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1. 发明授权

US07575611B2 Fuel processor for use in a fuel cell system 有权
标题翻译：用于燃料电池系统的燃料处理器
公开(公告)号：US07575611B2
公开(公告)日：2009-08-18
申请号：US11835747
申请日：2007-08-08
申请人： Jennifer Brantley , Kenneth Newell , David Sopchak , Ian W. Kaye , Jesse Thompson , Arpad Somogyvari
发明人： Jennifer Brantley , Kenneth Newell , David Sopchak , Ian W. Kaye , Jesse Thompson , Arpad Somogyvari
IPC分类号： B01J7/00
CPC分类号： H01M8/04022 , B01J8/0449 , B01J8/0484 , B01J8/0492 , B01J8/0496 , B01J8/06 , B01J8/065 , B01J8/067 , B01J19/0093 , B01J19/2495 , B01J2208/00309 , B01J2208/00504 , B01J2208/0053 , B01J2208/00672 , B01J2219/00788 , B01J2219/00835 , B01J2219/00846 , B01J2219/0086 , B01J2219/00869 , B01J2219/00873 , B01J2219/00891 , C01B3/323 , C01B2203/0233 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/0827 , C01B2203/1017 , C01B2203/1023 , C01B2203/1029 , C01B2203/1064 , C01B2203/1076 , C01B2203/1223 , C01B2203/1288 , C01B2203/1614 , H01M8/0631 , Y02P20/128 , Y02P70/56 , Y10T29/49345
摘要： In one embodiment, a fuel processor for use in a fuel cell system, may have a bottom plate, having a regenerator having a first inlet to receive an air flow, a burner flow chamber within the regenerator, the burner flow chamber having a second inlet to receive the air flow from the regenerator, and a reformer flow chamber positioned between the regenerator and the burner flow chamber, the reformer flow chamber having a third inlet to receive the air flow from the burner chamber, wherein the burner flow chamber and the reformer flow chamber is formed of a monolithic structure having an elongated, rounded baffle in the center of the monolithic structure. The fuel processor may also have a top plate coupled to the bottom plate to enclose the fuel processor, the top plate having a top surface and a bottom surface.
摘要翻译：在一个实施例中，用于燃料电池系统的燃料处理器可以具有底板，具有一个再生器，该再生器具有用于接收气流的第一入口，再生器内的燃烧器流动室，燃烧器流动室具有第二入口为了接收来自再生器的空气流，以及位于再生器和燃烧器流动室之间的重整器流动室，重整器流动室具有第三入口以接收来自燃烧器室的空气流，其中燃烧器流动室和重整器流动室由在整体结构的中心具有细长的圆形挡板的整体结构形成。燃料处理器还可以具有联接到底板以封闭燃料处理器的顶板，顶板具有顶表面和底表面。

2. 发明申请

US20080118796A1 FUEL PROCESSOR FOR USE IN A FUEL CELL SYSTEM 有权
标题翻译：用于燃料电池系统的燃料处理器
公开(公告)号：US20080118796A1
公开(公告)日：2008-05-22
申请号：US11835747
申请日：2007-08-08
申请人： Jennifer Brantley , Kenneth Newell , David Sopchak , Ian W. Kaye , Jesse Thompson , Arpad Somogyvari
发明人： Jennifer Brantley , Kenneth Newell , David Sopchak , Ian W. Kaye , Jesse Thompson , Arpad Somogyvari
IPC分类号： H01M8/18
CPC分类号： H01M8/04022 , B01J8/0449 , B01J8/0484 , B01J8/0492 , B01J8/0496 , B01J8/06 , B01J8/065 , B01J8/067 , B01J19/0093 , B01J19/2495 , B01J2208/00309 , B01J2208/00504 , B01J2208/0053 , B01J2208/00672 , B01J2219/00788 , B01J2219/00835 , B01J2219/00846 , B01J2219/0086 , B01J2219/00869 , B01J2219/00873 , B01J2219/00891 , C01B3/323 , C01B2203/0233 , C01B2203/066 , C01B2203/0811 , C01B2203/0822 , C01B2203/0827 , C01B2203/1017 , C01B2203/1023 , C01B2203/1029 , C01B2203/1064 , C01B2203/1076 , C01B2203/1223 , C01B2203/1288 , C01B2203/1614 , H01M8/0631 , Y02P20/128 , Y02P70/56 , Y10T29/49345
摘要： In one embodiment, a fuel processor for use in a fuel cell system, may have a bottom plate, having a regenerator having a first inlet to receive an air flow, a burner flow chamber within the regenerator, the burner flow chamber having a second inlet to receive the air flow from the regenerator, and a reformer flow chamber positioned between the regenerator and the burner flow chamber, the reformer flow chamber having a third inlet to receive the air flow from the burner chamber, wherein the burner flow chamber and the reformer flow chamber is formed of a monolithic structure having an elongated, rounded baffle in the center of the monolithic structure. The fuel processor may also have a top plate coupled to the bottom plate to enclose the fuel processor, the top plate having a top surface and a bottom surface.
摘要翻译：在一个实施例中，用于燃料电池系统的燃料处理器可以具有底板，具有一个再生器，该再生器具有用于接收气流的第一入口，再生器内的燃烧器流动室，燃烧器流动室具有第二入口为了接收来自再生器的空气流，以及位于再生器和燃烧器流动室之间的重整器流动室，重整器流动室具有第三入口以接收来自燃烧器室的空气流，其中燃烧器流动室和重整器流动室由在整体结构的中心具有细长的圆形挡板的整体结构形成。燃料处理器还可以具有联接到底板以封闭燃料处理器的顶板，顶板具有顶表面和底表面。

3. 发明申请

US20070210125A1 Backpack with retractable seat 审中-公开
标题翻译：带伸缩座椅的背包
公开(公告)号：US20070210125A1
公开(公告)日：2007-09-13
申请号：US11373359
申请日：2006-03-10
申请人： Martin Grabijas , Jesse Thompson
发明人： Martin Grabijas , Jesse Thompson
IPC分类号： A45F4/02 , A45F3/04
CPC分类号： A45F3/04 , A45F4/02
摘要： A backpack with a retractable seat is disclosed having a pouch with a sleeve secured thereto. A seat is selectively positionable within the sleeve and has extension straps secured to a lower portion thereof and retraction straps secured to an upper portion thereof. The lower portion of the seat is wider than the upper portion. The seat is deployed by gripping the extension straps and withdrawing the seat. The seat is then bent to conform to the lower back and hips of a user such that the lower portion is directly beneath the user. The seat is retracted by pulling on the retraction straps. In an alternative embodiment, the seat comprises multiple panels folded over one another when retracted into the sleeve.
摘要翻译：公开了一种具有伸缩座的背包，其具有固定于其上的套筒。座椅可选择性地定位在套筒内并且具有固定到其下部的延伸带和固定到其上部的收缩带。座椅的下部比上部宽。通过抓住延伸带并取出座椅来部署座椅。然后，座椅被弯曲以符合使用者的下背部和臀部，使得下部直接在使用者的下方。通过拉动收回带收回座椅。在替代实施例中，座椅包括当缩回到套筒中时彼此折叠的多个面板。

4. 发明申请

US20050150813A1 Foldover packages and manufacturing and test methods therefor 审中-公开
标题翻译：折叠包装及其制造和测试方法
公开(公告)号：US20050150813A1
公开(公告)日：2005-07-14
申请号：US10969527
申请日：2004-10-20
申请人： Jesse Thompson , Jennifer Alfonso , Glenn Urbish , Philip Osborn , Ellis Chau
发明人： Jesse Thompson , Jennifer Alfonso , Glenn Urbish , Philip Osborn , Ellis Chau
IPC分类号： B65D85/30 , H01L23/498 , H01L25/10
CPC分类号： H01L23/4985 , H01L25/105 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2924/0002 , H01L2924/00
摘要： A microelectronic fold package is formed from an in-process unit including an internal unit such as a chip and a tape defining a bottom run extending beneath the internal unit, a top run extending above the internal unit and a fold connecting said top and bottom runs. The in-process unit is engaged between a pair of elements having flat surfaces so that these elements form the top and bottom runs to a substantially flat condition at least in regions between the internal unit and the fold and so that the engagement elements form the fold to a height equal to the height of the internal unit.
摘要翻译：微电子折叠包装由包括诸如芯片的内部单元和限定在内部单元下方延伸的底部行程的带的内部单元形成，在内部单元上方延伸的顶部行程以及连接所述顶部和底部行程的折叠。在处理单元被接合在具有平坦表面的一对元件之间，使得这些元件至少在内部单元和折叠之间的区域中形成顶部和底部行程至基本上平坦的状态，并且使得接合元件形成折叠高度等于内部单元的高度。

5. 发明申请

US20120128548A1 POLYMER MICROFLUIDIC BIOCHIP FABRICATION 有权
标题翻译：聚合物微生物生物制品
公开(公告)号：US20120128548A1
公开(公告)日：2012-05-24
申请号：US12673192
申请日：2008-08-08
申请人： Jason A.A. West , Jesse Thompson
发明人： Jason A.A. West , Jesse Thompson
IPC分类号： G01N30/00 , B29C59/02 , B29C45/00 , B32B37/06 , B29C45/03 , B29C45/73 , B01L3/00 , B05D5/00
CPC分类号： B01L3/502707 , B01J19/0046 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00722 , B01L2200/0636 , B01L2200/0647 , B01L2200/0668 , B01L2200/0689 , B01L2300/0636 , B01L2300/0681 , B01L2300/0816 , B01L2300/0819 , B01L2300/0887 , B01L2300/12 , B29L2031/756 , G01N33/54386
摘要： Provided are microfluidic devices and methods for fabricating and bonding such devices. Also provided are kits for analyzing analyte-containing samples and for lysing cells.
摘要翻译：提供了用于制造和结合这种装置的微流体装置和方法。还提供了用于分析含分析物的样品和裂解细胞的试剂盒。

6. 发明申请

US20070077677A1 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US20070077677A1
公开(公告)日：2007-04-05
申请号：US11607372
申请日：2006-12-01
申请人： Belgacem Haba , Masud Beroz , Ronald Green , IIyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
发明人： Belgacem Haba , Masud Beroz , Ronald Green , IIyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
IPC分类号： H01L21/00
CPC分类号： H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.
摘要翻译：微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖着微电子元件的第一面的柔性基板，以及多个导电柱，其从柔性基板延伸并远离第一面微电子元件，至少一些导电柱与微电子元件电互连。所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。至少一些导电柱从支撑元件偏移。组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

7. 发明申请

US20070028339A1 Deltoid arm protection system for ballistic body armor 有权
标题翻译：防弹手臂防弹系统
公开(公告)号：US20070028339A1
公开(公告)日：2007-02-08
申请号：US11199860
申请日：2005-08-08
申请人： Richard Carlson , Jesse Thompson
发明人： Richard Carlson , Jesse Thompson
IPC分类号： F41H1/02
CPC分类号： F41H1/02
摘要： A deltoid arm protection system for a ballistic vest including an asymmetrical anatomically shaped deltoid cover having fasteners for attachment to a ballistic vest. The deltoid cover is connected to the vest and prevents any gaps forming between the deltoid cover and the vest during arm movement of the wearer. The deltoid cover includes a weapon gripping pad and attachment loops on an outer surface of the deltoid cover.
摘要翻译：用于防弹背心的三角臂保护系统，其包括具有用于附接到弹道背心的紧固件的不对称解剖形状的三角肌盖。三角形盖连接到背心，并防止在佩戴者的手臂运动期间形成三角肌盖和背心之间的任何间隙。三角形盖包括在三角形盖的外表面上的武器夹持垫和附接环。

8. 发明申请

US20070015310A1 Polyceramic-coated tool for applying a flowable composition 有权
标题翻译：用于涂布可流动组合物的聚碳酸酯涂层工具
公开(公告)号：US20070015310A1
公开(公告)日：2007-01-18
申请号：US11183490
申请日：2005-07-18
申请人： Jesse Thompson , Hilda Tadio , Salvador Tostado , Apolinar Alvarez
发明人： Jesse Thompson , Hilda Tadio , Salvador Tostado , Apolinar Alvarez
IPC分类号： H01L21/00
CPC分类号： H01L21/67126 , H01L21/316 , H05K3/1225
摘要： A tool is provided for applying a flowable composition onto a receiving surface. The tool includes a polyceramic coating on a surface thereof and may take the form of a stencil or mold. Also provided are an apparatus and a method that uses the tool. In use, the tool is placed such that its polyceramic-coated surface is in contact with the flowable composition, which, in turn, simultaneously contacts the receiving surface.
摘要翻译：提供了用于将可流动组合物施加到接收表面上的工具。该工具在其表面上包括一个聚酯陶瓷涂层，并且可以采用模版或模具的形式。还提供了使用该工具的装置和方法。在使用中，该工具被放置成使得其多陶瓷涂覆的表面与可流动的组合物接触，而可流动的组合物又反过来同时接触接收表面。

9. 发明申请

US20050189622A1 Packaged acoustic and electromagnetic transducer chips 审中-公开
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

10. 发明申请

US20050181544A1 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US20050181544A1
公开(公告)日：2005-08-18
申请号：US11014439
申请日：2004-12-16
申请人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
发明人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart Wilson , Wael Zohni , Yoichi Kubota , Jesse Thompson
IPC分类号： H01L21/44
CPC分类号： H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
摘要翻译：微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件微电子元件上的柔性衬底。导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

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