会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • METHOD AND STRUCTURE FOR MULTI-CORE CHIP PRODUCT TEST AND SELECTIVE VOLTAGE BINNING DISPOSITION
    • 多核芯片产品测试和选择性电压调整处理方法与结构
    • US20140024145A1
    • 2014-01-23
    • US13553986
    • 2012-07-20
    • JEANNE P. BICKFORDVikram IyengarRahul K. NadkarniPascal A. Nsame
    • JEANNE P. BICKFORDVikram IyengarRahul K. NadkarniPascal A. Nsame
    • H01L21/66G01R31/02G06F19/00
    • G01R31/31718G01R31/31725G06F1/32
    • Operating speeds of integrated circuit devices are tested to establish maximum and minimum frequency at maximum and minimum voltage. The devices are sorted into relatively-slow and relatively-fast devices to classify the devices into different voltage bins. A bin-specific voltage limit is established for each of the voltage bins needed for core performance at system use conditions. The bin-specific voltage limit is compared to core minimum chip-level functionality voltage at system maximum and minimum frequency specifications. The method correlates system design evaluation of design maximum and minimum frequency at design maximum and minimum voltage conditions with evaluation of tested maximum and minimum frequency at tested maximum and minimum voltage conditions. A chip-specific functionality voltage limit is established for the device. Initial system voltage for all devices from a voltage bin is set at a greater of the bin-specific voltage limit and the chip-specific functionality voltage limit consistent with the evaluation conditions.
    • 测试集成电路器件的工作速度,以在最大和最小电压下建立最大和最小频率。 将器件分类为相对较慢且相对较快的器件,以将器件分类到不同的电压仓。 对于在系统使用条件下核心性能所需的每个电压箱,建立了一个特定于特定电压限制。 特定于箱体的电压限制与系统最大和最小频率规格下的核心最小芯片级功能电压进行比较。 该方法在设计最大和最小电压条件下将设计最大和最小频率的系统设计评估与测试的最大和最小电压条件下的最大和最小频率进行了评估。 为器件建立芯片专用功能电压限制。 来自电压仓的所有器件的初始系统电压设置在特定于器件的电压限制和芯片专用功能电压限制的更大值与评估条件一致。
    • 2. 发明授权
    • Method and structure for multi-core chip product test and selective voltage binning disposition
    • 多核芯片产品测试和选择性电压组合配置的方法和结构
    • US09557378B2
    • 2017-01-31
    • US13553986
    • 2012-07-20
    • Jeanne P. BickfordVikram IyengarRahul K. NadkarniPascal A. Nsame
    • Jeanne P. BickfordVikram IyengarRahul K. NadkarniPascal A. Nsame
    • H01L21/66G01R31/02G06F19/00G01R31/317G06F1/32
    • G01R31/31718G01R31/31725G06F1/32
    • Operating speeds of integrated circuit devices are tested to establish maximum and minimum frequency at maximum and minimum voltage. The devices are sorted into relatively-slow and relatively-fast devices to classify the devices into different voltage bins. A bin-specific voltage limit is established for each of the voltage bins needed for core performance at system use conditions. The bin-specific voltage limit is compared to core minimum chip-level functionality voltage at system maximum and minimum frequency specifications. The method correlates system design evaluation of design maximum and minimum frequency at design maximum and minimum voltage conditions with evaluation of tested maximum and minimum frequency at tested maximum and minimum voltage conditions. A chip-specific functionality voltage limit is established for the device. Initial system voltage for all devices from a voltage bin is set at a greater of the bin-specific voltage limit and the chip-specific functionality voltage limit consistent with the evaluation conditions.
    • 测试集成电路器件的工作速度,以在最大和最小电压下建立最大和最小频率。 将器件分类为相对较慢且相对较快的器件,以将器件分类到不同的电压仓。 对于在系统使用条件下核心性能所需的每个电压箱,建立了一个特定于特定电压限制。 特定于箱体的电压限制与系统最大和最小频率规格下的核心最小芯片级功能电压进行比较。 该方法在设计最大和最小电压条件下将设计最大和最小频率的系统设计评估与测试的最大和最小电压条件下的最大和最小频率进行了评估。 为器件建立芯片专用功能电压限制。 来自电压仓的所有器件的初始系统电压设置在特定于器件的电压限制和芯片专用功能电压限制的更大值与评估条件一致。
    • 9. 发明授权
    • System yield optimization using the results of integrated circuit chip performance path testing
    • 系统产量优化采用集成电路芯片性能路径测试的结果
    • US08539429B1
    • 2013-09-17
    • US13572954
    • 2012-08-13
    • Jeanne P. BickfordPeter A. HabitzVikram Iyengar
    • Jeanne P. BickfordPeter A. HabitzVikram Iyengar
    • G06F17/50
    • G01R31/31718G01R31/31725
    • Disclosed are embodiments of a method, system and computer program for optimizing system yield based on the results of post-manufacture integrated circuit (IC) chip performance path testing. In these embodiments, a correlation is made between IC chip performance measurements, which were acquired from IC chips specifically during post-manufacture (i.e., wafer-level or module-level) performance path testing, and system performance measurements, which were acquired from systems that incorporate those IC chips previously subjected to performance path testing. Based on this correlation and a target system performance value, a post-manufacture (i.e., wafer-level or module-level) chip dispositioning rule can be adjusted to optimize system yield (i.e., to ensure that subsequently manufactured systems which incorporate the IC chip meet the target system performance value). Optionally, simulation of such processing can be performed during design of the IC chip for incorporation into the system in order establish the initial chip dispositioning rule in the first place.
    • 公开了一种基于后制造集成电路(IC)芯片性能路径测试的结果来优化系统产量的方法,系统和计算机程序的实施例。 在这些实施例中,在IC芯片特性在后期制造(即晶片级或模块级)性能路径测试中获得的IC芯片性能测量和从系统获取的系统性能测量之间进行相关 其中包含先前经过性能路径测试的那些IC芯片。 基于这种相关性和目标系统性能值,可以调整后制造(即晶片级或模块级)芯片布置规则以优化系统产量(即,确保随后制造的并入IC芯片的系统 满足目标系统的性能价值)。 可选地,可以在用于结合到系统中的IC芯片的设计期间执行这种处理的模拟,以便首先建立初始的芯片布置规则。