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1. 发明授权

US08535808B2 Heat dissipation coating agent and heat-dissipating plate including same 有权
标题翻译：散热涂层剂和散热板包括它们
公开(公告)号：US08535808B2
公开(公告)日：2013-09-17
申请号：US13313191
申请日：2011-12-07
申请人： Hyo-yul Park , Myeong-sang Ahn , Dong-jun Kang , Dae-young Jung
发明人： Hyo-yul Park , Myeong-sang Ahn , Dong-jun Kang , Dae-young Jung
IPC分类号： B32B15/04 , B32B5/16
CPC分类号： H01L23/36 , C08K3/04 , C08K3/14 , C08K3/22 , C08K3/24 , C08K3/34 , C09D1/00 , C09D7/61 , H01L23/3737 , H01L2924/0002 , Y10T428/31511 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31529 , Y10T428/31663 , Y10T428/31667 , H01L2924/00
摘要： The present invention relates to a heat dissipation coating agent and to a heat-dissipating plate including same, which efficiently dissipate heat from the surface of a heat-dissipating plate of an electric/electronic component. Particularly, the heat dissipation coating agent, which is applied to the surface of a heat-dissipating plate of an electric/electronic component, includes infrared radiation powder and a binder, and the heat-dissipating plate is coated with a heat dissipation layer consisting of the heat dissipation coating agent. Since the heat dissipation coating agent applied to the heat-dissipating plate is highly conductive, heat is emitted from the heat-dissipating plate by conduction as well as convection. In particular, the heat dissipation coating agent, which conducts heat with high conductivity, can be applied to a heat-dissipating plate of a high-power LED light source.
摘要翻译：本发明涉及一种散热涂层剂和包括其的散热板，其有效地从电子/电子部件的散热板的表面散发热量。特别地，涂敷在电气电子部件的散热板表面的散热涂层剂包括红外线辐射粉末和粘合剂，并且散热板涂覆有散热层，该散热层由散热涂层剂。由于施加到散热板的散热涂层剂具有高导电性，因此通过传导和对流从散热板发出热量。特别是，能够将高导电性的导热性的散热涂层剂施加到大功率LED光源的散热板上。

2. 发明申请

US20100306800A1 IMAGE DISPLAY APPARATUS AND OPERATING METHOD THEREOF 有权
标题翻译：图像显示装置及其操作方法
公开(公告)号：US20100306800A1
公开(公告)日：2010-12-02
申请号：US12630471
申请日：2009-12-03
申请人： Dae Young JUNG , Hae Jin Bae , Jae Kyung Lee , Kun Sik Lee , Gyu Seung Kim
发明人： Dae Young JUNG , Hae Jin Bae , Jae Kyung Lee , Kun Sik Lee , Gyu Seung Kim
IPC分类号： H04N5/445
CPC分类号： H04N21/4316 , G06F3/0482 , H04N1/00448 , H04N1/00453 , H04N1/00461 , H04N5/44543 , H04N5/44582 , H04N5/44591 , H04N5/50 , H04N21/4263 , H04N21/4314 , H04N21/440263 , H04N21/4622 , H04N21/4755 , H04N21/482 , H04N21/84 , H04N2005/44556
摘要： A method for operating an image display apparatus includes providing input signals to the image display apparatus, displaying at least one image on a display based on the input signals, generating a plurality thumbnail images based on the input signals, and displaying a thumbnail-image list which includes a plurality of generated thumbnail images.
摘要翻译：一种用于操作图像显示装置的方法包括向图像显示装置提供输入信号，基于输入信号在显示器上显示至少一个图像，基于输入信号生成多个缩略图图像，并且显示缩略图列表其包括多个生成的缩略图图像。

3. 发明申请

US20090032974A1 METHOD AND STRUCTURE TO REDUCE CRACKING IN FLIP CHIP UNDERFILL 有权
标题翻译：减少裂片碎屑破碎的方法和结构
公开(公告)号：US20090032974A1
公开(公告)日：2009-02-05
申请号：US11831026
申请日：2007-07-31
申请人： Mukta G. Farooq , Robert Hannon , Dae-Young Jung , Ian D. Melville
发明人： Mukta G. Farooq , Robert Hannon , Dae-Young Jung , Ian D. Melville
IPC分类号： H01L21/00 , H01L23/528
CPC分类号： H01L21/563 , H01L24/32 , H01L2224/05568 , H01L2224/05573 , H01L2224/131 , H01L2224/16225 , H01L2224/26145 , H01L2224/29036 , H01L2224/321 , H01L2224/32225 , H01L2224/73204 , H01L2224/831 , H01L2224/83379 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/3512 , H01L2924/00 , H01L2924/00012 , H01L2924/014 , H01L2224/13099 , H01L2224/05599
摘要： A method of assembling a microelectronic flip-chip arrangement includes attaching a chip having a defined length to a supporting substrate, wherein the chip forms a chip shadow line of the defined length on the supporting substrate, creating a first non-wettable zone on an outer portion of the bottom surface of the chip, creating a second non-wettable zone on a portion of the supporting substrate outside the chip shadow line, underfilling the chip and forming a fillet, wherein the fillet does not extend beyond the chip shadow line, and hardening the underfill including the fillet.
摘要翻译：组装微电子倒装芯片布置的方法包括将具有限定长度的芯片附接到支撑衬底，其中芯片在支撑衬底上形成具有限定长度的芯片阴影线，在外部形成第一非可湿润区域在芯片阴影线外部的支撑基板的一部分上形成第二不可润湿区域，在芯片上填充并形成圆角，其中圆角不延伸超过芯片阴影线，以及硬化底部填充物，包括圆角。

4. 发明授权

US07479447B2 Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses 失效
标题翻译：在相邻保险丝之间的低k电介质层中形成裂纹停止空隙的方法
公开(公告)号：US07479447B2
公开(公告)日：2009-01-20
申请号：US11277398
申请日：2006-03-24
申请人： Timothy H. Daubenspeck , Christopher D. Muzzy , Paul S. McLaughlin , Judith A. Wright , Jean E. Wynne , Dae Young Jung
发明人： Timothy H. Daubenspeck , Christopher D. Muzzy , Paul S. McLaughlin , Judith A. Wright , Jean E. Wynne , Dae Young Jung
IPC分类号： H01L21/44 , H01L29/00
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A crack stop void is formed in a low-k dielectric layer between adjacent fuse structures for preventing propagation of cracks between the adjacent fuse structures during a fuse blow operation. The crack stop void is formed simultaneously with the formation of an interconnect structure.
摘要翻译：在相邻熔丝结构之间的低k电介质层中形成裂纹阻挡空隙，用于在保险丝熔断操作期间防止相邻熔丝结构之间的裂纹传播。裂缝停止空隙与形成互连结构同时形成。

5. 发明申请

US20080274608A1 STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDING PADS 有权
标题翻译：结构和方法提高结合力的破坏
公开(公告)号：US20080274608A1
公开(公告)日：2008-11-06
申请号：US12174074
申请日：2008-07-16
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L21/768
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
摘要翻译：本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

6. 发明申请

US20080111250A1 STRUCTURE AND METHOD FOR ENHANCING RESISTANCE TO FRACTURE OF BONDING PADS 有权
公开(公告)号：US20080111250A1
公开(公告)日：2008-05-15
申请号：US11559130
申请日：2006-11-13
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L23/52 , H01L21/768
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.

7. 发明申请

US20070279323A1 METHOD OF COMPENSATING FOR CHANNEL INTERFERENCE OF DISPLAY APPARATUS AND DEVICE FOR CONTROLLING DRIVING OF DATA SIGNAL 审中-公开
标题翻译：用于显示设备的通道干扰的补偿方法和用于控制数据信号驱动的设备
公开(公告)号：US20070279323A1
公开(公告)日：2007-12-06
申请号：US11697160
申请日：2007-04-05
申请人： Jin Park , Joon-Seok Lee , Dae Young Jung
发明人： Jin Park , Joon-Seok Lee , Dae Young Jung
IPC分类号： G09G3/20
CPC分类号： G09G3/3283 , G09G3/3216 , G09G2310/0248 , G09G2310/0251 , G09G2310/08 , G09G2320/0223 , G09G2360/16
摘要： A method of compensating for channel interference of a display apparatus and a device for controlling driving of a data signal are provided. The method of compensating for the channel interference of the display apparatus includes: receiving pixel data of a scan line selected from an external screen memory; summing up the received pixel data and detecting a compensation time for compensating for channel interference which occurs in the selected scan line by using the sum of the pixel data; and adjusting at least one of a discharge time and a peak boost time of a driving current that is output to each data line according to the detected compensation time. Accordingly, it is possible to solve problems such as an increase of the circuit size caused by the existing compensation for the channel interference by controlling the discharge period or peak boost period with respect to each scan line and compensating for the channel interference phenomenon.
摘要翻译：提供了补偿显示装置和控制数据信号驱动装置的信道干扰的方法。补偿显示装置的信道干扰的方法包括：接收从外部屏幕存储器中选择的扫描线的像素数据; 对所接收的像素数据求和，并通过使用像素数据的和来检测在所选择的扫描行中发生的信道干扰的补偿时间; 以及根据检测到的补偿时间来调整输出到每个数据线的驱动电流的放电时间和峰值升高时间中的至少一个。因此，可以通过控制相对于每个扫描线的放电周期或峰值升高周期并补偿信道干扰现象来解决由现有的信道干扰补偿引起的电路尺寸增加的问题。

8. 发明授权

US07221410B2 Television receiving module and display apparatus and television receiving system using the same 失效
标题翻译：电视接收模块及其使用的显示装置和电视接收系统
公开(公告)号：US07221410B2
公开(公告)日：2007-05-22
申请号：US10625682
申请日：2003-07-24
申请人： Nam Su Choi , Jong Jin Lee , Dae Young Jung , Jin Seog Kang
发明人： Nam Su Choi , Jong Jin Lee , Dae Young Jung , Jin Seog Kang
IPC分类号： H04N5/63
CPC分类号： H04N5/64 , H04N5/44 , H04N5/63 , H04N21/4183
摘要： A TV receiving module and a display apparatus and a TV receiving system using the same, wherein the TV receiving module is small in size and is detachably mounted outside or inside of the display apparatus. The TV receiving module is adapted to select and receive a TV signal of a desired broadcast from among TV signals inputted from a TV broadcast receiving antenna or cable, and provide the received TV signal. A detachable connector unit includes a first connector installed in the TV receiving module for receiving external power and an external control signal and providing the TV signal received by the TV receiving module externally, and a second connector detachably coupled with the first connector. The display apparatus is connected to the TV receiving module via the second connector of the detachable connector unit to provide the external power and external control signal to the TV receiving module, receive the TV signal from the TV receiving module and output video and audio signals of the received TV signal. The display apparatus may be an LCD monitor or a PDP TV receiver.
摘要翻译：一种电视接收模块和显示装置以及使用该TV接收系统的TV接收系统，其中TV接收模块的尺寸小，并且可拆卸地安装在显示装置的外部或内部。电视接收模块适于从从TV广播接收天线或电缆输入的TV信号中选择并接收所需广播的TV信号，并提供所接收的TV信号。可拆卸连接器单元包括安装在TV接收模块中的用于接收外部电力的第一连接器和外部控制信号，并且将外部由TV接收模块接收的TV信号提供，以及可拆卸地与第一连接器耦合的第二连接器。显示装置通过可拆卸连接器单元的第二连接器连接到TV接收模块，以将外部电源和外部控制信号提供给TV接收模块，从TV接收模块接收TV信号，并输出视频和音频信号收到的电视信号。显示装置可以是LCD监视器或PDP TV接收器。

9. 发明授权

US07573115B2 Structure and method for enhancing resistance to fracture of bonding pads 有权
$Structure and method for enhancing resistance to fracture of bonding pads$
标题翻译：提高接合焊盘断裂性的结构和方法
公开(公告)号：US07573115B2
公开(公告)日：2009-08-11
申请号：US11559130
申请日：2006-11-13
申请人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
发明人： Ian D. Melville , Mukta G. Farooq , Dae Young Jung
IPC分类号： H01L23/52
CPC分类号： H01L24/05 , H01L24/13 , H01L2224/02235 , H01L2224/02351 , H01L2224/0401 , H01L2224/05073 , H01L2224/05094 , H01L2224/05095 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/13006 , H01L2224/131 , H01L2224/16 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01057 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/14 , H01L2924/00014 , H01L2224/05599 , H01L2224/13099 , H01L2224/05099 , H01L2224/13599 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： The present invention provides bond pads structures between semiconductor integrated circuits and the chip package with enhanced resistance to fracture and improved reliability. Mismatch in the coefficient of temperature expansion (CTE) among the materials used in bond structures induces stress and shear on them that may result in fractures within the back end dielectric stacks and cause reliability problems of the packaging. By placing multiple metal pads which are connected to the bond pad through multiple metal via, the adhesion between the bond pads and the back end dielectric stacks is enhanced.
摘要翻译：本发明提供了半导体集成电路和芯片封装之间的接合焊盘结构，其具有增强的抗断裂性和改进的可靠性。在粘结结构中使用的材料之间的温度膨胀系数（CTE）的不匹配会对其造成应力和剪切，这可能导致后端介质堆叠中的断裂，并导致包装的可靠性问题。通过设置通过多个金属通孔连接到接合焊盘的多个金属焊盘，增强了接合焊盘和后端电介质叠层之间的粘附力。

10. 发明申请

US20070120232A1 LASER FUSE STRUCTURES FOR HIGH POWER APPLICATIONS 失效
标题翻译：高功率应用的激光保险丝结构
公开(公告)号：US20070120232A1
公开(公告)日：2007-05-31
申请号：US11164640
申请日：2005-11-30
申请人： Stephen Greco , Erik Hedberg , Dae-Young Jung , Paul McLaughlin , Christopher Muzzy , Norman Rohrer , Jean Wynne
发明人： Stephen Greco , Erik Hedberg , Dae-Young Jung , Paul McLaughlin , Christopher Muzzy , Norman Rohrer , Jean Wynne
IPC分类号： H01L23/62
CPC分类号： H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a laser fuse structure for high power applications. Specifically, the laser fuse structure of the present invention comprises first and second conductive supporting elements (12a, 12b), at least one conductive fusible link (14), first and second connection elements (20a, 20b), and first and second metal lines (22a, 22b). The conductive supporting elements (12a, 12b), the conductive fusible link (14), and the metal lines (22a, 22b) are located at a first metal level (3), while the connect elements (20a, 20b) are located at a second, different metal level (4) and are connected to the conductive supporting elements (12a, 12b) and the metal lines (22a, 22b) by conductive via stacks (18a, 18b, 23a, 23b) that extend between the first and second metal levels (3, 4).
摘要翻译：本发明涉及一种用于大功率应用的激光熔丝结构。具体地，本发明的激光熔丝结构包括第一和第二导电支撑元件（12a，12b），至少一个导电熔丝（14），第一和第二连接元件（20a，20b）和第一和第二金属线（22a，22b）。导电支撑元件（12a，12b），导电可熔连接件（14）和金属线（22A，22b）位于第一金属级（3）处，而连接元件（20a， 20b）位于第二不同的金属层（4）处，并且通过导电通孔叠层（18a，18b）连接到导电支撑元件（12a，12b）和金属线（22a，22b） b，23a，23b），其在第一和第二金属水平面（3,4）之间延伸。

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