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    • 8. 发明授权
    • Vertical junction field effect transistor with mesa termination and method of making the same
    • 垂直结场效应晶体管与台面端接及制作方法相同
    • US08269262B2
    • 2012-09-18
    • US11836994
    • 2007-08-10
    • Igor SankinJoseph Neil Merrett
    • Igor SankinJoseph Neil Merrett
    • H01L29/66
    • H01L29/868H01L29/1608H01L29/872
    • A vertical junction field effect transistor (VJFET) having a mesa termination and a method of making the device are described. The device includes: an n-type mesa on an n-type substrate; a plurality of raised n-type regions on the mesa comprising an upper n-type layer on a lower n-type layer; p-type regions between and adjacent the raised n-type regions and along a lower sidewall portion of the raised regions; dielectric material on the sidewalls of the raised regions, on the p-type regions and on the sidewalls of the mesa; and electrical contacts to the substrate (drain), p-type regions (gate) and the upper n-type layer (source). The device can be made in a wide-bandgap semiconductor material such as SiC. The method includes selectively etching through an n-type layer using a mask to form the raised regions and implanting p-type dopants into exposed surfaces of an underlying n-type layer using the mask.
    • 描述具有台面终止的垂直结型场效应晶体管(VJFET)和制造该器件的方法。 该装置包括:n型衬底上的n型台面; 在台面上的多个凸起的n型区域,包括在下n型层上的上n型层; 在凸起的n型区域之间和相邻的凸起区域的下侧壁部分之间的p型区域; 介电材料在凸起区域的侧壁上,在p型区域和台面的侧壁上; 和与基板(漏极),p型区域(gate)和上部n型层(源极)的电接触。 该器件可以制成诸如SiC的宽带隙半导体材料。 该方法包括使用掩模选择性地蚀刻n型层以形成凸起区域,并使用掩模将p型掺杂剂注入到下面的n型层的暴露表面中。
    • 10. 发明申请
    • Self-aligned silicon carbide semiconductor devices and methods of making the same
    • 自对准碳化硅半导体器件及其制造方法
    • US20050199882A1
    • 2005-09-15
    • US11076857
    • 2005-03-11
    • Igor SankinJanna CasadyJoseph Merrett
    • Igor SankinJanna CasadyJoseph Merrett
    • H01L29/15H01L31/0312
    • H01L29/66068H01L29/1608H01L29/2003H01L29/42316H01L29/45H01L29/66863H01L29/8128
    • A self-aligned silicon carbide power MESFET with improved current stability and a method of making the device are described. The device, which includes raised source and drain regions separated by a gate recess, has improved current stability as a result of reduced surface trapping effects even at low gate biases. The device can be made using a self-aligned process in which a substrate comprising an n+-doped SiC layer on an n-doped SiC channel layer is etched to define raised source and drain regions (e.g., raised fingers) using a metal etch mask. The metal etch mask is then annealed to form source and drain ohmic contacts. A single- or multilayer dielectric film is then grown or deposited and anisotropically etched. A Schottky contact layer and a final metal layer are subsequently deposited using evaporation or another anisotropic deposition technique followed by an optional isotropic etch of dielectric layer or layers.
    • 描述了具有改善的电流稳定性的自对准碳化硅功率MESFET和制造该器件的方法。 包括由栅极凹槽分开的升高的源极和漏极区域的器件由于即使在低栅极偏置处减小的表面俘获效应也具有改善的电流稳定性。 可以使用自对准工艺来制造器件,其中蚀刻在n掺杂的SiC沟道层上包括n + +掺杂的SiC层的衬底以限定凸起的源极和漏极区域(例如, 使用金属蚀刻掩模。 然后将金属蚀刻掩模退火以形成源极和漏极欧姆接触。 然后生长或沉积单层或多层介电膜并进行各向异性蚀刻。 随后使用蒸发或其他各向异性沉积技术沉积肖特基接触层和最后的金属层,然后对电介质层或层进行任意的各向同性蚀刻。