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1. 发明授权

US5262351A Process for manufacturing a multilayer integrated circuit interconnection 失效
标题翻译：制造多层集成电路互连的方法
公开(公告)号：US5262351A
公开(公告)日：1993-11-16
申请号：US734671
申请日：1991-07-23
申请人： Jean-Marc Bureau , Francois Bernard , Dominique Broussoux , Claude Vergnolle
发明人： Jean-Marc Bureau , Francois Bernard , Dominique Broussoux , Claude Vergnolle
IPC分类号： H01L21/68 , H01L23/538 , H01L25/065 , H01L21/28 , H01L21/56 , H01L21/58 , H01L21/60
CPC分类号： H01L21/6835 , H01L23/5383 , H01L25/0652 , H01L2221/68359 , H01L2224/16225 , H01L2924/01014 , H01L2924/09701 , H01L2924/1627 , H01L2924/3025 , Y10S438/98
摘要： The invention is a method of producing a multilayer polymer-metal system to interconnect integrated circuits which allows two-dimensional electrical and/or optical connections between components, in which a first layer of polymer is deposited on a rigid substrate such that the layer can be separated from the substrate, in which a multilayer interconnection system is then produced on this first layer using industrial methods and in which the rigid substrate is removed after installation and connection of the integrated circuit.
摘要翻译：本发明是一种生产多层聚合物金属系统以互连集成电路的方法，其允许组件之间的二维电和/或光学连接，其中第一层聚合物沉积在刚性基底上，使得该层可以与衬底分离，其中使用工业方法在该第一层上制造多层互连系统，并且其中在安装和连接集成电路之后去除刚性衬底。

2. 发明授权

US5235463A Method for the making of microlenses for optical applications 失效
标题翻译：用于制造光学应用微晶的方法
公开(公告)号：US5235463A
公开(公告)日：1993-08-10
申请号：US800423
申请日：1991-12-02
申请人： Dominique Broussoux , Jean-Marc Bureau , Daniel Dolfi , Sylvain Lazare
发明人： Dominique Broussoux , Jean-Marc Bureau , Daniel Dolfi , Sylvain Lazare
IPC分类号： C03C17/32 , B29D11/00 , G02B1/04 , G02B3/00
CPC分类号： G02B3/0056 , B29D11/00365 , G02B3/0012 , G02B3/0068 , Y10S359/90
摘要： Disclosed is a method for the making of microlenses for optical applications (display for example) resulting from the deposition of a liquid on a substrate, the surface of which has been locally modified so as to increase the wetting capacity of the liquid thereon. The substrate may be a polymer and the wetting liquid may be an organic fluid capable of hardening by an adapted treatment.
摘要翻译：公开了一种用于制造用于光学应用的微透镜的方法（例如显示），其由液体沉积在基底上，其表面已被局部改性，以增加其上的液体的润湿能力。基底可以是聚合物，并且润湿液体可以是能够通过适应的处理而硬化的有机流体。

3. 发明授权

US5418365A Thermal detector comprising a thermal insulator made of expanded polymer 失效
标题翻译：热探测器包括由膨胀聚合物制成的绝热体
公开(公告)号：US5418365A
公开(公告)日：1995-05-23
申请号：US193741
申请日：1994-02-09
申请人： Philippe Robin , Jean-Marc Bureau , Francois Bernard , Hugues Facoetti
发明人： Philippe Robin , Jean-Marc Bureau , Francois Bernard , Hugues Facoetti
IPC分类号： G01J1/02 , G01J5/02 , G01J5/34 , H01L37/02
CPC分类号： H01L37/02
摘要： A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.
摘要翻译：具有整体结构的热检测器包括对红外辐射敏感的材料层和由可沉积为薄层并具有微孔结构的耐热聚合物构成的绝缘层。该绝缘层使得敏感层与包括检测器所提供的读取电路的基板的热去耦合。因此，通过显着降低敏感层的热损失，可以显着改善目前使用的单片红外探测器的性能特征。这通过电介质聚合物层的大大降低的热导率来实现。应用于红外成像设备。

4. 发明授权

US06556105B1 Surface wave device connected to a base with a conductive adhesive 失效
标题翻译：表面波器件用导电粘合剂连接到基底
公开(公告)号：US06556105B1
公开(公告)日：2003-04-29
申请号：US09890280
申请日：2001-08-10
申请人： Ngoc-Tuan Nguyen , Jean-Marc Bureau , Christian LeLong
发明人： Ngoc-Tuan Nguyen , Jean-Marc Bureau , Christian LeLong
IPC分类号： H03H964
CPC分类号： H03H9/0585 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01079 , H01L2924/07811 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： The invention relates to a surface wave device linked to a base by a conductive material which is anisotropic in a direction perpendicular to the plane of the surface wave device and of the base. This anisotropic conductive material provides for the mechanical efficacy and the encapsulation of the surface wave device. It is deposited locally in the plane of the base, in such a way as to provide for the presence of a cavity in which the surface acoustic waves can propagate.
摘要翻译：本发明涉及一种通过导电材料连接到基底的表面波器件，该导电材料在垂直于表面波器件和基底的平面的方向上是各向异性的。这种各向异性导电材料提供了表面波器件的机械效能和封装。它以局部沉积在基底的平面中，以便提供表面声波可以传播的空腔的存在。

5. 发明授权

US5908304A Mass memory and method for the manufacture of mass memories 失效
标题翻译：用于制造大容量存储器的大容量存储器和方法
公开(公告)号：US5908304A
公开(公告)日：1999-06-01
申请号：US805850
申请日：1997-03-03
申请人： Myriam Oudart , Fran.cedilla.ois Bernard , Jean-Marc Bureau
发明人： Myriam Oudart , Fran.cedilla.ois Bernard , Jean-Marc Bureau
IPC分类号： G11C11/41 , G11C5/00 , G11C5/02 , H01L21/98 , H01L23/538 , H01L25/065 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L25/50 , H01L25/0652 , H01L25/0655 , H01L2224/48091 , H01L2224/48227
摘要： The disclosure relates to a mass memory with very large-scale integration as well as to a method for the manufacture of such a memory.
摘要翻译：本公开涉及具有非常大规模集成的大容量存储器以及用于制造这种存储器的方法。

6. 发明授权

US06492194B1 Method for the packaging of electronic components 失效
标题翻译：电子元器件封装方法
公开(公告)号：US06492194B1
公开(公告)日：2002-12-10
申请号：US09688358
申请日：2000-10-12
申请人： Jean-Marc Bureau , Jacques Elziere , Daniel Le Bail , Christian Lelong , Ngoc-Tuan Nguyen
发明人： Jean-Marc Bureau , Jacques Elziere , Daniel Le Bail , Christian Lelong , Ngoc-Tuan Nguyen
IPC分类号： H01L2156
CPC分类号： H01L21/561 , H01L21/56 , H01L23/3135 , H01L23/3164 , H01L23/552 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/73253 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/0102 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01058 , H01L2924/01079 , H01L2924/15151 , H01L2924/181 , H01L2924/3025 , H03H3/08 , H01L2224/81 , H01L2224/05599 , H01L2924/00012
摘要： A method for the packaging of electronic components, including the mounting of at least one electronic component on its active face side to a base, the base including electrical contacts on an external face and connection pads on a face opposite the external face, and including a first series of via holes connecting the electrical contacts and the connection pads and a second series of holes for use in aspiration. A deformable film is deposited on the face opposite to the active face of the electronic component or components. The deformable film is aspirated through the second series of holes from the face opposite the external face of the base, so as to sheath the electronic component or components. The method may furthermore include, on top of the deformable film, a mineral deposition to provide for the hermetic sealing of the components and a conductive deposition to provide for the shielding. Such an application may find particular application to surface wave filters.
摘要翻译：一种用于包装电子部件的方法，包括将至少一个电子部件在其主动面侧安装到基部，所述基部包括外表面上的电触点和与外表面相对的表面上的连接焊盘，并且包括连接电触头和连接垫的第一系列通孔和用于抽吸的第二系列孔。在与电子部件的主动面相对的面上沉积可变形膜。可变形膜通过第二系列孔从与基座的外表面相对的面吸出，以便包覆电子部件。该方法还可以包括在可变形膜的顶部上的矿物沉积物以提供组件的气密密封和导电沉积以提供屏蔽。这种应用可能会发现特定应用于表面波滤波器。

7. 发明授权

US06341408B2 Method of manufacturing a multiple-element acoustic probe comprising a common ground electrode 失效
标题翻译：制造包括公共接地电极的多元声学探针的方法
公开(公告)号：US06341408B2
公开(公告)日：2002-01-29
申请号：US09117045
申请日：1998-07-27
申请人： Jean-Marc Bureau , Jean-François Gelly
发明人： Jean-Marc Bureau , Jean-François Gelly
IPC分类号： H01L4100
CPC分类号： B06B1/0622 , Y10T29/42 , Y10T29/49005
摘要： A method of manufacturing a multiple-element acoustic probe including piezoelectric transducers and an array of interconnections connecting the transducers to an electronic signal processing and control device. The probe also includes a continuous ground electrode integrated between the transducers and the acoustic matching elements, facing the piezoelectric transducers, the acoustic matching elements being totally uncoupled from one another mechanically. This probe may be used in medical imaging or underwater imaging.
摘要翻译：一种制造包括压电换能器的多元声学探针和将换能器连接到电子信号处理和控制装置的互连阵列的方法。探头还包括集成在换能器和声匹配元件之间的连续接地电极，面向压电换能器，声匹配元件完全与机械相互耦合。该探针可用于医学成像或水下成像。

8. 发明授权

US6044533A Method of making an acoustic probe 失效
标题翻译：制作声学探针的方法
公开(公告)号：US6044533A
公开(公告)日：2000-04-04
申请号：US849734
申请日：1997-07-02
申请人： Jean-Marc Bureau , Fran.cedilla.ois Bernard , Serge Calisti
发明人： Jean-Marc Bureau , Fran.cedilla.ois Bernard , Serge Calisti
IPC分类号： G01N29/24 , A61B8/00 , B06B1/06 , H01L41/09 , H01L41/22
CPC分类号： B06B1/0629 , Y10T29/42 , Y10T29/49158
摘要： An acoustic probe and a method for making the same. The probe includes a novel interconnection network consisting of two portions, i.e., a first portion in which M.times.N conductive paths have a section contacting M.times.N piezoelectric transducers and are arranged at a pitch (P.sub.N) in a direction (D.sub.x) and at a pitch (P.sub.M) in direction (D.sub.y) within the acoustic absorption material; and a second portion in which the M.times.N conductive paths are arranged on M dielectric substrates spaced apart at a pitch (P'.sub.M) and each provided with N paths are arranged at a pitch (P'.sub.N). A method for making the acoustic probe is also disclosed. The dielectric substrates may advantageously be flexible printed circuits optionally including chips.
摘要翻译： PCT No.PCT / FR96 / 01650 Sec。 371日期1997年7月2日 102（e）1997年7月2日PCT PCT 1996年10月22日PCT公布。公开号WO97 / 17145 日期1997年5月15日声探头及其制作方法。该探头包括由两部分组成的新颖的互连网络，即其中MxN导电路径具有接触MxN压电换能器的部分的第一部分，并且以方向（Dx）和间距（PM）以间距（PN）布置）在吸声材料内的方向（Dy）; 以及以间距（P'M）间隔开的M个电介质基板上布置MxN导电路径，并且分别设置有N个路径的间隔（P'N）的第二部分。还公开了一种用于制造声探针的方法。电介质基底可以有利地是柔性印刷电路，任选地包括芯片。

9. 发明授权

US5618737A Thermal detector comprising a thermal insulator made of expanded polymer 失效
标题翻译：热探测器包括由膨胀聚合物制成的绝热体
公开(公告)号：US5618737A
公开(公告)日：1997-04-08
申请号：US389143
申请日：1995-02-15
申请人： Philippe Robin , Jean-Marc Bureau , Fran.cedilla.ois Bernard , Hugues Facoetti
发明人： Philippe Robin , Jean-Marc Bureau , Fran.cedilla.ois Bernard , Hugues Facoetti
IPC分类号： G01J1/02 , G01J5/02 , G01J5/34 , H01L37/02 , H01L31/18
CPC分类号： H01L37/02
摘要： A thermal detector with a monolithic structure comprises a layer of material sensitive to infrared radiation and an insulating layer constituted by a thermostable polymer that can be deposited as a thin layer and has a microporous structure. This insulating layer enables the thermal decoupling of the sensitive layer from the substrate comprising reading circuits with which the detector is provided. The performance characteristics of currently used monolithic infrared detectors can thus be substantially improved through the notable reduction of the thermal losses in the sensitive layer. This is achieved through the greatly reduced thermal conductivity of the layer of dielectric polymer. Application to infrared imaging devices.
摘要翻译：具有整体结构的热检测器包括对红外辐射敏感的材料层和由可沉积为薄层并具有微孔结构的耐热聚合物构成的绝缘层。该绝缘层使得敏感层与包括检测器所提供的读取电路的基板的热去耦合。因此，通过显着降低敏感层中的热损失，可以显着改善目前使用的单片红外探测器的性能特征。这通过电介质聚合物层的大大降低的热导率来实现。应用于红外成像设备。

10. 发明授权

US4768130A Capacitor of the polymer film type with stability at high temperatures 失效
标题翻译：高分子膜型电容器在高温下具有稳定性
公开(公告)号：US4768130A
公开(公告)日：1988-08-30
申请号：US106255
申请日：1987-10-09
申请人： Gilles Bernard , Jean-Marc Bureau , Jean-Claude Dubois , Jean-Luc Zattara
发明人： Gilles Bernard , Jean-Marc Bureau , Jean-Claude Dubois , Jean-Luc Zattara
IPC分类号： H01G4/18 , H01G3/175
CPC分类号： H01G4/18
摘要： The invention pertains to a capacitor of a thermostable polymer film type. The polymer used is polyphenylquinoxaline or polyhydantoin. The polymer film may be obtained by casting with organic solutions. The capacitor can also be obtained with supporting films covered with metallizations coated with this thermostable polymer.
摘要翻译：本发明涉及一种耐热聚合物膜型电容器。所使用的聚合物是聚苯基喹喔啉或多乙内酰脲。聚合物膜可以通过用有机溶液浇铸获得。电容器也可以用覆盖有涂有该耐热聚合物的金属化物的支撑膜获得。

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