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    • 1. 发明授权
    • Apparatus and method to inspect defect of semiconductor device
    • 检测半导体器件缺陷的装置和方法
    • US08034640B2
    • 2011-10-11
    • US12627222
    • 2009-11-30
    • Ji-Young ShinYoung-Nam KimJong-An KimHyung-Suk ChoYu-Sin Yang
    • Ji-Young ShinYoung-Nam KimJong-An KimHyung-Suk ChoYu-Sin Yang
    • G01R31/26H01L21/66
    • H01J37/241H01J37/265H01J37/28H01L22/12
    • An apparatus and method to inspect a defect of a semiconductor device. The amount of secondary electrons generated due to a scanning electron microscope (SEM) may depend on the topology of a pattern of a semiconductor substrate. The amount of secondary electrons emitted from a recess of an under layer is far smaller than that of secondary electrons emitted from a projection of a top layer. Since the recess is darker than the projection, a ratio of a value of a secondary electron signal of the under layer to a value of a secondary electron signal of the top layer may be increased in order to improve a pattern image used to inspect a defect in the under layer. To do this, a plurality of conditions under which electron beams (e-beams) are irradiated may be set, at least two may be selected out of the set conditions, and the pattern may be scanned under the selected conditions. Thus, secondary electron signals may be generated according to the respective conditions and converted into image data so that various pattern images may be displayed on a monitor. Scan information on the pattern images may be automatically stored in a computer storage along with positional information on a predetermined portion of the semiconductor substrate. When calculation conditions are input to a computer, each of scan information on the pattern images may be calculated to generate a new integrated pattern image.
    • 一种用于检查半导体器件的缺陷的装置和方法。 由扫描电子显微镜(SEM)产生的二次电子量可能取决于半导体衬底图案的拓扑结构。 从下层的凹部发射的二次电子的量远远小于从顶层的投影发射的二次电子的量。 由于凹部比投影更暗,所以可以增加下层的二次电子信号的值与顶层的二次电子信号的值的比例,以便改善用于检查缺陷的图案图像 在下层。 为此,可以设置照射电子束(电子束)的多个条件,可以从设定条件中选择至少两个,并且可以在所选择的条件下扫描图案。 因此,可以根据各自的条件生成二次电子信号,并将其转换为图像数据,从而可以在监视器上显示各种图案图像。 关于图案图像的扫描信息可以与位于半导体基板的预定部分上的位置信息一起自动存储在计算机存储器中。 当将计算条件输入到计算机时,可以计算每个关于图案图像的扫描信息,以生成新的集成图案图像。
    • 4. 发明申请
    • APPARATUS AND METHOD TO INSPECT DEFECT OF SEMICONDUCTOR DEVICE
    • 检测半导体器件缺陷的装置和方法
    • US20100136717A1
    • 2010-06-03
    • US12627222
    • 2009-11-30
    • Ji-Young SHINYoung-Nam KimJong-An KIMHyung-Suk CHOYu-Sin YANG
    • Ji-Young SHINYoung-Nam KimJong-An KIMHyung-Suk CHOYu-Sin YANG
    • H01L21/66G01N23/00G06F19/00
    • H01J37/241H01J37/265H01J37/28H01L22/12
    • An apparatus and method to inspect a defect of a semiconductor device. The amount of secondary electrons generated due to a scanning electron microscope (SEM) may depend on the topology of a pattern of a semiconductor substrate. The amount of secondary electrons emitted from a recess of an under layer is far smaller than that of secondary electrons emitted from a projection of a top layer. Since the recess is darker than the projection, a ratio of a value of a secondary electron signal of the under layer to a value of a secondary electron signal of the top layer may be increased in order to improve a pattern image used to inspect a defect in the under layer. To do this, a plurality of conditions under which electron beams (e-beams) are irradiated may be set, at least two may be selected out of the set conditions, and the pattern may be scanned under the selected conditions. Thus, secondary electron signals may be generated according to the respective conditions and converted into image data so that various pattern images may be displayed on a monitor. Scan information on the pattern images may be automatically stored in a computer storage along with positional information on a predetermined portion of the semiconductor substrate. When calculation conditions are input to a computer, each of scan information on the pattern images may be calculated to generate a new integrated pattern image.
    • 一种用于检查半导体器件的缺陷的装置和方法。 由扫描电子显微镜(SEM)产生的二次电子量可能取决于半导体衬底图案的拓扑结构。 从下层的凹部发射的二次电子的量远远小于从顶层的投影发射的二次电子的量。 由于凹部比投影更暗,所以可以增加下层的二次电子信号的值与顶层的二次电子信号的值的比例,以便改善用于检查缺陷的图案图像 在下层。 为此,可以设置照射电子束(电子束)的多个条件,可以从设定条件中选择至少两个,并且可以在所选择的条件下扫描图案。 因此,可以根据各自的条件生成二次电子信号,并将其转换为图像数据,从而可以在监视器上显示各种图案图像。 关于图案图像的扫描信息可以与位于半导体基板的预定部分上的位置信息一起自动存储在计算机存储器中。 当将计算条件输入到计算机时,可以计算每个关于图案图像的扫描信息,以生成新的集成图案图像。
    • 5. 发明授权
    • Apparatus and method for measuring semiconductor device
    • 半导体器件测量装置及方法
    • US08324571B2
    • 2012-12-04
    • US12713261
    • 2010-02-26
    • Young-Seok KimJong-Sun PeakYoung-Nam KimHyung-Suk ChoSun-Jin KangBu-Dl Yoo
    • Young-Seok KimJong-Sun PeakYoung-Nam KimHyung-Suk ChoSun-Jin KangBu-Dl Yoo
    • G01N23/20
    • H01L22/20H01L22/12
    • An apparatus for measuring a semiconductor device is provided. The apparatus includes a beam emitter configured to irradiate an electron beam onto a sample having the entire region composed of a critical dimension (CD) region, which is formed by etching or development, and a normal region connected to the CD region, and an analyzer electrically connected to the beam emitter, and configured to select and set a wavelength range of a region in which a difference in reflectance between the CD region and the normal region occurs, after obtaining reflectance from the electron beam reflected by a surface of the sample according to the wavelength of the electron beam. A method of measuring a semiconductor device using the measuring apparatus is also provided. Therefore, it is possible to minimize a change in reflectance due to the thickness and properties of the semiconductor device, and set a wavelength range to monitor a specific wavelength, thereby accurately measuring and analyzing a CD value of a measurement part of the semiconductor device.
    • 提供了一种用于测量半导体器件的设备。 该装置包括:射束发射器,被配置为将电子束照射到具有由蚀刻或显影形成的临界尺寸(CD)区域和连接到CD区域的法线区域构成的整个区域的样品上;以及分析器 电连接到射束发射器,并且被配置为在从由样品表面反射的电子束获得反射率之后,选择和设置发生CD区域和法线区域之间的反射率差的区域的波长范围, 到电子束的波长。 还提供了使用测量装置测量半导体器件的方法。 因此,可以使半导体器件的厚度和特性的反射率变化最小化,并且设定波长范围来监视特定波长,从而精确地测量和分析半导体器件的测量部分的CD值。
    • 8. 发明授权
    • Polishing pad of a chemical mechanical polishing apparatus and method of manufacturing the same
    • 化学机械抛光装置的抛光垫及其制造方法
    • US07815496B2
    • 2010-10-19
    • US11706241
    • 2007-02-15
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • Young-Sam LimYoung-Nam KimGi-Jung Kim
    • B24D11/00
    • B24B37/24B24D18/0063
    • The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.
    • 用于抛光物体的抛光垫的表面具有包括亲水材料的第一部分和包括疏水材料的第二部分。 抛光表面的第一部分位于抛光垫的第一区域中,并且抛光表面的第二部分位于抛光垫的与垫的径向方向上与第一区域并置的第二区域中。 亲水材料可以是在聚合物的键合位置处含有OH和/或= O的亲水性官能团的聚合物树脂。 疏水性材料可以是在聚合物的结合位置含有H和/或F的疏水官能团的聚合物树脂。 抛光垫通过挤出亲水和疏水材料的相应线来制造。 挤出机和背衬相对于彼此移动,使得线形成亲水和疏水材料的同心环。