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1. 发明申请

US20070241466A1 Chip package 有权
标题翻译：芯片封装
公开(公告)号：US20070241466A1
公开(公告)日：2007-10-18
申请号：US11642892
申请日：2006-12-21
申请人： Chien-Chen Chou , Hung-Hsiang Lu , Chi-Feng Hung
发明人： Chien-Chen Chou , Hung-Hsiang Lu , Chi-Feng Hung
IPC分类号： H01L23/544
CPC分类号： H01L23/544 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/54413 , H01L2223/54473 , H01L2224/05554 , H01L2224/48227 , H01L2224/49171 , H01L2224/85 , H01L2924/00014 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.
摘要翻译：提供了包括基板，芯片和标记的芯片封装。基板具有承载表面。标记区域设置在承载表面上。芯片设置在承载表面上并与基板电连接。标记设置在标记区域中，用于记录处理参数。

2. 发明授权

US07626278B2 Chip package 有权
标题翻译：芯片封装
公开(公告)号：US07626278B2
公开(公告)日：2009-12-01
申请号：US11642892
申请日：2006-12-21
申请人： Chien-Chen Chou , Hung-Hsiang Lu , Chi-Feng Hung
发明人： Chien-Chen Chou , Hung-Hsiang Lu , Chi-Feng Hung
IPC分类号： H01L23/544
CPC分类号： H01L23/544 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L24/85 , H01L2223/54413 , H01L2223/54473 , H01L2224/05554 , H01L2224/48227 , H01L2224/49171 , H01L2224/85 , H01L2924/00014 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A chip package including a substrate, a chip and a mark is provided. The substrate has a carrying surface. A mark region is disposed on the carrying surface. The chip is disposed on the carrying surface and electrically connected to the substrate. The mark is disposed in the mark region for recording a process parameter.
摘要翻译：提供了包括基板，芯片和标记的芯片封装。基板具有承载表面。标记区域设置在承载表面上。芯片设置在承载表面上并与基板电连接。标记设置在标记区域中，用于记录处理参数。

3. 发明申请

US20080041614A1 Circuit board and circuit structure 审中-公开
标题翻译：电路板和电路结构
公开(公告)号：US20080041614A1
公开(公告)日：2008-02-21
申请号：US11889096
申请日：2007-08-09
申请人： Kuo-Hua Chen , Hung-Hsiang Lu
发明人： Kuo-Hua Chen , Hung-Hsiang Lu
IPC分类号： H05K1/02
CPC分类号： H05K1/0269 , H01L2924/0002 , H05K3/0052 , H05K3/303 , H05K3/3452 , H05K2201/09781 , H05K2201/0989 , H01L2924/00
摘要： A circuit board for carrying a chip is provided. The circuit board includes a substrate, a wiring layer and a solder mask. The wiring layer including a cutting line pattern defining a cutting region is disposed on the substrate. The solder mask including a chip region, a first opening and a second opening is disposed on the substrate and the wiring layer. The chip region is disposed inside the cutting region. The chip is suitable to be disposed in the chip region, wherein the chip overlaps the chip region. The first opening and the second opening are respectively disposed outside two adjacent lateral sides of the chip region for exposing a part of the cutting line pattern. The exposed part of the cutting line pattern is used for measuring the position of the chip relative to the substrate.
摘要翻译：提供用于承载芯片的电路板。电路板包括基板，布线层和焊接掩模。包括限定切割区域的切割线图案的布线层设置在基板上。包括芯片区域，第一开口和第二开口的焊接掩模设置在基板和布线层上。芯片区域设置在切割区域内。该芯片适于放置在芯片区域中，其中芯片与芯片区域重叠。第一开口和第二开口分别设置在芯片区域的两个相邻侧面的外侧，用于暴露切割线图案的一部分。切割线图案的露出部分用于测量芯片相对于基板的位置。

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