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    • 3. 发明授权
    • Compact camera module and the substrate thereof
    • 紧凑型相机模块及其基板
    • US07621683B2
    • 2009-11-24
    • US11556530
    • 2006-11-03
    • She-Hong ChengKuo-Hua Chen
    • She-Hong ChengKuo-Hua Chen
    • G03B17/00
    • G03B17/02H01L27/14618H01L27/14625H01L2224/48091H04N5/2254H04N5/2257H04N17/002Y10S438/975H01L2924/00014
    • A compact camera module (CCM) substantially includes a substrate, a sensor chip and a lens module. The substrate has a surface defining a chip-attached area for attaching the sensor chip and a module-secured area for mounting the lens module. A check point is defined in the chip attached area. The module-secured area surrounds the chip-attached area. The substrate includes a plurality of connecting pads and a plurality of check bars disposed outside the chip-attached area, wherein the perpendicular bisectors of the check bars intersect with each other at a point aligning with the check point. Accordingly, a self-check step can be performed to check the center of the sensor area of the sensor chip in accordance with the intersection point after a chip is attached.
    • 小型相机模块(CCM)基本上包括基板,传感器芯片和透镜模块。 衬底具有限定用于附接传感器芯片的芯片连接区域和用于安装透镜模块的模块固定区域的表面。 检查点在芯片连接区域中定义。 模块固定区域围绕芯片附着区域。 基板包括多个连接焊盘和设置在芯片附着区域外部的多个检查条,其中检查条的垂直平分线在与检查点对准的点处彼此相交。 因此,可以执行自检步骤,以便在安装芯片之后根据交点检查传感器芯片的传感器区域的中心。
    • 4. 发明申请
    • Circuit board and circuit structure
    • 电路板和电路结构
    • US20080041614A1
    • 2008-02-21
    • US11889096
    • 2007-08-09
    • Kuo-Hua ChenHung-Hsiang Lu
    • Kuo-Hua ChenHung-Hsiang Lu
    • H05K1/02
    • H05K1/0269H01L2924/0002H05K3/0052H05K3/303H05K3/3452H05K2201/09781H05K2201/0989H01L2924/00
    • A circuit board for carrying a chip is provided. The circuit board includes a substrate, a wiring layer and a solder mask. The wiring layer including a cutting line pattern defining a cutting region is disposed on the substrate. The solder mask including a chip region, a first opening and a second opening is disposed on the substrate and the wiring layer. The chip region is disposed inside the cutting region. The chip is suitable to be disposed in the chip region, wherein the chip overlaps the chip region. The first opening and the second opening are respectively disposed outside two adjacent lateral sides of the chip region for exposing a part of the cutting line pattern. The exposed part of the cutting line pattern is used for measuring the position of the chip relative to the substrate.
    • 提供用于承载芯片的电路板。 电路板包括基板,布线层和焊接掩模。 包括限定切割区域的切割线图案的布线层设置在基板上。 包括芯片区域,第一开口和第二开口的焊接掩模设置在基板和布线层上。 芯片区域设置在切割区域内。 该芯片适于放置在芯片区域中,其中芯片与芯片区域重叠。 第一开口和第二开口分别设置在芯片区域的两个相邻侧面的外侧,用于暴露切割线图案的一部分。 切割线图案的露出部分用于测量芯片相对于基板的位置。
    • 8. 发明授权
    • Winding mechanism for a window blind
    • 窗帘的绕线机构
    • US07540315B2
    • 2009-06-02
    • US11590414
    • 2006-10-31
    • Kuo-Hua Chen
    • Kuo-Hua Chen
    • E06B9/30
    • E06B9/322E06B2009/3225
    • A winding mechanism for a window blind includes a base having two slideways, a rotation member rotatably mounted on the base and having an outer wall formed with a threaded guide portion, and a guide seat having an inner wall formed with a threaded guide hole screwed onto the threaded guide portion of the rotation member and an outer wall formed with two guide posts each provided with a roller slidably mounted in a respective slideway of the base. Thus, when the lift cord is wound around the rotation member, the guide seat is movable successively on the rotation member by guidance of the roller, so that the lift cord is wound around the rotation member serially and smoothly by guidance of the guide seat, thereby preventing the lift cord from being tangled.
    • 用于窗帘的卷绕机构包括具有两个滑道的基座,旋转构件可旋转地安装在基座上并具有形成有螺纹导向部分的外壁,以及引导座,其具有形成有螺纹导向孔的内壁, 旋转构件的螺纹引导部分和形成有两个导向柱的外壁,每个导向柱设置有可滑动地安装在基座的相应滑道中的辊。 因此,当提升绳缠绕在旋转构件上时,引导座可以通过引导辊在旋转构件上依次移动,使得提升绳在引导座的引导下顺序地和顺畅地缠绕在旋转构件上, 从而防止电梯线缠结。