发明授权

US07479447B2 Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses 失效
标题翻译：在相邻保险丝之间的低k电介质层中形成裂纹停止空隙的方法
公开(公告)号：US07479447B2
公开(公告)日：2009-01-20
申请号：US11277398
申请日：2006-03-24
申请人： Timothy H. Daubenspeck , Christopher D. Muzzy , Paul S. McLaughlin , Judith A. Wright , Jean E. Wynne , Dae Young Jung
发明人： Timothy H. Daubenspeck , Christopher D. Muzzy , Paul S. McLaughlin , Judith A. Wright , Jean E. Wynne , Dae Young Jung
IPC分类号： H01L21/44 , H01L29/00
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A crack stop void is formed in a low-k dielectric layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The crack stop void is formed simultaneously with the formation of an interconnect structure.
摘要翻译：在相邻熔丝结构之间的低k电介质层中形成裂纹阻挡空隙，用于在保险丝熔断操作期间防止相邻熔丝结构之间的裂纹传播。裂缝停止空隙与形成互连结构同时形成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式